Fine Quality Fr-4 Copper Clad Laminats, Cem-1, Fr-2 Copper Clad Laminats, Xpc, Flexible Ccl pictures & photos

Fine Quality Fr-4 Copper Clad Laminats, Cem-1, Fr-2 Copper Clad Laminats, Xpc, Flexible Ccl

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About this Item

Price

Min. Order Reference FOB Price

50 Square Meters Negotiable

Sepcifications

Structure Multilayer Rigid PCB
Dielectric FR-4
Material PTFE
Application Consumer Electronics
Flame Retardant Properties V0
Processing Technology Delay Pressure Foil
Production Process Additive Process
Base Material Copper
Insulation Materials Metal Composite Materials
Transport Package Cardboard Box
Trademark SENRONG
Origin Zibo City
Size Customization
Tensile Strength Excellent

Product Description

Copper Clad Laminate, abbreviated to CCL, is a type of base material of PCBs. With glass fiber or wood pulp paper as reinforcing material, a CCL is a type of product through lamination with copper clad on either one side or both sides of reinforcing material after being soaked in resin. According ...

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Shandong Senrong New Materials Co., Ltd.

Diamond Member Since 2012

Audited Supplier

Business Type Manufacturer/Factory
Main Products PTFE Fiber, PTFE Rod, PTFE Tube, PTFE Plate, PTFE Membrane
Number of Employees 168
Year of Establishment 2006-06-22
Management System Certification ISO9001:2015, ISO14001:2015, ISO45001:2016
Average Lead Time Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays

Ccl Board Comparison

	Fine Quality Fr-4 Copper Clad Laminats, Cem-1, Fr-2 Copper Clad Laminats, Xpc, Flexible Ccl Contact Now	Immersion Gold 1u"-3u" Printed Circuit Board PCB Manufacturing PCB Assembly Contact Now	Immersion Gold+OSP PCB, Heavy Gold PCB, HDI PCB, Electronics Motherboard PCB Manufacturing Contact Now	Enig Fr4 Multilayer Immersion Gold PCB OEM Factory, Electronic Component Sourcing SMT PCBA Contact Now	PCB Assembly Electronics Immersion Gold PCB Board, Hard Gold PCB Plating Gold Finger Manufacturing Contact Now

Transaction Info
	Fine Quality Fr-4 Copper Clad Laminats, Cem-1, Fr-2 Copper Clad Laminats, Xpc, Flexible Ccl Contact Now	Immersion Gold 1u"-3u" Printed Circuit Board PCB Manufacturing PCB Assembly Contact Now	Immersion Gold+OSP PCB, Heavy Gold PCB, HDI PCB, Electronics Motherboard PCB Manufacturing Contact Now	Enig Fr4 Multilayer Immersion Gold PCB OEM Factory, Electronic Component Sourcing SMT PCBA Contact Now	PCB Assembly Electronics Immersion Gold PCB Board, Hard Gold PCB Plating Gold Finger Manufacturing Contact Now
Price	Negotiable	US $ 0.1/ Piece	US $ 0.1/ Piece	US $ 0.1/ Piece	US $ 0.1/ Piece
Min Order	50 Square Meters	1 Pieces	1 Pieces	1 Pieces	1 Pieces
Trade Terms	-	-	-	-	-
Payment Terms	L/C, T/T	L/C, T/T, D/P, Western Union, Paypal, Money Gram	L/C, T/T, D/P, Western Union, Paypal, Money Gram	L/C, T/T, D/P, Western Union, Paypal, Money Gram	L/C, T/T, D/P, Western Union, Paypal, Money Gram
Quality Control
Management System Certification	-	ISO 9001	ISO 9001	ISO 9001	ISO 9001
Trade Capacity
Export Markets	North America, South America, Europe	North America, Europe, Southeast Asia/ Mideast, East Asia(Japan/ South Korea), Australia	North America, Europe, Southeast Asia/ Mideast, East Asia(Japan/ South Korea), Australia	North America, Europe, Southeast Asia/ Mideast, East Asia(Japan/ South Korea), Australia	North America, Europe, Southeast Asia/ Mideast, East Asia(Japan/ South Korea), Australia
Annual Export Revenue	> US $100 Million	-	-	-	-
Business Model	Own Brand	OEM	OEM	OEM	OEM
Average Lead Time	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)
Product Attributes
Specification	Structure: Multilayer Rigid PCB; Dielectric: FR-4; Material: PTFE; Application: Consumer Electronics; Flame Retardant Properties: V0; Processing Technology: Delay Pressure Foil; Production Process: Additive Process; Base Material: Copper; Insulation Materials: Metal Composite Materials; Size: Customization; Tensile Strength: Excellent;	Structure: Multilayer Rigid PCB; Dielectric: FR-4; Material: Phenolic Paper Laminate; Application: Aerospace; Flame Retardant Properties: V0; Processing Technology: Delay Pressure Foil; Production Process: Semi-Additive Process; Base Material: Copper; Insulation Materials: Epoxy Resin; Brand: Zitrok; Quality Assurance: UL, Aoi, RoHS, ISO9001, 100% E-Test; Material Stock: Fr4, Isola, Rogers, Ceramic, Arlon, Pi, Taconic;	Structure: Multilayer Rigid PCB; Dielectric: FR-4; Material: Phenolic Paper Laminate; Application: Aerospace; Flame Retardant Properties: V0; Processing Technology: Delay Pressure Foil; Production Process: Semi-Additive Process; Base Material: Copper; Insulation Materials: Epoxy Resin; Brand: Zitrok; Quality Assurance: UL, Aoi, RoHS, ISO9001, 100% E-Test; Material Stock: Fr4, Isola, Rogers, Ceramic, Arlon, Pi, Taconic;	Structure: Multilayer Rigid PCB; Dielectric: FR-4; Material: Phenolic Paper Laminate; Application: Aerospace; Flame Retardant Properties: V0; Processing Technology: Delay Pressure Foil; Production Process: Semi-Additive Process; Base Material: Copper; Insulation Materials: Epoxy Resin; Brand: Zitrok; Quality Assurance: UL, Aoi, RoHS, ISO9001, 100% E-Test; Material Stock: Fr4, Isola, Rogers, Ceramic, Arlon, Pi, Taconic;	Structure: Multilayer Rigid PCB; Dielectric: FR-4; Material: Phenolic Paper Laminate; Application: Aerospace; Flame Retardant Properties: V0; Processing Technology: Delay Pressure Foil; Production Process: Semi-Additive Process; Base Material: Copper; Insulation Materials: Epoxy Resin; Brand: Zitrok; Quality Assurance: UL, Aoi, RoHS, ISO9001, 100% E-Test; Material Stock: Fr4, Isola, Rogers, Ceramic, Arlon, Pi, Taconic;
Supplier Name	Shandong Senrong New Materials Co., Ltd.	Zitrok Electronics Co., Ltd.	Zitrok Electronics Co., Ltd.	Zitrok Electronics Co., Ltd.	Zitrok Electronics Co., Ltd.
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