Electrical Controller Glue

US$4.30-4.80 / kg

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High Quality High Volume Resistivity Polyurethane Potting Adhesive for Electronic Circuit Board Electronic and Electrical Controller IGBT Potting pictures & photos

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What is High Quality High Volume Resistivity Polyurethane Potting Adhesive for Electronic Circuit Board Electronic and Electrical Controller IGBT Potting

Name: High Quality High Volume Resistivity Polyurethane Potting Adhesive for Electronic Circuit Board Electronic and Electrical Controller IGBT Potting
Uploaded: 2023-04-14T10:49:22+08:00
Description: High quality High volume resistivity polyurethane potting adhesive Our products SP295 is a solvent-free, environment-friendly, and transparent two-component polyurethane electronic

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About this Item

Price

Purchase Qty. Reference FOB Price

1,000-2,999 kg US$4.80

3,000-4,999 kg US$4.60

5,000+ kg US$4.30

Sepcifications

CAS No. 9009-54-5
Formula CH3h8n2o
EINECS 210-898-8
Bonding Function Sealing and Waterproof
Morphology Paste
Application Electrical
Material Polyurethane
Classification Potting
Color Transparent
Transport Package Air, Sea, Road and Railway.
Specification 600ML
Trademark Sepna
Origin China
Shelf Life 6 Months
Usage Structural Bonding of New Energy Batteries
Advantage High Bond Strength and Sealing
OEM/ODM Free OEM&ODM Service
Mixture Ratio a:B=1:1
Insulation Strength /Kv/mm 16
Tensile Strength More Than 0.54 MPa

Product Description

High quality High volume resistivity polyurethane potting adhesive Our products SP295 is a solvent-free, environment-friendly, and transparent two-component polyurethane electronic potting adhesive, which has the characteristics of low hardness, good elasticity, excellent waterproof performance ...

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Shanghai Sepna Chemical Technology Co., Ltd.

Diamond Member Since 2014

Audited Supplier

Main Products Polyurethane Adhesive, Polyurethane Sealant, PU Sealant, Epoxy Adhesive, Sealant, Ms Sealant, Adhesive, Potting, Waterproof Coating, Joint Sealant
Management System Certification ISO 9001, ISO 9000, ISO 14001, ISO 14000, OHSAS/ OHSMS 18001, IATF16949, HSE, ISO 14064, QC 080000, GMP, BSCI, BRC, SA 8000, QHSE, HACCP, BS 25999-2, SEDEX, ISO 22000, AIB, WRAP, GAP, IFS, PAS 28000
Export Year 2011-02-02
OEM/ODM Availability Yes

Electrical Controller Glue Comparison

	Quick View High Quality High Volume Resistivity Polyurethane Potting Adhesive for Electronic Circuit Board Electronic and Electrical Controller IGBT Potting Contact Now	Quick View PA Glue Shoe Counter Adhesive Glue Hot Melt for Shoe Making Adhesive Lamination Contact Now	Quick View Pressure Sensititve Adhesives Glue Hotmelt for Mattress Foam Fabric Bonding Contact Now	Quick View Glue Adhesive Hot Melt Nonwoven Fabric Foam Mattress Contact Now	Quick View Stone Surface Epoxy Adhesive for Fissures or Crack Filling and Uneven Patches Repairing Glue Adhesive Contact Now

Transaction Info
	Quick View High Quality High Volume Resistivity Polyurethane Potting Adhesive for Electronic Circuit Board Electronic and Electrical Controller IGBT Potting Contact Now	Quick View PA Glue Shoe Counter Adhesive Glue Hot Melt for Shoe Making Adhesive Lamination Contact Now	Quick View Pressure Sensititve Adhesives Glue Hotmelt for Mattress Foam Fabric Bonding Contact Now	Quick View Glue Adhesive Hot Melt Nonwoven Fabric Foam Mattress Contact Now	Quick View Stone Surface Epoxy Adhesive for Fissures or Crack Filling and Uneven Patches Repairing Glue Adhesive Contact Now
Price	US $ 4.30-4.80/ kg	US $ 1.50-4.00/ kg	US $ 1.50-2.80/ kg	US $ 1.50-2.80/ kg	US $ 4.50-5.00/ kg
Min Order	1000 kg	500 kg	500 kg	500 kg	100 kg
Trade Terms	-	-	-	-	-
Payment Terms	L/C, T/T, Paypal	L/C, T/T, Western Union, Paypal, Money Gram	L/C, T/T, Western Union, Paypal, Money Gram	L/C, T/T, Western Union, Paypal, Money Gram	L/C, T/T, D/P, Western Union, Paypal, Money Gram
Quality Control
Management System Certification	ISO 9001, ISO 9000, ISO 14001, ISO 14000, OHSAS/ OHSMS 18001, IATF16949, HSE, ISO 14064, QC 080000, GMP, BSCI, BRC, SA 8000, QHSE, HACCP, BS 25999-2, SEDEX, ISO 22000, AIB, WRAP, GAP, IFS, PAS 28000	ISO 9001, ISO 14001, HSE	ISO 9001, ISO 14001, HSE	ISO 9001, ISO 14001, HSE	ISO 9000, ISO 14001
Trade Capacity
Export Markets	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
Annual Export Revenue	-	-	-	-	-
Business Model	OEM, ODM, Own Brand	OEM, ODM	OEM, ODM	OEM, ODM	OEM, ODM, Own Brand
Average Lead Time	-	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)	Off-season: within 15 Day(s) Peak-season: 1 Month(s)
Product Attributes
Specification	CAS No.: 9009-54-5; Formula: CH3h8n2o; EINECS: 210-898-8; Bonding Function: Sealing and Waterproof; Morphology: Paste; Application: Electrical; Material: Polyurethane; Classification: Potting; Color: Transparent; Shelf Life: 6 Months; Usage: Structural Bonding of New Energy Batteries; Advantage: High Bond Strength and Sealing; OEM/ODM: Free OEM&ODM Service; Mixture Ratio: a:B=1:1; Insulation Strength /Kv/mm: 16; Tensile Strength: More Than 0.54 MPa;	CAS No.: 9003-55-8; Formula: C12h14; EINECS: 618-370-2; Bonding Function: Shoes Making; Morphology: Granule; Application: Shoes Making; Material: Thermoplastic Elastomer; Classification: Pressure-Sensitive; Main Agent Composition: Thermoplastic Elastomer; Characteristic: Weatherability; Promoter Composition: Antioxidant; Composition: Organic Material; Color: Clear; Soften Point: 85; Viscosity: 3200cps; Odor: Odorless; Toxicity: No; Shape: Granule Chip; Other Name: Polyamide; Key Words: Shoes Glue;	CAS No.: 9003-55-8; Formula: C12h14; EINECS: 618-370-2; Bonding Function: Fabric Bonding; Morphology: Block; Application: Mattress Pocket Spring; Material: Thermoplastic Elastomer; Classification: Pressure-Sensitive; Main Agent Composition: Thermoplastic Elastomer; Characteristic: Weatherability; Promoter Composition: Antioxidant; Composition: Organic Material; Color: Clear; Soften Point: 85; Viscosity: 3200cps; Odor: Odorless; Toxicity: No; Shape: Granule Chip; Other Name: Pocket Spring Glue and Foam Lamination; Key Words: Used for Mattress Pocket Spring and Form Fabric;	CAS No.: 9003-55-8; Formula: C12h14; EINECS: 618-370-2; Bonding Function: Pocket Spring, Nonwoven; Morphology: Chip; Application: Mattress Pocket Spring; Material: Thermoplastic Elastomer; Classification: Pressure-Sensitive; Main Agent Composition: Thermoplastic Elastomer; Characteristic: Weatherability; Promoter Composition: Antioxidant; Composition: Organic Material; Color: Clear; Soften Point: 85; Viscosity: 3200cps; Odor: Odorless; Toxicity: No; Shape: Granule Chip; Other Name: Pocket Spring Glue; Key Words: Used for Mattress Pocket Spring and Form Fabric;	Bonding Function: Structural Adhesive; Morphology: Epoxy Adhesive; Application: Construction, Woodworking, Footwear & Leather, Fiber & Garment, Packing; Material: Epoxy; Classification: Room Curing; Main Agent Composition: Epoxy Resin; Characteristic: Waterproof; Promoter Composition: Curing Agent; Composition: Inorganic Material; Color: Clear;
Supplier Name	Shanghai Sepna Chemical Technology Co., Ltd.	XIAMEN INSPRING TECHNOLOGY CO., LTD	XIAMEN INSPRING TECHNOLOGY CO., LTD	XIAMEN INSPRING TECHNOLOGY CO., LTD	Hunan Magpow Adhesive Group Co., Ltd.
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