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US$0.031-0.42 / Piece

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What is High Quality Printed Circuit Board PCBA Design PCB Assembly

Name: High Quality Printed Circuit Board PCBA Design PCB Assembly
Uploaded: 2022-06-20T14:48:23+08:00
Description: Technical Capabilities Items Speci. Remark Max panel size 32" x 20.5"(800mm x 520mm) Max. Board size 2000×610mm Min. board Thickness 2-layer 0.15mm 4-layer 0.4mm 6-layer 0.6mm 8-laye

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About this Item

Price

Min. Order Reference FOB Price

1 Piece US$0.031-0.42 / Piece

Sepcifications

Structure Double-Sided Rigid PCB
Dielectric FR-4
Material Fr4
Application Consumer Electronics
Flame Retardant Properties V0
Processing Technology Electrolytic Foil
Production Process Semi-Additive Process
Base Material Copper
Insulation Materials Organic Resin
Transport Package Inner Vacuum Packing Outer Carton Box
Specification FR 4, 0.8mm, 1 Layer, 1OZ Copper Thickness
Trademark OKEY
Origin Guangdong Shenzhen, China
Color Green, Blue, Black, Red, Yellow etc.
Certificate ISO UL RoHS and Reach
Surface Finish Lead Free HASL

Product Description

Technical Capabilities Items Speci. Remark Max panel size 32" x 20.5"(800mm x 520mm) Max. Board size 2000×610mm Min. board Thickness 2-layer 0.15mm 4-layer 0.4mm 6-layer 0.6mm 8-layer 1.5mm 10-layer 1.6~2.0mm Min. line Width/Space 0.1mm(4mil) Max. ...

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Shenzhen Okey Circuit Co., Ltd.

Diamond Member Since 2013

Audited Supplier

Business Type Manufacturer/Factory
Main Products PCB, PCB Board, Circuit Board, Printed Circuit Board, PCB Assembly, PCB Manufactory, Aluminum PCB, LED PCB, LED Board, Flexible PCB
Registered Capital 2000000 RMB
Plant Area >2000 square meters
Management System Certification ISO 9001, ISO 14001, IATF16949
Average Lead Time Peak Season Lead Time: one month
Off Season Lead Time: within 15 workdays

PCB Comparison

	Quick View High Quality Printed Circuit Board PCBA Design PCB Assembly Contact Now	Quick View 2.0mm 10layer Immersion Gold Circuit Board PCB for 5g Antenna Contact Now	Quick View 3.8mm 10layer Counterbore Hole 6.0mm Depth 1.5mm Multilayer Complex Circuit Board PCB Contact Now	Quick View Plated Gold 30u" Motherboard PCB for Consumer Electronics Module Contact Now	Quick View 12layer Circuit Board PCB with Plated Gold Finger 30u and BGA Contact Now

Transaction Info
	Quick View High Quality Printed Circuit Board PCBA Design PCB Assembly Contact Now	Quick View 2.0mm 10layer Immersion Gold Circuit Board PCB for 5g Antenna Contact Now	Quick View 3.8mm 10layer Counterbore Hole 6.0mm Depth 1.5mm Multilayer Complex Circuit Board PCB Contact Now	Quick View Plated Gold 30u" Motherboard PCB for Consumer Electronics Module Contact Now	Quick View 12layer Circuit Board PCB with Plated Gold Finger 30u and BGA Contact Now
Price	US $ 0.031-0.42/ Piece	US $ 0.29-2.90/ Piece	US $ 0.38-3.20/ Piece	US $ 0.43-2.80/ Piece	US $ 0.58-4.60/ Piece
Min Order	1 Pieces	100 Pieces	100 Pieces	100 Pieces	100 Pieces
Trade Terms	FOB, CIF, FCA, EXW	-	-	-	-
Payment Terms	L/C, T/T, Paypal	T/T, Western Union, Paypal	T/T, Western Union, Paypal	T/T, Western Union, Paypal	T/T, Western Union, Paypal
Quality Control
Product Certification	ISO UL RoHS and Reach	-	-	-	-
Management System Certification	ISO 9001, ISO 14001, IATF16949	ISO 9001, ISO 9000, ISO 14001, ISO 14000, IATF16949, HSE	ISO 9001, ISO 9000, ISO 14001, ISO 14000, IATF16949, HSE	ISO 9001, ISO 9000, ISO 14001, ISO 14000, IATF16949, HSE	ISO 9001, ISO 9000, ISO 14001, ISO 14000, IATF16949, HSE
Trade Capacity
Export Markets	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
Annual Export Revenue	-	-	-	-	-
Business Model	OEM, ODM	OEM, ODM	OEM, ODM	OEM, ODM	OEM, ODM
Average Lead Time	Off-season: within 15 Day(s) Peak-season: 1 Month(s)	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)
Product Attributes
Specification	Structure: Double-Sided Rigid PCB; Dielectric: FR-4; Material: Fr4; Application: Consumer Electronics; Flame Retardant Properties: V0; Processing Technology: Electrolytic Foil; Production Process: Semi-Additive Process; Base Material: Copper; Insulation Materials: Organic Resin; Color: Green, Blue, Black, Red, Yellow etc.; Surface Finish: Lead Free HASL;	Structure: Multilayer Rigid PCB; Dielectric: FR-4; Material: Epoxy Paper Laminate; Application: Communication; Flame Retardant Properties: V0; Processing Technology: Enig; Production Process: Additive Process; Base Material: Copper; Insulation Materials: Epoxy Resin; Layer Count: up to 64; Cu Thickness: up to 12oz; Board Thickness: up to 8mm; Min. Solder Bridge: 4mil;	Structure: Multilayer Rigid PCB; Dielectric: FR-4; Material: Epoxy Paper Laminate; Application: Communication; Flame Retardant Properties: V0; Processing Technology: Enig; Production Process: Additive Process; Base Material: Copper; Insulation Materials: Epoxy Resin; Brand: 1; Layer Count: up to 64; Cu Thickness: up to 12oz; Board Thickness: up to 8mm; Counterbore Hole: 6.0mm;	Structure: Multilayer Rigid PCB; Dielectric: FR-4; Material: Epoxy Paper Laminate; Application: Communication; Flame Retardant Properties: V0; Processing Technology: Enig; Production Process: Additive Process; Base Material: Copper; Insulation Materials: Epoxy Resin; Layer Count: up to 64; Cu Thickness: up to 12oz; Board Thickness: up to 8mm; Counterbore Hole: 6.0mm;	Structure: Multilayer Rigid PCB; Dielectric: FR-4; Material: Epoxy Paper Laminate; Application: Communication; Flame Retardant Properties: V0; Processing Technology: Enig; Production Process: Additive Process; Base Material: Copper; Insulation Materials: Epoxy Resin; Brand: 1; Layer Count: up to 64; Cu Thickness: up to 12oz; Board Thickness: up to 8mm; Speciality: Plated Gold Fingers 30u;
Supplier Name	Shenzhen Okey Circuit Co., Ltd.	Shanghai Gawin Electronic Technology Co., Ltd.	Shanghai Gawin Electronic Technology Co., Ltd.	Shanghai Gawin Electronic Technology Co., Ltd.	Shanghai Gawin Electronic Technology Co., Ltd.
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