Good Quality 1.0mm 18/00um 1030*1230mm Fr4 Ccl Copper Clad Board pictures & photos

Good Quality 1.0mm 18/00um 1030*1230mm Fr4 Ccl Copper Clad Board

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Price

Min. Order Reference FOB Price

50 Square Meters Negotiable

Sepcifications

Structure Multilayer Rigid PCB
Dielectric FR-4
Material PTFE
Application Consumer Electronics
Flame Retardant Properties V0
Processing Technology Delay Pressure Foil
Production Process Additive Process
Base Material Copper
Insulation Materials Metal Composite Materials
Transport Package Cardboard Box
Trademark SENRONG
Origin Zibo City
Size Customization
Tensile Strength Excellent

Product Description

Copper Clad Laminate, abbreviated to CCL, is a type of base material of PCBs. With glass fiber or wood pulp paper as reinforcing material, a CCL is a type of product through lamination with copper clad on either one side or both sides of reinforcing material after being soaked in resin. According ...

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Shandong Senrong New Materials Co., Ltd.

Diamond Member Since 2012

Audited Supplier

Business Type Manufacturer/Factory
Main Products PTFE Fiber, PTFE Rod, PTFE Tube, PTFE Plate, PTFE Membrane
Number of Employees 168
Year of Establishment 2006-06-22
Management System Certification ISO9001:2015, ISO14001:2015, ISO45001:2016
Average Lead Time Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays

Circuit Board Comparison

	Good Quality 1.0mm 18/00um 1030*1230mm Fr4 Ccl Copper Clad Board Contact Now	Quick View ISO9001, ISO16949, RoHS V0 King Field/OEM Vacuum Packaging Copper Sheet PCB Board Contact Now	Quick View Electrolytic Foil Subtractive Process King Field/OEM Al Base Ccl PCB Circuit Board Contact Now	Quick View ± 8% Subtractive Process King Field/OEM Vacuum Packaging CCTV PCB Circuit Board Contact Now	Quick View Electrolytic Foil Subtractive Process King Field/OEM Vacuum Packaging Ccl Sheet Aluminum PCB Board Contact Now

Transaction Info
	Good Quality 1.0mm 18/00um 1030*1230mm Fr4 Ccl Copper Clad Board Contact Now	Quick View ISO9001, ISO16949, RoHS V0 King Field/OEM Vacuum Packaging Copper Sheet PCB Board Contact Now	Quick View Electrolytic Foil Subtractive Process King Field/OEM Al Base Ccl PCB Circuit Board Contact Now	Quick View ± 8% Subtractive Process King Field/OEM Vacuum Packaging CCTV PCB Circuit Board Contact Now	Quick View Electrolytic Foil Subtractive Process King Field/OEM Vacuum Packaging Ccl Sheet Aluminum PCB Board Contact Now
Price	Negotiable	US $ 0.95-2.10/ Piece	US $ 0.95-2.10/ Piece	US $ 0.95-2.10/ Piece	US $ 0.95-2.10/ Piece
Min Order	50 Square Meters	100 Pieces	100 Pieces	100 Pieces	100 Pieces
Trade Terms	-	-	-	-	-
Payment Terms	L/C, T/T	L/C, T/T, D/P, Western Union, Paypal	L/C, T/T, D/P, Western Union, Paypal	L/C, T/T, D/P, Western Union, Paypal	L/C, T/T, D/P, Western Union, Paypal, WeChat/Alipay
Quality Control
Product Certification	-	ISO9001, ISO16949, RoHS	ISO9001, ISO16949, RoHS	ISO9001, ISO16949, RoHS	ISO9001, ISO16949, RoHS
Management System Certification	-	ISO 9001, ISO 14001, IATF16949	ISO 9001, ISO 14001, IATF16949	ISO 9001, ISO 14001, IATF16949	ISO 9001, ISO 14001, IATF16949
Trade Capacity
Export Markets	North America, South America, Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
Annual Export Revenue	> US $100 Million	-	-	-	-
Business Model	Own Brand	OEM, ODM	OEM, ODM	OEM, ODM	OEM, ODM
Average Lead Time	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)
Product Attributes
Specification	Structure: Multilayer Rigid PCB; Dielectric: FR-4; Material: PTFE; Application: Consumer Electronics; Flame Retardant Properties: V0; Processing Technology: Delay Pressure Foil; Production Process: Additive Process; Base Material: Copper; Insulation Materials: Metal Composite Materials; Size: Customization; Tensile Strength: Excellent;	Structure: Multilayer Rigid PCB; Dielectric: FR-4; Material: Epoxide Woven Glass Fabric Laminate; Application: Medical Instruments; Flame Retardant Properties: V0; Processing Technology: Electrolytic Foil; Production Process: Subtractive Process; Base Material: Copper; Insulation Materials: Epoxy Resin; Surface Treatment: OSP, Immersion Gold, Immersion Tin, Immersion AG; Impedance Control Accuracy: ±8%; Minimum Solder Resist Opening: 1.5mil;	Structure: Multilayer Rigid PCB; Dielectric: FR-4; Material: Epoxide Woven Glass Fabric Laminate; Application: Medical Instruments; Flame Retardant Properties: V0; Processing Technology: Electrolytic Foil; Production Process: Subtractive Process; Base Material: Copper; Insulation Materials: Epoxy Resin; Surface Treatment: OSP, Immersion Gold, Immersion Tin, Immersion AG; Impedance Control Accuracy: ±8%; Minimum Solder Resist Opening: 1.5mil;	Structure: Multilayer Rigid PCB; Dielectric: FR-4; Material: Epoxide Woven Glass Fabric Laminate; Application: Medical Instruments; Flame Retardant Properties: V0; Processing Technology: Electrolytic Foil; Production Process: Subtractive Process; Base Material: Copper; Insulation Materials: Epoxy Resin; Surface Treatment: OSP, Immersion Gold, Immersion Tin, Immersion AG; Impedance Control Accuracy: ±8%; Minimum Solder Resist Opening: 1.5mil;	Structure: Multilayer Rigid PCB; Dielectric: FR-4; Material: Epoxide Woven Glass Fabric Laminate; Application: Medical Instruments; Flame Retardant Properties: V0; Processing Technology: Electrolytic Foil; Production Process: Subtractive Process; Base Material: Copper; Insulation Materials: Epoxy Resin; Surface Treatment: OSP, Immersion Gold, Immersion Tin, Immersion AG; Impedance Control Accuracy: ±8%; Minimum Solder Resist Opening: 1.5mil;
Supplier Name	Shandong Senrong New Materials Co., Ltd.	King Field Electronic Co., Ltd. (Shenzhen)	King Field Electronic Co., Ltd. (Shenzhen)	King Field Electronic Co., Ltd. (Shenzhen)	King Field Electronic Co., Ltd. (Shenzhen)
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