Experienced Industrial PCBA Contract Manufacturing

About this Item
Details
Company Profile

Price

Min. Order Reference FOB Price

1 Piece US$1.00-20.00 / Piece

Sepcifications

  • Metal Coating Tin
  • Mode of Production SMT&DIP
  • Layers Multilayer
  • Base Material FR-4
  • Certification RoHS, ISO, ISO13485 & IATF16949 & ISO9001
  • Customized Customized
  • Condition Used
  • Transport Package DHL&UPS
  • Specification 25*21*2 cm
  • Trademark Grandtop
  • Origin Guangdong China
  • BGA Minimum Dia 01005
  • PCBA Min. IC Pitch 0.30mm(12mil)
  • PCB Layer Max 64 Layers
  • PCBA Foot Pin So, Sop, Soj, Tsop, Tssop, Qfp, BGA and U-BGA
  • Function Testing Spi , Aoi , Ict, Fct , X-ray ,RoHS and Aging
  • IP Protection Strong Believe in IP Protection with Proven Record
  • Turkey Service Turkey Sourcing ,Procurement and Material Manageme

Product Description

Grandtop Group was established in 2005, specializing in high quality PCBA OEM &ODM,we have more than 10 years' experience in PCBA contract manufacturing, professionally providing SMT, DIP, MI, AI, PCB assembling, conformal coating, final product assembling, testing, material procurement . Our ...

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Experienced Industrial PCBA Comparison
Transaction Info
Price US $ 1.00-20.00/ Piece US $ 2/ Piece US $ 2/ Piece US $ 2/ Piece US $ 2/ Piece
Min Order 1 Pieces 1 Pieces 1 Pieces 1 Pieces 1 Pieces
Trade Terms - - - - -
Payment Terms T/T L/C, T/T, Western Union L/C, T/T, Western Union L/C, T/T, Western Union L/C, T/T, Western Union
Quality Control
Product Certification RoHS, ISO, ISO13485 & IATF16949 & ISO9001 RoHS, ISO RoHS, ISO RoHS, ISO RoHS, ISO
Management System Certification ISO 9001, ISO 9000, ISO 14001, IATF16949, ISO 13485, ISO 17025 ISO 9001 ISO 9001 ISO 9001 ISO 9001
Trade Capacity
Export Markets North America, South America, Eastern Europe, Southeast Asia, Africa, Mid East, Eastern Asia, Western Europe South America, Eastern Europe, Southeast Asia, Mid East, Eastern Asia, Western Europe South America, Eastern Europe, Southeast Asia, Mid East, Eastern Asia, Western Europe South America, Eastern Europe, Southeast Asia, Mid East, Eastern Asia, Western Europe South America, Eastern Europe, Southeast Asia, Mid East, Eastern Asia, Western Europe
Annual Export Revenue - - - - -
Business Model OEM, ODM OEM OEM OEM OEM
Average Lead Time Off-season: 1 Month(s)
Peak-season: 1 Month(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Product Attributes
Specification
Metal Coating: Tin;
Mode of Production: SMT&DIP;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: Used;
BGA Minimum Dia: 01005;
PCBA Min. IC Pitch: 0.30mm(12mil);
PCB Layer: Max 64 Layers;
PCBA Foot Pin: So, Sop, Soj, Tsop, Tssop, Qfp, BGA and U-BGA;
Function Testing: Spi , Aoi , Ict, Fct , X-ray ,RoHS and Aging;
IP Protection: Strong Believe in IP Protection with Proven Record;
Turkey Service: Turkey Sourcing ,Procurement and Material Manageme;
Metal Coating: Copper;
Mode of Production: DIP;
Layers: Double-Layer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Type: Rigid Circuit Board;
Dielectric: Fr-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Insulation Materials: Epoxy Resin;
Processing Technology: Immersion Gold;
Copper Thickness: 3oz -105oz;
Surface Finish: Gold Finger;
Special Technology: Metal Edging;
Special 1: Blind Hole;
Special 2: Buried Vias;
Special 3: Flex-Rigid PCB;
Surface Finish 1: Immersion Gold Immersion Tin Hal Lead Free;
Metal Coating: Copper;
Mode of Production: DIP;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Type: Rigid Circuit Board;
Dielectric: Fr-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Insulation Materials: Epoxy Resin;
Processing Technology: Immersion Gold;
Copper Thickness: 3oz -105oz;
Surface Finish: Gold Finger;
Special Technology: Metal Edging;
Special 1: Blind Hole;
Special 2: Buried Vias;
Special 3: Flex-Rigid PCB;
Surface Finish 1: Immersion Gold Immersion Tin Hal Lead Free;
Metal Coating: Copper;
Mode of Production: DIP;
Layers: Double-Layer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Type: Rigid Circuit Board;
Dielectric: Fr-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Insulation Materials: Epoxy Resin;
Processing Technology: Immersion Gold;
Copper Thickness: 3oz -105oz;
Surface Finish: Gold Finger;
Special Technology: Metal Edging;
Special 1: Blind Hole;
Special 2: Buried Vias;
Special 3: Flex-Rigid PCB;
Surface Finish 1: Immersion Gold Immersion Tin Hal Lead Free;
Metal Coating: Copper;
Mode of Production: DIP;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Type: Rigid Circuit Board;
Dielectric: Fr-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Insulation Materials: Epoxy Resin;
Processing Technology: Immersion Gold;
Copper Thickness: 3oz -105oz;
Surface Finish: Gold Finger;
Special Technology: Metal Edging;
Special 1: Blind Hole;
Special 2: Buried Vias;
Special 3: Flex-Rigid PCB;
Surface Finish 1: Immersion Gold Immersion Tin Hal Lead Free;
Supplier Name

Shenzhen Grandtop Electronics Co., Ltd.

China Supplier - Diamond Member Audited Supplier

Shenzhen Hemeixin Electronic Co., Limited

China Supplier - Diamond Member Audited Supplier

Shenzhen Hemeixin Electronic Co., Limited

China Supplier - Diamond Member Audited Supplier

Shenzhen Hemeixin Electronic Co., Limited

China Supplier - Diamond Member Audited Supplier

Shenzhen Hemeixin Electronic Co., Limited

China Supplier - Diamond Member Audited Supplier