High Quality Hydrocarbon Polymer Ceramic Copper Clad Laminates (WL-CT300)

About this Item
Details
Company Profile

Price

Min. Order Reference FOB Price

1 pcs Negotiable

Sepcifications

  • Type Polymer Ceramic Copper
  • Dielectric Polymer Ceramic Copper
  • Material Copper
  • Application Communication
  • Flame Retardant Properties HB
  • Mechanical Rigid Fexible
  • Processing Technology Electrolytic Foil
  • Base Material Copper
  • Insulation Materials Organic Resin
  • Brand Wl
  • Transport Package Standard Export Package
  • Trademark WL
  • Origin China
  • Pimd Less Than -158dbc
  • Sample Available
  • Dielectric Thickness 1.034mm
  • Density(G/ Cm3) 1.57
  • Dielectric Constant 3.0±0.05
  • Type of Copper Foil RTF Copper Foil

Product Description

High quality Hydrocarbon Polymer Ceramic Copper Clad Laminates (WL-CT300) Model: WL-CT300 Introduction: WL-CT300 is laminated by hydrocarbon polymer and cermaic with a woven fiberglass reinforcement through scientific formulation and strict technology procedures. It is a kind of thermoset ...

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Hydrocarbon Polymer Copper Comparison
Transaction Info
Price Negotiable US $ 0.10-1.00/ Piece US $ 0.10-1.00/ Piece US $ 0.10-1.00/ Piece US $ 0.10-1.00/ Piece
Min Order 1 pcs 1 Pieces 1 Pieces 1 Pieces 1 Pieces
Trade Terms - - - - -
Payment Terms L/C, T/T, D/P, Western Union, Paypal L/C, T/T, Western Union L/C, T/T, Western Union L/C, T/T, Western Union L/C, T/T, Western Union
Quality Control
Management System Certification ISO 9001, ISO 9000, ISO 13485 ISO 9001 ISO 9001 ISO 9001 ISO 9001
Trade Capacity
Export Markets North America, South America, Europe, Southeast Asia/ Mideast, Africa, East Asia(Japan/ South Korea), Australia, Domestic South America, Eastern Europe, Southeast Asia, Mid East, Eastern Asia, Western Europe South America, Eastern Europe, Southeast Asia, Mid East, Eastern Asia, Western Europe South America, Eastern Europe, Southeast Asia, Mid East, Eastern Asia, Western Europe South America, Eastern Europe, Southeast Asia, Mid East, Eastern Asia, Western Europe
Annual Export Revenue - - - - -
Business Model OEM, ODM, Own Brand OEM, ODM OEM, ODM OEM, ODM OEM, ODM
Average Lead Time Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Product Attributes
Specification
Type: Polymer Ceramic Copper;
Dielectric: Polymer Ceramic Copper;
Material: Copper;
Application: Communication;
Flame Retardant Properties: HB;
Mechanical Rigid: Fexible;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: Wl;
Pimd: Less Than -158dbc;
Sample: Available;
Dielectric Thickness: 1.034mm;
Density(G/ Cm3): 1.57;
Dielectric Constant: 3.0±0.05;
Type of Copper Foil: RTF Copper Foil;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Immersion Gold;
Base Material: Fr4;
Insulation Materials: Epoxy Resin;
Copper Thickness: 3oz -105oz;
Surface Finish: Gold Finger;
Special Teck: Metal Edging;
Special 1: Blind Hole;
Special 2: Buried Vias;
Special 3: Flex-Rigid PCB;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Immersion Gold;
Base Material: Fr4;
Insulation Materials: Epoxy Resin;
Copper Thickness: 3oz -105oz;
Surface Finish: Gold Finger;
Special Teck: Metal Edging;
Special 1: Blind Hole;
Special 2: Buried Vias;
Special 3: Flex-Rigid PCB;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Immersion Gold;
Base Material: Fr4;
Insulation Materials: Epoxy Resin;
Copper Thickness: 3oz -105oz;
Surface Finish: Gold Finger;
Special Teck: Metal Edging;
Special 1: Blind Hole;
Special 2: Buried Vias;
Special 3: Flex-Rigid PCB;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Immersion Gold;
Base Material: Fr4;
Insulation Materials: Epoxy Resin;
Copper Thickness: 3oz -105oz;
Surface Finish: Gold Finger;
Special Teck: Metal Edging;
Special 1: Blind Hole;
Special 2: Buried Vias;
Special 3: Flex-Rigid PCB;
Supplier Name

New Vision Meditec Co., Limited

China Supplier - Gold Member Audited Supplier

Shenzhen Hemeixin Electronic Co., Limited

China Supplier - Diamond Member Audited Supplier

Shenzhen Hemeixin Electronic Co., Limited

China Supplier - Diamond Member Audited Supplier

Shenzhen Hemeixin Electronic Co., Limited

China Supplier - Diamond Member Audited Supplier

Shenzhen Hemeixin Electronic Co., Limited

China Supplier - Diamond Member Audited Supplier