Specification |
Material: Diamond;
Abrasive: Normal Abrasive;
Shapes: Round;
Types: Surface Grinding Wheel;
Grain Size: 16-400#;
Cylindricity: <1;
Circular Degree: <1;
Technics: Sinter;
Working Style: Surface Grinding;
Segment Size: 10mm;
Grit: 30-50-100-200-400#;
Bond: Soft,Hard,Medium Bond;
Segment Type: Two Arrow Shaped Segments;
Application Machine: HTC, Cps, Prep/Master, Levetec etc Grinders Plate;
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Material: Diamond;
Abrasive: Superabrasive;
Shapes: Round;
Types: Surface Grinding Wheel;
Grain Size: 30#, 50#, 100#, 200#, 400#, 800#, 1500#, 3000#;
OEM: Available;
Usage: Concrete, Granite, Marble, Stone;
Use Type: Cutting, Drilling, Polishing of Stone, Concrete;
Kind: Circular Polishing Pad;
Feature: Concrete Polishing;
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Material: Diamond;
Abrasive: Superabrasive;
Shapes: Round;
Types: Surface Grinding Wheel;
Grain Size: 30#, 50#, 100#, 200#, 400#, 800#, 1500#, 3000#, Buff;
OEM: Available;
Usage: Granite, Marble, Stone;
Use Type: Cutting, Drilling, Polishing of Stone, Concrete;
Kind: Circular Polishing Pad;
|
Material: Diamond;
Abrasive: Superabrasive;
Shapes: Round;
Types: Surface Grinding Wheel;
Grain Size: 30#, 50#, 100#, 200#, 400#, 800#, 1500#, 3000#, Buff;
OEM: Available;
Usage: Granite, Marble, Stone;
Use Type: Cutting, Drilling, Polishing of Stone, Concrete;
Kind: Circular Polishing Pad;
|
Material: Diamond;
Abrasive: Superabrasive;
Shapes: Round;
Types: Surface Grinding Wheel;
Grain Size: 30#, 50#, 100#, 200#, 400#, 800#, 1500#, 3000#, Buff;
OEM: Available;
Usage: Concrete, Granite, Marble, Stone;
Use Type: Cutting, Drilling, Polishing of Stone, Concrete;
Kind: Circular Polishing Pad;
Feature: Floor Polishing;
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