FPC
US$0.01-0.41 / Piece
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What is OEM ODM Rigid-Flex PCB Printed LED Circuit Board Flexible PCB FPC Factory

About this Item
Details
Company Profile

Price

Min. Order Reference FOB Price

1 Piece US$0.01-0.41 / Piece

Sepcifications

  • Structure Multilayer FPC
  • Material Polyimide
  • Combination Mode Adhesive Flexible Plate
  • Application Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace
  • Conductive Adhesive Anisotropic Conductive Adhesive
  • Flame Retardant Properties V0
  • Processing Technology Delay Pressure Foil
  • Base Material Copper
  • Insulation Materials Metal Composite Materials
  • Brand Okey
  • Transport Package Inner Vacuum Packing Outer Carton Box
  • Specification FR4 PI, 0.1-0.3mm, 1 Layer, 1OZ Copper Thickness
  • Trademark OKEY/ODM OEM
  • Origin China
  • Shape Retangular, Round, Slots, Cutouts, Complex, Irreg
  • Surface Finishing OSP, Immersion Gold, Immersion Tin, Immersion AG
  • Layer 1-6 Layers
  • Service Turnkey Assembly PCB Service
  • Other Capabilities Repair/Rework Services Mechanical Assembly Box Bui
  • Min Hole Size Mechanical Hole: 0.15mm, Laser Hole: 0.1mm
  • Outline Profile Rout/ V-Cut/ Bridge/ Stamp Hole
  • Certificate ISO9001, ISO14000, Ts16949.UL.RoHS
  • Order Qty No Limited
  • Controlling Range -40c~125c
  • Solder Resist Color Green;Red;Yellow;Black;White
  • Surface Finished HASL, Gold Finger, OSP, Enig, Peelable Mask
  • Trade Mark OEM, ODM
  • Min. Line Width 2mil
  • Max Production Size 600*800mm

Product Description

Our Advantage: 1. Free programming and free functional test, free package. 2. High quality: IPC-A-610E standard, E-test, X-ray, AOI test, QC, 100% funtional test. 3. Professional service. ISO SMT and through hole assembly, over 12 years experience. 4. Certification for electronics: UL, ...

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FPC Comparison
Transaction Info
Price US $ 0.01-0.41/ Piece US $ 4.15-16.20/ Piece US $ 2.68-8.15/ Piece US $ 0.326-2.89/ Piece US $ 0.58-3.66/ Piece
Min Order 1 Pieces 100 Pieces 100 Pieces 100 Pieces 100 Pieces
Trade Terms - - - - -
Payment Terms L/C, T/T, D/P, Western Union, Paypal, Money Gram T/T, Western Union, Paypal T/T, Western Union, Paypal T/T, Western Union, Paypal T/T, Western Union, Paypal
Quality Control
Product Certification ISO9001, ISO14000, Ts16949.UL.RoHS - - - -
Management System Certification ISO 9001, ISO 14001, IATF16949 ISO 9001, ISO 9000, ISO 14001, ISO 14000, IATF16949, HSE ISO 9001, ISO 9000, ISO 14001, ISO 14000, IATF16949, HSE ISO 9001, ISO 9000, ISO 14001, ISO 14000, IATF16949, HSE ISO 9001, ISO 9000, ISO 14001, ISO 14000, IATF16949, HSE
Trade Capacity
Export Markets North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
Annual Export Revenue - - - - -
Business Model OEM, ODM OEM, ODM OEM, ODM OEM, ODM OEM, ODM
Average Lead Time Off-season: within 15 Day(s)
Peak-season: 1 Month(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Product Attributes
Specification
Structure: Multilayer FPC;
Material: Polyimide;
Combination Mode: Adhesive Flexible Plate;
Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace;
Conductive Adhesive: Anisotropic Conductive Adhesive;
Flame Retardant Properties: V0;
Processing Technology: Delay Pressure Foil;
Base Material: Copper;
Insulation Materials: Metal Composite Materials;
Brand: Okey;
Shape: Retangular, Round, Slots, Cutouts, Complex, Irreg;
Surface Finishing: OSP, Immersion Gold, Immersion Tin, Immersion AG;
Layer: 1-6 Layers;
Service: Turnkey Assembly PCB Service;
Other Capabilities: Repair/Rework Services Mechanical Assembly Box Bui;
Min Hole Size: Mechanical Hole: 0.15mm, Laser Hole: 0.1mm;
Outline Profile: Rout/ V-Cut/ Bridge/ Stamp Hole;
Order Qty: No Limited;
Controlling Range: -40c~125c;
Solder Resist Color: Green;Red;Yellow;Black;White;
Surface Finished: HASL, Gold Finger, OSP, Enig, Peelable Mask;
Trade Mark: OEM, ODM;
Min. Line Width: 2mil;
Max Production Size: 600*800mm;
Structure: Multilayer PCB+FPC;
Material: Polyimide;
Combination Mode: Adhesive Flexible Plate;
Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace;
Conductive Adhesive: Conductive Silver Paste;
Flame Retardant Properties: V0;
Processing Technology: Immersion Gold;
Base Material: Fr4+Pi+Nfpp;
Insulation Materials: Organic Resin;
Structure: Multilayer PCB+FPC;
Material: Polyimide;
Combination Mode: Adhesive Flexible Plate;
Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace, Medical Device;
Conductive Adhesive: Conductive Silver Paste;
Flame Retardant Properties: V0;
Processing Technology: Enig;
Base Material: Fr4+Pi+Nfpp;
Insulation Materials: Organic Resin;
Blind Vias: 0.1mm;
Buried Vias: 0.1mm;
Structure: Multilayer PCB+FPC;
Material: Polyimide;
Combination Mode: Adhesive Flexible Plate;
Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace;
Conductive Adhesive: Conductive Silver Paste;
Flame Retardant Properties: V0;
Processing Technology: Enig+OSP;
Base Material: Fr4+Pi+Nfpp;
Insulation Materials: Organic Resin;
Brand: 1;
Structure: Multilayer PCB+FPC;
Material: Polyimide;
Combination Mode: Adhesive Flexible Plate;
Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace;
Conductive Adhesive: Conductive Silver Paste;
Flame Retardant Properties: V0;
Processing Technology: Enig+OSP;
Base Material: Fr4+Pi+Nfpp;
Insulation Materials: Organic Resin;
Brand: 1;
Supplier Name

Shenzhen Okey Circuit Co., Ltd.

China Supplier - Diamond Member Audited Supplier

Shanghai Gawin Electronic Technology Co., Ltd.

China Supplier - Diamond Member Audited Supplier

Shanghai Gawin Electronic Technology Co., Ltd.

China Supplier - Diamond Member Audited Supplier

Shanghai Gawin Electronic Technology Co., Ltd.

China Supplier - Diamond Member Audited Supplier

Shanghai Gawin Electronic Technology Co., Ltd.

China Supplier - Diamond Member Audited Supplier