HDI
US$0.024-0.046 / Piece
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What is High Precision Six Layers PCB Board with Impedance and BGA Balls

About this Item
Details
Company Profile

Price

Purchase Qty. Reference FOB Price

1-999 Pieces US$0.046

1,000-9,999 Pieces US$0.037

10,000+ Pieces US$0.024

Sepcifications

  • Type Rigid Circuit Board
  • Dielectric FR-4
  • Material Fiberglass Epoxy
  • Application Aerospace
  • Flame Retardant Properties V0
  • Mechanical Rigid Rigid
  • Processing Technology Electrolytic Foil
  • Base Material Copper
  • Insulation Materials Epoxy Resin
  • Brand Okey
  • Transport Package Inner Vacuum; Outer Carton Box; Fianlly Pallet
  • Specification FR-4,1.6mm board thickness,1OZ Copper,Green Solder
  • Trademark OKEY
  • Origin Guangdong Shenzhen, China
  • Board Material Fr4, H-Tg, It-180A, Cem, Aluminum, Copper Base
  • Board Thickness 0.4-5.0mm
  • Layer 1-60 Layers
  • Copper Thickness 0.5-10 Oz
  • Solder Mask Color Green, White, Black, Blue, Yellow, Red, Purple
  • Silkscreen Color Green, White, Black, Blue, Yellow
  • Surface Finishing HASL, Lf HASL, Enig, OSP, Carbon Oil, Immersion Tin
  • Certificate RoHS, SGS, Reach, UL, ISO9001, Tsca
  • Min. SMD Size 01005
  • PCB Testing E-Test, Fly Probe Test, Visual Checking
  • PCBA Testing Aoi, Ict, Fct, Burn-in, Vibration Test
  • Order Qty Not Limited
  • Shape Rectangular, Round, Slots, Cutouts, Complex, Irregular
  • Service Turnkey Assembly PCB PCBA Service
  • Customized Customizable

Product Description

Shenzhen Okey Circuit Co.,Ltd provides one-stop electronic OEM/ODM services,from design,components sourcing,PCB production,SMT assembly,DIP assembly,hand soldering,PCBA testing,case assembly to finished products. Since its establishment in 2006, our products are widely used in computer, audio, ...

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HDI Comparison
Transaction Info
Price US $ 0.024-0.046/ Piece US $ 0.20-0.30/ Piece US $ 0.1/ Piece US $ 0.1/ Piece US $ 0.1/ Piece
Min Order 1 Pieces 1 Pieces 1 Pieces 1 Pieces 1 Pieces
Trade Terms - FOB, CFR, EXW, CIF, DAT, FAS, DDP, DAP, CIP, CPT, FCA FOB, CFR, EXW, CIF, DAT, FAS, DDP, DAP, CIP, CPT, FCA FOB, CFR, EXW, CIF, DAT, FAS, DDP, DAP, CIP, CPT, FCA FOB, CFR, CIF, DAT, FAS, DDP, DAP, CIP, CPT, FCA, EXW
Payment Terms L/C, T/T, D/P, Western Union, Paypal, Money Gram, Cash,Wechat,Alipay L/C, T/T, D/P, Western Union, Paypal, Money Gram, cash L/C, T/T, Western Union, Paypal, Money Gram, Cash L/C, T/T, D/P, Western Union, Paypal, Money Gram L/C, T/T, D/P, Western Union, Paypal, Money Gram
Quality Control
Product Certification RoHS, SGS, Reach, UL, ISO9001, Tsca - - UL, ISO9001 UL, ISO9001
Management System Certification ISO 9001, ISO 14001, IATF16949 ISO 9001, ISO 14001 ISO 9001, ISO 14001 ISO 9001, ISO 14001 ISO 9001, ISO 14001
Trade Capacity
Export Markets North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
Annual Export Revenue - - - - -
Business Model OEM, ODM OEM, ODM OEM, ODM OEM, ODM OEM, ODM
Average Lead Time Off-season: within 15 Day(s)
Peak-season: 1 Month(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Product Attributes
Specification
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Aerospace;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Okey;
Board Material: Fr4, H-Tg, It-180A, Cem, Aluminum, Copper Base;
Board Thickness: 0.4-5.0mm;
Layer: 1-60 Layers;
Copper Thickness: 0.5-10 Oz;
Solder Mask Color: Green, White, Black, Blue, Yellow, Red, Purple;
Silkscreen Color: Green, White, Black, Blue, Yellow;
Surface Finishing: HASL, Lf HASL, Enig, OSP, Carbon Oil, Immersion Tin;
Min. SMD Size: 01005;
PCB Testing: E-Test, Fly Probe Test, Visual Checking;
PCBA Testing: Aoi, Ict, Fct, Burn-in, Vibration Test;
Order Qty: Not Limited;
Shape: Rectangular, Round, Slots, Cutouts, Complex, Irregular;
Service: Turnkey Assembly PCB PCBA Service;
Customized: Customizable;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Fr4;
Insulation Materials: Organic Resin;
Copper Thickness: 1oz;
Layer: 2 Layer;
Solder Mask Color: Green, Blue, White, Red, Ect;
Surface Finished: HASL;
Min. Hole Size: 0.2mm;
Min. Line Width: 0.1mm;
Min. Line Space: 0.1mm;
Silkscreen: White;
Test: E-Test;
Package: Vacuum Package;
Type: Rigid Circuit Board;
Dielectric: CEM-3;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Fr4;
Insulation Materials: Organic Resin;
Solder Mask: Green Blue Red White Biack etc;
Test: Aol;
Board Thickness: 1.6mm;
Copper Thickness: 1oz;
Layer: 1 to 16;
Color: Green, White, Black, Ect;
Min Hole Size: 0.2mm;
Min Line Width: 0.1mm;
Min Line Spacing: 0.1mm;
Surface Finish: HASL, Immersion Gold, OSP;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Paper Phenolic Copper Foil Substrate;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Base Material: Fr4;
Insulation Materials: Epoxy Resin;
Copper Thickness: 2oz;
Board Thickness: 1.6mm;
Min. Hole Size: 0.1mm;
Min. Line Space: 0.075mm;
Min. Line Width: 0.075mm;
Solder Mask: Green;
Test: Aoi;
Package: Vacuum Package;
Small Order: Accept;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Paper Phenolic Copper Foil Substrate;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Base Material: Fr4;
Insulation Materials: Epoxy Resin;
Copper Thickness: 2oz;
Board Thickness: 1.6mm;
Min. Hole Size: 0.1mm;
Min. Line Space: 0.075mm;
Min. Line Width: 0.075mm;
Solder Mask: Green;
Test: Aoi;
Package: Vacuum Package;
Small Order: Accept;
Supplier Name

Shenzhen Okey Circuit Co., Ltd.

China Supplier - Diamond Member Audited Supplier

Shenzhen Xinjiaye Electronics Technology Co., Ltd.

China Supplier - Gold Member Audited Supplier

Shenzhen Xinjiaye Electronics Technology Co., Ltd.

China Supplier - Gold Member Audited Supplier

Shenzhen Xinjiaye Electronics Technology Co., Ltd.

China Supplier - Gold Member Audited Supplier

Shenzhen Xinjiaye Electronics Technology Co., Ltd.

China Supplier - Gold Member Audited Supplier