PS Copper Base Thick Copper PCB Board for Power Supply Video

Name: PS Copper Base Thick Copper PCB Board for Power Supply
Uploaded: 2024-02-21T11:51:59+08:00
Description: PCB Parameters Item PCB Parameters Material FR4 (140Tg, 170Tg, 180Tg), FR-406, FR-408, 370HR, IT180A, Metal Core, Polyimide, Rogers 4350B/3003/4003C/5880, Taconic, Teflon, etc Material Brands KB, ITEQ

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Price

Purchase Qty. Reference FOB Price

1-99 Pieces US$5.00

100-999 Pieces US$1.00

1,000+ Pieces US$0.10

Sepcifications

Structure Multilayer Rigid PCB
Dielectric FR-4
Material Fr4 (140tg, 170tg, 180tg), Fr-406, Fr-408, 370hr
Flame Retardant Properties V0
Processing Technology Electrolytic Foil
Production Process Subtractive Process
Base Material Copper
Brand PS
Transport Package Box
Specification <1500mm
Trademark PS Electronics
Origin China
Quality Test Aoi, 100% E-Test
V- Cut Tolerance +-10mi
Bevel Edge +-5mil
Hole Location Tolerance +-2mil
Hole Diameter Tolerance +-0.05mm
Board Thickness Tolerance +-5%
Line Width/Space Tolerance +-10%

Product Description

PCB Parameters Item PCB Parameters Material FR4 (140Tg, 170Tg, 180Tg), FR-406, FR-408, 370HR, IT180A, Metal Core, Polyimide, Rogers 4350B/3003/4003C/5880, Taconic, Teflon, etc Material Brands KB, ITEQ, SY, ISOLA, Rogers (Arlon), Ventec, Laird, Nelco, Bergquist, DENKA, Panasonic, Taconic, or ...

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Ps Electronics Co., Ltd

Diamond Member Since 2023

Audited Supplier

Business Type Trading Company
Main Products PCB Design, PCB, PCB Assembly
Number of Employees 58
Year of Establishment 2018-05-10
Management System Certification ISO9001:2015, ISO14001:2015
Average Lead Time Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays

PCBA Comparison

	Quick View PS Copper Base Thick Copper PCB Board for Power Supply Contact Now	Quick View ISO9001, ISO16949, RoHS V0 King Field/OEM Customized PCB Boards Circuit Board Contact Now	Quick View Epoxy Resin King Field/OEM Vacuum Packaging Fr4 Copper Clad Laminate PCB Board Contact Now	Quick View Multilayer Rigid Fr-4 King Field/OEM Vacuum Packaging Aluminium PCB Board Contact Now	Quick View 1.5mil Copper King Field/OEM Vacuum Packaging 100*585 Circuit Board PCB Contact Now

Transaction Info
	Quick View PS Copper Base Thick Copper PCB Board for Power Supply Contact Now	Quick View ISO9001, ISO16949, RoHS V0 King Field/OEM Customized PCB Boards Circuit Board Contact Now	Quick View Epoxy Resin King Field/OEM Vacuum Packaging Fr4 Copper Clad Laminate PCB Board Contact Now	Quick View Multilayer Rigid Fr-4 King Field/OEM Vacuum Packaging Aluminium PCB Board Contact Now	Quick View 1.5mil Copper King Field/OEM Vacuum Packaging 100*585 Circuit Board PCB Contact Now
Price	US $ 0.10-5.00/ Piece	US $ 0.95-2.10/ Piece	US $ 0.95-2.10/ Piece	US $ 0.95-2.10/ Piece	US $ 0.95-2.10/ Piece
Min Order	1 Pieces	100 Pieces	100 Pieces	100 Pieces	100 Pieces
Trade Terms	-	-	-	-	-
Payment Terms	L/C, T/T, D/P, Western Union, Paypal, Money Gram	L/C, T/T, D/P, Western Union, Paypal	L/C, T/T, D/P, Western Union, Paypal	L/C, T/T, D/P, Western Union, Paypal	L/C, T/T, D/P, Western Union, Paypal
Quality Control
Product Certification	-	ISO9001, ISO16949, RoHS	ISO9001, ISO16949, RoHS	ISO9001, ISO16949, RoHS	ISO9001, ISO16949, RoHS
Management System Certification	-	ISO 9001, ISO 14001, IATF16949	ISO 9001, ISO 14001, IATF16949	ISO 9001, ISO 14001, IATF16949	ISO 9001, ISO 14001, IATF16949
Trade Capacity
Export Markets	North America, Europe, Southeast Asia/ Mideast	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
Annual Export Revenue	-	-	-	-	-
Business Model	-	OEM, ODM	OEM, ODM	OEM, ODM	OEM, ODM
Average Lead Time	-	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)
Product Attributes
Specification	Structure: Multilayer Rigid PCB; Dielectric: FR-4; Material: Fr4 (140tg, 170tg, 180tg), Fr-406, Fr-408, 370hr; Flame Retardant Properties: V0; Processing Technology: Electrolytic Foil; Production Process: Subtractive Process; Base Material: Copper; Brand: PS; Quality Test: Aoi, 100% E-Test; V- Cut Tolerance: +-10mi; Bevel Edge: +-5mil; Hole Location Tolerance: +-2mil; Hole Diameter Tolerance: +-0.05mm; Board Thickness Tolerance: +-5%; Line Width/Space Tolerance: +-10%;	Structure: Multilayer Rigid PCB; Dielectric: FR-4; Material: Epoxide Woven Glass Fabric Laminate; Application: Medical Instruments; Flame Retardant Properties: V0; Processing Technology: Electrolytic Foil; Production Process: Subtractive Process; Base Material: Copper; Insulation Materials: Epoxy Resin; Surface Treatment: OSP, Immersion Gold, Immersion Tin, Immersion AG; Impedance Control Accuracy: ±8%; Minimum Solder Resist Opening: 1.5mil;	Structure: Multilayer Rigid PCB; Dielectric: FR-4; Material: Epoxide Woven Glass Fabric Laminate; Application: Medical Instruments; Flame Retardant Properties: V0; Processing Technology: Electrolytic Foil; Production Process: Subtractive Process; Base Material: Copper; Insulation Materials: Epoxy Resin; Surface Treatment: OSP, Immersion Gold, Immersion Tin, Immersion AG; Impedance Control Accuracy: ±8%; Minimum Solder Resist Opening: 1.5mil;	Structure: Multilayer Rigid PCB; Dielectric: FR-4; Material: Epoxide Woven Glass Fabric Laminate; Application: Medical Instruments; Flame Retardant Properties: V0; Processing Technology: Electrolytic Foil; Production Process: Subtractive Process; Base Material: Copper; Insulation Materials: Epoxy Resin; Surface Treatment: OSP, Immersion Gold, Immersion Tin, Immersion AG; Impedance Control Accuracy: ±8%; Minimum Solder Resist Opening: 1.5mil;	Structure: Multilayer Rigid PCB; Dielectric: FR-4; Material: Epoxide Woven Glass Fabric Laminate; Application: Medical Instruments; Flame Retardant Properties: V0; Processing Technology: Electrolytic Foil; Production Process: Subtractive Process; Base Material: Copper; Insulation Materials: Epoxy Resin; Surface Treatment: OSP, Immersion Gold, Immersion Tin, Immersion AG; Impedance Control Accuracy: ±8%; Minimum Solder Resist Opening: 1.5mil;
Supplier Name	Ps Electronics Co., Ltd	King Field Electronic Co., Ltd. (Shenzhen)	King Field Electronic Co., Ltd. (Shenzhen)	King Field Electronic Co., Ltd. (Shenzhen)	King Field Electronic Co., Ltd. (Shenzhen)
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