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US$0.03-10.00 / Piece

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Design Assembly Home OEM Fr4 DC Power Supply 2.1A Mobile USB Charger PCB PCBA pictures & photos

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What is Design Assembly Home OEM Fr4 DC Power Supply 2.1A Mobile USB Charger PCB PCBA

Name: Design Assembly Home OEM Fr4 DC Power Supply 2.1A Mobile USB Charger PCB PCBA
Uploaded: 2023-02-10T16:21:27+08:00
Description: Company Service Specifications Details Material Type FR-4, CEM-1, CEM-3, Aluminium Clad,Arlon*,Teflon,Taconic, Rogers*, Polyimide*, Kapton,Dupont Material Thickness ( in inches) 0.062", 0.08

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Price

Purchase Qty. Reference FOB Price

1-99 Pieces US$10.00

100-999 Pieces US$0.80

1,000-9,999 Pieces US$0.60

10,000+ Pieces US$0.03

Sepcifications

Type Rigid Circuit Board
Dielectric FR-4
Material Fiberglass Epoxy Resin + Polyimide Resin
Application Consumer Electronics
Flame Retardant Properties V2
Mechanical Rigid Rigid
Processing Technology Electrolytic Foil
Base Material Copper
Insulation Materials Epoxy Resin
Brand New Chip
Transport Package Foam Packing
Specification FR4 1-4 Layers
Trademark New Chip
Origin China
Capacity 1000000
OEM/ODM Available
Sample Available
Surface Treatment OSP, Enig, HASL, AG Immersion
Certificate Gurantee Yes
Test 100%E-Testing
Min Bonding Pad Diameter 10mil
Min Thickness of Soldermask 10um
Color of Silk-Screen White, Yellow, Black
Data File Format Gerber File and Drilling File
Material for PCB Fr-4, High Tg Fr$, Halogen Free
Layer Count 1-20 Layers
Shipping DHL/UPS/FedEx/Air/Sea

Product Description

Company Service Specifications Details Material Type FR-4, CEM-1, CEM-3, Aluminium Clad,Arlon*,Teflon,Taconic, Rogers*, Polyimide*, Kapton,Dupont Material Thickness ( in inches) 0.062", 0.080", 0.093", 0.125", 0.220", 0.047", 0.031", 0.020", 0.005" Layer count 1 to 28 Layers Max. ...

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Shenzhen New Chip international Ltd

Diamond Member Since 2022

Audited Supplier

Business Type Manufacturer/Factory & Trading Company
Main Products PCB, PCBA, Component Chip
Number of Employees 10
Year of Establishment 2022-05-11
Management System Certification ISO 9001, IATF16949
Average Lead Time Peak Season Lead Time: one month
Off Season Lead Time: within 15 workdays

PCBA Manufacturing Comparison

	Quick View Design Assembly Home OEM Fr4 DC Power Supply 2.1A Mobile USB Charger PCB PCBA Contact Now	Quick View Assembly PCBA for Consumer Electronic Device Manufacturer Communication Type Contact Now	Quick View FPC, Flexible Printed Circuit Board PCB Contact Now	Quick View HDI PCB Board Precision Circuit Board Contact Now	Quick View FPC, Flexible PCB Circuit Board Contact Now

Transaction Info
	Quick View Design Assembly Home OEM Fr4 DC Power Supply 2.1A Mobile USB Charger PCB PCBA Contact Now	Quick View Assembly PCBA for Consumer Electronic Device Manufacturer Communication Type Contact Now	Quick View FPC, Flexible Printed Circuit Board PCB Contact Now	Quick View HDI PCB Board Precision Circuit Board Contact Now	Quick View FPC, Flexible PCB Circuit Board Contact Now
Price	US $ 0.03-10.00/ Piece	US $ 0.39-2.19/ Piece	US $ 0.99/ Piece	US $ 0.99/ Piece	US $ 0.99/ Piece
Min Order	1 Pieces	1 Pieces	1 Pieces	1 Pieces	1 Pieces
Trade Terms	-	-	-	-	-
Payment Terms	T/T, D/P, Western Union, Paypal	T/T, Western Union, Paypal, Money Gram	L/C, T/T, Paypal	L/C, T/T, Paypal	L/C, T/T, Paypal
Quality Control
Management System Certification	ISO 9001, IATF16949	ISO 9001, ISO 14001, IATF16949	ISO 9001, ISO 9000, ISO 14001, ISO 14000, ISO 20000, IATF16949	ISO 9001, ISO 9000, ISO 14001, ISO 14000, ISO 20000, IATF16949	ISO 9001, ISO 9000, ISO 14001, ISO 14000, ISO 20000, IATF16949
Trade Capacity
Export Markets	North America, South America, Europe, Southeast Asia/ Mideast, Africa, East Asia(Japan/ South Korea), Australia	North America, South America, Eastern Europe, Southeast Asia, Africa, Mid East, Eastern Asia, Western Europe	-	-	-
Annual Export Revenue	-	-	-	-	-
Business Model	OEM, ODM	OEM, ODM	OEM, ODM	OEM, ODM	OEM, ODM
Average Lead Time	-	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)	-	-	-
Product Attributes
Specification	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy Resin + Polyimide Resin; Application: Consumer Electronics; Flame Retardant Properties: V2; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Copper; Insulation Materials: Epoxy Resin; Brand: New Chip; Capacity: 1000000; OEM/ODM: Available; Sample: Available; Surface Treatment: OSP, Enig, HASL, AG Immersion; Certificate Gurantee: Yes; Test: 100%E-Testing; Min Bonding Pad Diameter: 10mil; Min Thickness of Soldermask: 10um; Color of Silk-Screen: White, Yellow, Black; Data File Format: Gerber File and Drilling File; Material for PCB: Fr-4, High Tg Fr$, Halogen Free; Layer Count: 1-20 Layers; Shipping: DHL/UPS/FedEx/Air/Sea;	Type: Rigid Circuit Board, Rigid Circuit Board; Dielectric: FR-4, Fr-4; Material: Fiberglass Epoxy Resin + Polyimide Resin, Fiberglass Epoxy; Application: Medical Instruments, Consumer Electronics; Flame Retardant Properties: V2, V1; Mechanical Rigid: Rigid, Rigid; Processing Technology: Electrolytic Foil, Electrolytic Foil; Base Material: Copper, Copper; Insulation Materials: Epoxy Resin, Epoxy Resin; Brand: Szx, Szx; Model: PCB; Layers: Multilayer; Solder Marsk: Green, Black, Blue, Red, Yellow, White; Hole: Mechanical Hole, Laser Hole; Assembly: Components; Processing: SMT and DIP; Surface Treatment: HASL, Immersion Gold, OSP; Service Providing: PCB Production, PCB Assembly, Components Sourcing;	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Complex; Application: Consumer Electronics; Flame Retardant Properties: HB; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Copper; Insulation Materials: Organic Resin; Brand: Tecircuit;	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Complex; Application: Consumer Electronics; Flame Retardant Properties: HB; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Copper; Insulation Materials: Organic Resin; Brand: Tecircuit;	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Complex; Application: Consumer Electronics; Flame Retardant Properties: HB; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Copper; Insulation Materials: Organic Resin; Brand: Tecircuit;
Supplier Name	Shenzhen New Chip international Ltd	Shenzexin Electronic (Hongkong) Co., Ltd.	Shenzhen Tecircuit Electronic Limited	Shenzhen Tecircuit Electronic Limited	Shenzhen Tecircuit Electronic Limited
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