Aluminum Welding Wire of Radiator Raw Material

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Price

Min. Order Reference FOB Price

500 kg US$5.00-10.00 / kg

Sepcifications

state Solid
pH Neutral
Type Organic
Melting Point 501℃-600℃
Chemical Composition Ai, K
Function Remove Oxides, Protect Weld Metal, Make the Liquid Solder Flow
Application Submerged-arc Welding, Electroslag Welding
Manufacturing Method Smelting
Transport Package Carton
Specification Customized
Trademark Customized
Origin China

Product Description

Aluminum welding wire 1.Product Description ER1100 is a filler metal containing 99% aluminum with a melting point temperature range of 643-657°C, suitable for hydrogen arc welding before entering the furnace; ER3003 AIMn1.2 alloy, the melting point temperature range is 643-657°C, suitable ...

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NANJING MAJESTIC AUTO PARTS CO., LTD.

Diamond Member Since 2019

Audited Supplier

Business Type Manufacturer/Factory
Business Range Construction & Decoration
Main Products Radiator Tube, Radiator, Cooling System, Heat Exchanger System, Aluminum Tube, High Frequency Welded Tube, Intercooler Tube, Oil Cooler Tube, Intercooler, Oil Cooler
Management System Certification IATF16949
Main Markets North America, South America, Eastern Europe, Southeast Asia, Mid East, Eastern Asia
Average Lead Time Peak Season Lead Time: one month
Off Season Lead Time: within 15 workdays

Aluminum Welding Wire Comparison

	Aluminum Welding Wire of Radiator Raw Material Contact Now	Quick View RoHS Pewter Pai Relief Relife Ppd Rl 405 Om 340 5100 No 5 PCB Reflow Lead Pb Free Solder Paste 138c for Stencil Printing Contact Now	Quick View Best BGA Ppd AG Style Welding Aim Om 340 Alpha Cookson Lead Free Solder Paste for Electronics SMD Reflow Reballing Contact Now	Quick View Tin Lead Halide Free Flux Soldering and Fct Felder Fluxite Fryolux Fusion Goot Henkel Heraeus Hercules Eutectic Solder Paste Contact Now	Quick View Instant Indium Innolot Inventec Johnson Jyd Kek Kester Ep256 Jet Printing Jetting Lead Free Solder Paste for Electronics Contact Now

Transaction Info
	Aluminum Welding Wire of Radiator Raw Material Contact Now	Quick View RoHS Pewter Pai Relief Relife Ppd Rl 405 Om 340 5100 No 5 PCB Reflow Lead Pb Free Solder Paste 138c for Stencil Printing Contact Now	Quick View Best BGA Ppd AG Style Welding Aim Om 340 Alpha Cookson Lead Free Solder Paste for Electronics SMD Reflow Reballing Contact Now	Quick View Tin Lead Halide Free Flux Soldering and Fct Felder Fluxite Fryolux Fusion Goot Henkel Heraeus Hercules Eutectic Solder Paste Contact Now	Quick View Instant Indium Innolot Inventec Johnson Jyd Kek Kester Ep256 Jet Printing Jetting Lead Free Solder Paste for Electronics Contact Now
Price	US $ 5.00-10.00/ kg	US $ 40/ kg	US $ 30.00-80.00/ kg	US $ 30/ kg	US $ 30.00-80.00/ kg
Min Order	500 kg	50 kg	30 kg	50 kg	30 kg
Trade Terms	-	-	-	-	-
Payment Terms	L/C, T/T	T/T, Western Union, Paypal, Money Gram	T/T, Western Union, Paypal, Money Gram	T/T, Western Union, Paypal, Money Gram	T/T, Western Union, Paypal, Money Gram
Quality Control
Product Certification	-	RoHS	RoHS	-	RoHS Lead Free
Management System Certification	IATF16949	ISO 9001, ISO 14001	ISO 9001, ISO 14001	ISO 9001, ISO 14001	ISO 9001, ISO 14001
Trade Capacity
Export Markets	North America, South America, Eastern Europe, Southeast Asia, Mid East, Eastern Asia	South America, Europe, Southeast Asia/ Mideast, Domestic	South America, Europe, Southeast Asia/ Mideast, Domestic	South America, Europe, Southeast Asia/ Mideast, Domestic	South America, Europe, Southeast Asia/ Mideast, Domestic
Annual Export Revenue	-	-	-	-	-
Business Model	OEM, ODM	OEM, ODM, Own Brand	OEM, ODM, Own Brand	OEM, ODM, Own Brand	OEM, ODM, Own Brand
Average Lead Time	Off-season: within 15 Day(s) Peak-season: 1 Month(s)	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)
Product Attributes
Specification	state: Solid; pH: Neutral; Type: Organic; Melting Point: 501℃-600℃; Chemical Composition: Ai, K; Function: Remove Oxides, Protect Weld Metal, Make the Liquid Solder Flow; Application: Submerged-arc Welding, Electroslag Welding; Manufacturing Method: Smelting;	state: Liquid; pH: Neutral; Type: Solder Paste; Melting Point: <200℃; Chemical Composition: Sn-Bi; Function: Make the Liquid Solder Flow; Application: SMT; Manufacturing Method: Smelting; Alloy: Lead Free; Powder Size: Type 3: 25 to 45 Microns; Powder Size 2: Type 4: 20 to 38 Microns; Flux: No Clean Flux; Alloy 2: Sac305 Sn96.5AG3.0cu0.5; Alloy 3: Sac0307 Sn99AG0.3cu0.7; Alloy 4: Sn42bi58 Low Temperature; Packing: Jar; Packing 2: Syringe; Shipping: Courier / Air Freight; Shelf Life: 6months; Storage: 0 to 10 Degree Celsius; Application 2: for SMD SMT Component Reflow Soldering; Application 3: for Electronics Assembly by Stencil Printing;	state: Liquid; pH: Neutral; Type: Solder Paste; Melting Point: <200℃; Chemical Composition: Sn-Bi; Function: Make the Liquid Solder Flow; Application: SMT; Manufacturing Method: Smelting; Alloy: Lead Free; Powder Size: Type 3: 25 to 45 Microns; Powder Size 2: Type 4: 20 to 38 Microns; Flux: No Clean Flux; Alloy 2: Sac305 Sn96.5AG3.0cu0.5; Alloy 3: Sac0307 Sn99AG0.3cu0.7; Alloy 4: Sn42bi58 Low Temperature; Packing: Jar; Packing 2: Syringe; Shipping: Courier / Air Freight; Shelf Life: 6months; Storage: 0 to 10 Degree Celsius; Application 2: SMD;	state: Liquid; pH: Neutral; Type: Organic; Melting Point: <200℃; Chemical Composition: Tin; Function: Make the Liquid Solder Flow; Manufacturing Method: Smelting; Alloy: Tin Lead; Powder Size: Type 3: 25 to 45 Microns; Powder Size 2: Type 4: 20 to 38 Microns; Flux: No Clean Flux; Alloy 2: Sn63pb37; Alloy 3: Sn60pb40; Alloy 4: Sn55pb45; Alloy 5: Sn50pb50; Packing: Jar; Packing 2: Syringe; Shipping: Courier / Air Freight; Shelf Life: 6months; Storage: 0 to 10 Degree Celsius; Application 2: for SMT Reflow Soldering; Application 3: for PCB Assembly Soldering;	state: Liquid; pH: Neutral; Type: Solder Paste; Melting Point: <200℃; Chemical Composition: Sn-Bi; Function: Make the Liquid Solder Flow; Application: SMT; Manufacturing Method: Smelting; Alloy: Lead Free; Powder Size: Type 3: 25 to 45 Microns; Powder Size 2: Type 4: 20 to 38 Microns; Flux: No Clean Flux; Alloy 2: Sac305 Sn96.5AG3.0cu0.5; Alloy 3: Sac0307 Sn99AG0.3cu0.7; Alloy 4: Sn42bi58 Low Temperature; Packing: Jar; Packing 2: Syringe; Shipping: Courier / Air Freight; Shelf Life: 6months; Storage: 0 to 10 Degree Celsius; Application 2: for SMD SMT PCB Soldering; Application 3: for Jet Printing Jetting Soldering;
Supplier Name	NANJING MAJESTIC AUTO PARTS CO., LTD.	Foshan Xi Feng Tin Products Co., Ltd.	Foshan Xi Feng Tin Products Co., Ltd.	Foshan Xi Feng Tin Products Co., Ltd.	Foshan Xi Feng Tin Products Co., Ltd.
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