Specification |
Structure: Double-Sided FPC;
Material: Pi;
Application: Computer with LCD Screen;
Flame Retardant Properties: V0;
Processing Technology: Delay Pressure Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Hl-PCB;
Surface Treatment: Gold Plated;
Mini Hole Diameter: 0.3mm;
Borad Thickness: 1.0mm;
Count Layer: 2;
Min Trace Width/Spacing: 4mil/4mil;
Special: Black Screened Film;
Certificated: ISO9001, ISO14001, CQC, IATF16949, UL, RoHS etc.;
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Structure: Single-Sided FPC;
Material: Polyimide;
Combination Mode: Adhesive Flexible Plate;
Application: Digital Products;
Conductive Adhesive: Conductive Silver Paste;
Flame Retardant Properties: V0;
Processing Technology: HASL;
Base Material: Fr4;
Insulation Materials: Epoxy Resin;
Brand: Xjy;
Board Size: Customized;
Board Color: Green/Black/Red/Yellow Customized;
Silkscreen Color: Green/Black/Red/Yellow Customized;
Design Improvement: Available;
Min. Line Space: 0.1mm;
Min.Hole Size: 0.15mm;
Min.Line Width: 0.1mm;
Max.Panel Size: 1200*750mm;
Certificates: ISO, UL, SGS, RoHS;
Shipping Express: DHL, UPS, TNT, Aramex, FedEx;
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Structure: Double-Sided FPC;
Material: Polyester Film;
Combination Mode: Adhesive Flexible Plate;
Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace, Display Screen;
Conductive Adhesive: Conductive Silver Paste;
Flame Retardant Properties: V0;
Base Material: Membrane;
Insulation Materials: Metal Composite Materials;
Surface Finishing: Enig;
Copper Thickness: 35um;
Board Thickness: 0.1mm;
Min. Hole Size: 0.15mm;
Min. Line Wigth: 0.25mm;
Min. Line Spacing: 0.25mm;
Solder Mask Color: Yellow;
Silkscreen Color: White;
Export Markets: Global;
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Structure: Multilayer FPC;
Material: Polyester Film;
Combination Mode: Adhesive Flexible Plate;
Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace, Display Screen;
Conductive Adhesive: Conductive Silver Paste;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Surface Finishing: Enig;
Copper Thickness: 0.2~1.0mm;
Board Thickness: 0.1mm;
Min. Hole Size: 0.15mm;
Min. Line Wigth: 0.25mm;
Min. Line Spacing: 0.25mm;
Color: Yellow;
Size: 5*5mm~50*50mm;
Tolerance: 0.13mm;
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Structure: Double-Sided FPC;
Material: Polyimide;
Combination Mode: Adhesive Flexible Plate;
Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace, Electronic Products;
Conductive Adhesive: Conductive Silver Paste;
Flame Retardant Properties: V0;
Processing Technology: Immersion Gold;
Base Material: Fr4;
Insulation Materials: Organic Resin;
Board Size: Customized;
Board Color: Green/Black/Red/Yellow Customized;
Silkscreen Color: Green/Black/Red/Yellow Customized;
Design Improvement: Available;
Min. Line Space: 0.1mm;
Min.Hole Size: 0.15mm;
Min.Line Width: 0.1mm;
Max.Panel Size: 1200*750mm;
Certificates: ISO, UL, SGS, RoHS;
Shipping Express: DHL, UPS, TNT, Aramex, FedEx;
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