Specification |
Metal Coating: Copper;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Number of Layers: Custom;
Copper Thickness: 1 Oz;
Product Name: PCB Assembly;
Surface Finishing: HASL;
Transport: EMS,DHL,UPS,FedEx,TNT;
Certificate: RoHS/ISO9001/Ts16949/ISO14001/ISO13485;
Board Thickness: Custom, 1.6mm;
Testing Service: Ict,Fct,X-ray,Aoi;
Packaging Details: ESD Package with Cartons.;
Test: 100% Aoi / X-ray / Visual Test;
Min. Line Width: 0.075(3mil);
Supplier Type: OEM;
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Metal Coating: Copper;
Mode of Production: SMT;
Layers: Double-Layer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
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Metal Coating: Plastic;
Mode of Production: SMT;
Layers: Single-Layer;
Base Material: FR-4;
Customized: Non-Customized;
Condition: New;
Battery Type: LiFePO4, Limno4, AGM, Gell, Flooded Battery;
Battery Capacity: Unlimited;
Battery Method: Energy Transfer/Dynamic;
Power Consumption: Lower Than 50MW;
Balance Current: 6A;
Work Efficiency: Over 94%;
OEM: Yes;
Size: 85mm X 45mm X 25mm;
Weight: 100g;
BMS Limited: Can Work with BMS or Can Work Independently;
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Metal Coating: Plastic;
Mode of Production: SMT;
Layers: Single-Layer;
Base Material: FR-4;
Customized: Non-Customized;
Condition: New;
Battery Type: LiFePO4, Limno4, AGM, Gell, Flooded Battery;
Battery Capacity: Unlimited;
Battery Method: Energy Transfer/Dynamic;
Power Consumption: Lower Than 50MW;
Balance Current: 3A;
Work Efficiency: Over 94%;
OEM: Yes;
Weight: 550g;
BMS Limited: Can Work with BMS or Can Work Independently;
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Metal Coating: Copper/Tin/Gold/Silver;
Mode of Production: SMT+DIP;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: Used/New;
Service: PCB/Componentssourcing/Assembly/Test/Package;
Layer: 1-20 Layers;
PCB Material: Fr4/High Tg Fr4/Aluminum/Rogers /Cem-3/Cem-1/ etc.;
Surface Finished: HASL/Lead Free/OSP/Immersion Gold etc.;
Certificate: ISO/UL/RoHS/CQC/IATF;
Board Thickness: 0.3mm~3.5mm;
Solder Mask: Green/Black/White/Red/Blue/Yellow/Purple.etc;
Test: X-ray, Aoi, in-Circuit Test (Ict), Functional Test;
PCBA QA: X-ray, Aoi Test, in-Circuit Test (Ict);
Profiling Punching: Routing, V-Cut, Beveling;
Copper Thickness: 18um-3500um(0.5- 100oz);
Finished Outer Copper Thickness: H/H0z-5/50z;
Finished Inner Copper Thickness: H/H0z-4/40z;
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