PCBA Design Assemble and SMT Other Electronic Components PCB Assembly Service Shenzhen

About this Item
Details
Company Profile

Price

Purchase Qty. Reference FOB Price

1-9 Pieces US$10.00

10+ Pieces US$1.00

Sepcifications

  • Type PCBA
  • Dielectric PCBA
  • Material PCBA
  • Application PCBA
  • Flame Retardant Properties PCBA
  • Mechanical Rigid PCBA
  • Processing Technology PCBA
  • Base Material Aluminum
  • Insulation Materials Organic Resin
  • Brand Nova
  • Transport Package EXW
  • Specification 1
  • Trademark N/A
  • Origin China
  • PCBA PCBA

Product Description

pcba design assemble and SMT Other Electronic Components PCB Assembly Service Shenzhen 1. The industry market situation and original factory prices fluctuate frequently, and the specific prices are subject to confirmation by customer service 2. Original factory full package packaging, the ...

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PCB Assembly Comparison
Transaction Info
Price US $ 1.00-10.00/ Piece US $ 0.01-150.00/ Piece US $ 0.01-150.00/ Piece US $ 0.51-3.00/ Piece US $ 0.56-5.00/ Piece
Min Order 1 Pieces 1 Pieces 1 Pieces 10 Pieces 10 Pieces
Trade Terms - - - - -
Payment Terms T/T L/C, T/T, Western Union, Paypal, Money Gram L/C, T/T, Western Union, Paypal, Money Gram T/T T/T
Quality Control
Product Certification - - - RoHS, CCC, ISO RoHS, CCC, ISO
Management System Certification GMP ISO 9001, ISO 14001, IATF16949 ISO 9001, ISO 14001, IATF16949 ISO 9001, IATF16949, ISO 13485 ISO 9001, IATF16949, ISO 13485
Trade Capacity
Export Markets North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe Domestic Domestic
Annual Export Revenue - - - - -
Business Model OEM OEM OEM OEM, ODM OEM, ODM
Average Lead Time - Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: 1 Month(s)
Peak-season: 1-3 Month(s)
Off-season: 1 Month(s)
Peak-season: 1-3 Month(s)
Product Attributes
Specification
Type: PCBA;
Dielectric: PCBA;
Material: PCBA;
Application: PCBA;
Flame Retardant Properties: PCBA;
Mechanical Rigid: PCBA;
Processing Technology: PCBA;
Base Material: Aluminum;
Insulation Materials: Organic Resin;
Brand: Nova;
PCBA: PCBA;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Remark: PCB Board;
Layer: 6;
Surface Finish: HASL;
Materials: Fr4, High Tg Fr4, PTFE, Alu, Cu Base, Rogers;
Board Thickness: 0.20mm-8.00mm;
Min Line: 0.075mm;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Remark: PCB Board;
Layer: 8;
Surface Finish: HASL;
Materials: Fr4, High Tg Fr4, PTFE, Alu, Cu Base, Rogers;
Board Thickness: 0.20mm-8.00mm;
Min Line: 0.075mm;
Type: Flexible Circuit Board;
Dielectric: FR-4;
Material: Aluminum Covered Copper Foil Layer;
Application: Communication;
Flame Retardant Properties: V0;
Mechanical Rigid: Fexible;
Processing Technology: Customized;
Base Material: Aluminum;
Insulation Materials: Epoxy Resin;
Brand: OEM/ODM;
PCBA-Testing: X-ray, Aoi;
Processing: Electrolytic Foil;
SMT Capacity: >2 Million Points/Day;
DIP Capacity: >100K Parts/Day;
Min. Space of BGA: +/- 0.3mm;
Min.Pin Space of IC: 0.3mm;
Max.Precision of IC Assembly: 0.03mm;
Surface Finishing: Lead-Free HASL;
Number of Layers: 4-10 Layer;
Board Thickness: 1.6mm;
Type: Flexible Circuit Board;
Dielectric: FR-4;
Material: Aluminum Covered Copper Foil Layer;
Application: Communication;
Flame Retardant Properties: V0;
Mechanical Rigid: Fexible;
Processing Technology: Customized;
Base Material: Aluminum;
Insulation Materials: Epoxy Resin;
Brand: OEM/ODM;
PCBA-Testing: X-ray, Aoi;
Processing: Electrolytic Foil;
SMT Capacity: >2 Million Points/Day;
DIP Capacity: >100K Parts/Day;
Min. Space of BGA: +/- 0.3mm;
Min.Pin Space of IC: 0.3mm;
Max.Precision of IC Assembly: 0.03mm;
Surface Finishing: Lead-Free HASL;
Number of Layers: 4-10 Layer;
Board Thickness: 1.6mm;
Supplier Name

ShenZhen Nova Semiconductor Co., Ltd.

China Supplier - Diamond Member Audited Supplier

Abis Circuits Co., Ltd.

China Supplier - Diamond Member Audited Supplier

Abis Circuits Co., Ltd.

China Supplier - Diamond Member Audited Supplier

Shenzhen Hongzhou Smart Technology Co., Ltd.

China Supplier - Diamond Member Audited Supplier

Shenzhen Hongzhou Smart Technology Co., Ltd.

China Supplier - Diamond Member Audited Supplier