| Specification |
Metal Coating: Copper;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Board Thickness: 0.21--7mm;
Min. Hole Size: 0.10mm;
Min. Line Width: 3mil;
Min. Line Spacing: 3mil;
Surface Finishing: HASL;
Soldermask: Green,Yellow,Black,White,Red;
Silkscreen: White,Yellow,Black;
Special Technological Requirement: Blind & Buried Vias and High Thickness Copper;
Needed: Gerber File,Bom List,Sample If Better;
Board Copy Service: Yes;
PCB Factory: Yes;
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Metal Coating: Tin;
Mode of Production: SMT+DIP;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Certificate: ISO9001, ISO14001, IATF 16949, Ipc-a-610g, RoHS;
PCB Material: Fr-4, Cem-1, Cem-3, Hight Tg, Fr4 Halogen Free;
PCB Shape: Rectangular, Round, Slots, Cutouts, Complex;
Solder Mask: Green/Black/White/Red/Blue/Yellow/Purple.etc;
Board Thickness: 0.2mm-8mm;
Copper Thickness: 18um-3500um(0.5- 100oz);
Service: PCB/Componentssourcing/Assembly/Test/Package;
PCBA QA: Full Test Include Aoi, in-Circuit Test (Ict);
Layer: 1-36 Layers;
Max. PCB Size: 1900mm*600mm;
Profiling Punching: Routing, V-Cut, Beveling;
Surface Finishing: HASL/HASL Lead Free, Chemical Tin, Chemical Gold;
PCB Type: Rigid PCB, HDI PCB, Flexible PCB, Rigid-Flexib;
Test: X-ray, Aoi, in-Circuit Test (Ict), Functional Test;
PCBA Packaging: ESD Packaging, Shockproof Packaging, Anti-Drop;
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Metal Coating: Tin;
Mode of Production: SMT+DIP;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Certificate: ISO9001, ISO14001, IATF 16949, Ipc-a-610g, RoHS;
PCB Material: Fr-4, Cem-1, Cem-3, Hight Tg, Fr4 Halogen Free;
PCB Shape: Rectangular, Round, Slots, Cutouts, Complex;
Solder Mask: Green/Black/White/Red/Blue/Yellow/Purple.etc;
Board Thickness: 0.2mm-8mm;
Copper Thickness: 18um-3500um(0.5- 100oz);
Service: PCB/Componentssourcing/Assembly/Test/Package;
PCBA QA: Full Test Include Aoi, in-Circuit Test (Ict);
Layer: 1-36 Layers;
Max. PCB Size: 1900mm*600mm;
Profiling Punching: Routing, V-Cut, Beveling;
Surface Finishing: HASL/HASL Lead Free, Chemical Tin, Chemical Gold;
PCB Type: Rigid PCB, HDI PCB, Flexible PCB, Rigid-Flexible;
Test: X-ray, Aoi, in-Circuit Test (Ict), Functional Test;
PCBA Packaging: ESD Packaging, Shockproof Packaging, Anti-Drop;
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Metal Coating: Copper;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: Used;
OEM/Odml: OEM/ODM;
PCB Board Type: Hard Plate;
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Metal Coating: Copper;
Mode of Production: SMT;
Layers: Double-Layer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Unos R3 Development Board: Mega 2560 R3;
PRO Mini Atmega328p: 1;
Package: SMD;
Quality: 100% Test Past;
Service: One Stop Bom Service;
IC: Integrated Circuit;
Trade Item: EXW;
Shipping: Customers Requirement;
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