Best Quality Xpc Fr4 Fr1 Cem1 Al Ccl Copper Clad Board Custom Size

About this Item
Details
Company Profile

Price

Min. Order Reference FOB Price

50 Square Meters Negotiable

Sepcifications

  • Structure Multilayer Rigid PCB
  • Dielectric FR-4
  • Material PTFE
  • Application Consumer Electronics
  • Flame Retardant Properties V0
  • Processing Technology Delay Pressure Foil
  • Production Process Additive Process
  • Base Material Copper
  • Insulation Materials Metal Composite Materials
  • Transport Package Cardboard Box
  • Trademark SENRONG
  • Origin Zibo City
  • Size Customization
  • Tensile Strength Excellent

Product Description

Copper Clad Laminate, abbreviated to CCL, is a type of base material of PCBs. With glass fiber or wood pulp paper as reinforcing material, a CCL is a type of product through lamination with copper clad on either one side or both sides of reinforcing material after being soaked in resin. According ...

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Circuit Board Comparison
Transaction Info
Price Negotiable Negotiable Negotiable Negotiable US $ 2.30-8.90/ Piece
Min Order 50 Square Meters 10 Pieces 10 Pieces 10 Pieces 100 Pieces
Trade Terms - - - - -
Payment Terms L/C, T/T L/C, T/T, D/P L/C, T/T, D/P L/C, T/T, D/P T/T, Western Union, Paypal
Quality Control
Management System Certification - ISO 9001 ISO 9001 ISO 9001 ISO 9001, ISO 9000, ISO 14001, ISO 14000, IATF16949, HSE
Trade Capacity
Export Markets North America, South America, Europe Domestic Domestic Domestic North America, Europe, Southeast Asia/ Mideast
Annual Export Revenue > US $100 Million - - - -
Business Model Own Brand OEM OEM OEM OEM, ODM
Average Lead Time Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Product Attributes
Specification
Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Material: PTFE;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Processing Technology: Delay Pressure Foil;
Production Process: Additive Process;
Base Material: Copper;
Insulation Materials: Metal Composite Materials;
Size: Customization;
Tensile Strength: Excellent;
Structure: Single-Sided Rigid PCB;
Base Material: Aluminum;
Brand: Dejia;
Structure: Single-Sided Rigid PCB;
Base Material: Aluminum;
Brand: Dejia;
Structure: Multilayer Rigid PCB;
Base Material: Aluminum;
Brand: Dejia;
Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Material: Epoxy Paper Laminate;
Application: Communication;
Flame Retardant Properties: V0;
Processing Technology: Enig;
Production Process: Additive Process;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Layer Count: up to 64;
Cu Thickness: up to 12oz;
Board Thickness: up to 8mm;
Min. Hole to Line: 8mil;
Surface Finish: Immersiong Gold;
Other: Counterbore Hole 8.5mm/Depth 2.35mm;
Supplier Name

Shandong Senrong New Materials Co., Ltd.

China Supplier - Diamond Member Audited Supplier

Zhejiang Dejia Electronics Technology Co.,Ltd.

China Supplier - Gold Member Audited Supplier

Zhejiang Dejia Electronics Technology Co.,Ltd.

China Supplier - Gold Member Audited Supplier

Zhejiang Dejia Electronics Technology Co.,Ltd.

China Supplier - Gold Member Audited Supplier

Shanghai Gawin Electronic Technology Co., Ltd.

China Supplier - Diamond Member Audited Supplier