Specification |
shape: DIP;
Conductive Type: Unipolar Integrated Circuit;
Integration: GSI;
Technics: Semiconductor IC;
Layer: 1-32 Layers;
Service: OEM/ODM;
OEM/ODM: Available;
Test: 100%E-Testing;
Layer Count: 1-20 Layers;
Shipping: DHL/UPS/FedEx/Air/Sea;
Surface Treatmen: OSP, Enig, HASL, AG Immersion;
Certificate Gurantee: Yes;
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shape: Flat;
Conductive Type: Normal;
Integration: Normal;
Technics: Semiconductor IC;
Gold Tin Composition: Ausn8020;
Cladding Material: Nickel 3-8um, Gold Above 1.3um;
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shape: DIP;
Conductive Type: Unipolar Integrated Circuit;
Integration: ULSI;
Technics: Thick Film IC;
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shape: Flat;
Conductive Type: Bipolar Integrated Circuit;
Integration: SSI;
Technics: Semiconductor IC;
Date Code: 2023+;
Lead Time: Stock Inventory;
Minimal Package: 360PCS;
Package: Lqfp144;
Pb Free: Yes;
I/O Voltage: 1.62 V to 3.6 V;
Product Series: Arm Microcontrollers - MCU;
Minimum Operating Temperature: - 40 C;
Maximum Operating Temperature: + 85 C;
Interface Type: Can, I2c, Sai, Sdio, Spi, Usart, USB;
Device Core: Arm Cortex-M7;
Arm Cortex-M7: 144pins;
IC Case / Package: Lqfp;
IC Mounting: IC Mounting:;
MCU Series: Stm32h7;
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Conductive Type: Bipolar Integrated Circuit;
Integration: SSI;
Technics: Semiconductor IC;
Date Code: 2023+;
Lead Time: Stock Inventory;
Minimal Package: 360PCS;
Package: Multiwatt-11;
Pb Free: Yes;
I/O Voltage: 1.62 V to 3.6 V;
Product Series: Arm Microcontrollers - MCU;
Minimum Operating Temperature: - 20c;
Maximum Operating Temperature: + 85 C;
Interface Type: Can, I2c, Sai, Sdio, Spi, Usart, USB;
Device Core: Arm Cortex-M7;
Arm Cortex-M7: 144pins;
IC Case / Package: Lqfp;
IC Mounting: IC Mounting:;
MCU Series: Stm32h7;
shape: Flat;
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