Piesia Latest 6COM 8gpiointel Core Ultra-U/H Ai Computer Mainboard

About this Item
Details
Company Profile

Price

Min. Order Reference FOB Price

1 Piece US$505.00 / Piece

Sepcifications

  • Integrated Graphics Integrated Graphics
  • Main Chipset Intel
  • Maximum Memory Capacity 96
  • Structure 3.5 Inch Motherboard
  • Memory DDR5
  • SATA Interface SATA3.0
  • Main Board Structure Integrated
  • Trademark Piesia
  • Origin Guangdong, China
  • Form Factor X86
  • RAM 2*DDR5 So-DIMM, Max 96GB
  • Display Tpm2.0, Type-C, Dp, Edp/Lvds
  • LAN 2
  • COM 6
  • USB 8
  • Gpio 8
  • M.2 3m.2(SSD/WiFi/4G/5g
  • Power Supply DC 9-36V
  • OS Win 10/11, Linux

Product Description

UT1003AW(R100) Product Feature: * Intel core Ultra-U/H series processor * 2 DDR5 SO-DIMM, total maximum 96GB * TPM2.0 optional, 1TYPE-C (support DP), 1DP, 1HDMI, 1EDP/LVDS two optional * 2LAN/6COM/8USB/8GPIO/3M.2(SSD/WIFI/4G/5G) * DC9-36V wide voltage * 146x102mm Product Parameters ...

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Industrial Motherboard Comparison
Transaction Info
Price US $ 505/ Piece US $ 246.00-250.00/ Piece US $ 160.00-165.00/ Piece US $ 202.00-207.00/ Piece US $ 70.00-75.00/ Piece
Min Order 1 Pieces 2 Pieces 1 Pieces 1 Pieces 1 Pieces
Trade Terms - - - - -
Payment Terms L/C, T/T, D/P, Western Union, Paypal, Money Gram T/T, Western Union, Paypal, Money Gram T/T, Western Union, Money Gram T/T, Western Union, Money Gram T/T, Western Union, Money Gram
Quality Control
Management System Certification ISO 9001, HSE, QHSE, EICC ISO 9001 ISO 9001 ISO 9001 ISO 9001
Trade Capacity
Export Markets North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
Annual Export Revenue - - - - -
Business Model OEM, ODM, Own Brand OEM, ODM, Own Brand OEM, ODM, Own Brand OEM, ODM, Own Brand OEM, ODM, Own Brand
Average Lead Time Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Product Attributes
Specification
Integrated Graphics: Integrated Graphics;
Main Chipset: Intel;
Maximum Memory Capacity: 96;
Structure: 3.5 Inch Motherboard;
Memory: DDR5;
SATA Interface: SATA3.0;
Main Board Structure: Integrated;
Form Factor: X86;
RAM: 2*DDR5 So-DIMM, Max 96GB;
Display: Tpm2.0, Type-C, Dp, Edp/Lvds;
LAN: 2;
COM: 6;
USB: 8;
Gpio: 8;
M.2: 3m.2(SSD/WiFi/4G/5g;
Power Supply: DC 9-36V;
OS: Win 10/11, Linux;
Integrated Graphics: Integrated Graphics;
Main Chipset: Intel;
Maximum Memory Capacity: 8G;
Structure: 3.5inch;
Memory: DDR4;
SATA Interface: SATA3.0;
CPU Socket: Socket BGA1356;
Printed Circuit Board: Six Layer;
Main Board Structure: Integrated;
Audio Effects: Not HiFi;
Integrated Graphics: Integrated Graphics;
Main Chipset: Intel;
Maximum Memory Capacity: 16G;
Structure: Mini-ITX;
Memory: DDR3;
SATA Interface: SATA3.0;
CPU Socket: Fcbga1356;
Printed Circuit Board: Six Layer;
Main Board Structure: Integrated;
Memory Channel: Double;
Graphics Card Type: Integrated-Need CPU Support;
Test Condition: 100% 24~72 Hours Burnin Test;
Fsb / Ht: 4 Gt/S;
Power Supply: DC12 or DC19V;
Multiple Display: Optioanl Single / Dual/ Triple;
Integrated Graphics: Integrated Graphics;
Main Chipset: Intel;
Maximum Memory Capacity: 16G;
Structure: Mini-ITX;
Memory: DDR3;
SATA Interface: SATA3.0;
CPU Socket: Fcbga1356;
Printed Circuit Board: Six Layer;
Main Board Structure: Integrated;
Memory Channel: Double;
Graphics Card Type: Integrated-Need CPU Support;
Test Condition: 100% 24~72 Hours Burnin Test;
Fsb / Ht: 4 Gt/S;
Power Supply: DC12 or DC19V;
Multiple Display: Optioanl Single / Dual/ Triple;
Integrated Graphics: Integrated Graphics;
Main Chipset: Intel;
Maximum Memory Capacity: 8G;
Structure: Mini-ITX;
Memory: DDR3;
SATA Interface: SATA3.0;
Printed Circuit Board: Six Layer;
Main Board Structure: Integrated;
Memory Channel: Double;
Graphics Card Type: Integrated-Need CPU Support;
Test Condition: 100% 24~72 Hours Burnin Test;
Supplier Name

Shenzhen Piesia Electronic Technology Co., Ltd.

China Supplier - Diamond Member Audited Supplier

Shenzhen Elsky Technology Co., Ltd.

China Supplier - Diamond Member Audited Supplier

Shenzhen Elsky Technology Co., Ltd.

China Supplier - Diamond Member Audited Supplier

Shenzhen Elsky Technology Co., Ltd.

China Supplier - Diamond Member Audited Supplier

Shenzhen Elsky Technology Co., Ltd.

China Supplier - Diamond Member Audited Supplier