Specification |
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy Resin + Polyimide Resin;
Application: Medical Instruments;
Flame Retardant Properties: V2;
Mechanical Rigid: Fexible;
Processing Technology: Delay Pressure Foil;
Base Material: Aluminum;
Insulation Materials: Metal Composite Materials;
Brand: Okey;
Shape: Retangular, Round, Slots, Cutouts, Complex, Irreg;
Surface Finishing: OSP, Immersion Gold, Immersion Tin, Immersion AG;
Layer: 1-60 Layers;
Service: Turnkey Assembly PCB Service;
Other Capabilities: Repair/Rework Services Mechanical Assembly Box Bui;
Min Hole Size: Mechanical Hole: 0.15mm, Laser Hole: 0.1mm;
Outline Profile: Rout/ V-Cut/ Bridge/ Stamp Hole;
Order Qty: No Limited;
Controlling Range: -40c~125c;
Solder Resist Color: Green;Red;Yellow;Black;White;
Surface Finished: HASL, Gold Finger, OSP, Enig, Peelable Mask;
Trade Mark: OEM, ODM;
Min. Line Width: 4mil;
Max Production Size: 600*800mm;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Medical Instruments;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: Uc;
Layer Count: 4 Layers;
Finished Copper Thickness: All 35um;
Board Thickness: 1.6mm;
Thickness Material: Fr4;
Surface Finish: HASL;
Soldermask Color: Red;
Specialities: BGA,Controlled Impedance;
PCB Testing: E-Testing, Flying Probe Testing;
Ipc Standards: Ipc Class II;
Lead Time: 9 Working Days;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Medical Instruments;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: Uc;
Layer Count: 4 Layers;
Finished Copper Thickness: All 35um;
Board Thickness: 1.6mm;
Thickness Material: Fr4;
Surface Finish: HASL;
Soldermask Color: Red;
Specialities: BGA,Controlled Impedance;
PCB Testing: E-Testing, Flying Probe Testing;
Ipc Standards: Ipc Class II;
Lead Time: 9 Working Days;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Medical Instruments;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: Uc;
Layer Count: 4 Layers;
Finished Copper Thickness: All 35um;
Board Thickness: 1.6mm;
Thickness Material: Fr4;
Surface Finish: Enig 4u";
Soldermask Color: Green;
Specialities: Hard Gold;
PCB Testing: E-Testing, Flying Probe Testing;
Ipc Standards: Ipc Class II;
Lead Time: 9 Working Days;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Aerospace;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Immersional Gold;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: Ucreate PCB;
Board Thickness: 1.2~2.0mm;
Surface Finihsing: Immersional Gold;
Lead Time: 6-8 Working Days;
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