Specification |
Metal Coating: Copper;
Mode of Production: SMT;
Layers: Single-Layer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Model Number: Hw-M09 Microwave Module;
Sensor Object: Microwave Induction Moving Object;
Supply Voltage: DC 12V (6-24V);
Operating Current: <5mA;
Level of Output: High-5V/Low-0V;
Trigger Way: Repeat(Default);
Delay Time: Default 2 S (3-200 S Adjustable);
Blocking Time: Blocking Time;
Size: 22*23*6mm;
Distance: 5-30m;
Angle: 180*360;
Working Temp: -20-+80;
Transmission Power: <0.2MW;
Load Power: 1.by Adding Relay as a Trigger Signal. 2.Maximum P;
Install Way: Hanging Install, Such as Install;
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Metal Coating: Gold;
Mode of Production: SMT+DIP;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Certificate: ISO9001, ISO14001, IATF 16949, Ipc-a-610g, RoHS;
PCB Material: Fr-4, Cem-1, Cem-3, Hight Tg, Fr4 Halogen Free;
PCB Shape: Rectangular, Round, Slots, Cutouts, Complex;
Solder Mask: Green/Black/White/Red/Blue/Yellow/Purple..etc;
Board Thickness: 0.2mm-8mm;
Copper Thickness: 18um-3500um(0.5- 100oz);
Service: PCB/Componentssourcing/Assembly/Test/Package;
PCBA QA: Full Test Include Aoi, in-Circuit Test (Ict);
Layer: 1-36 Layers;
Max. PCB Size: 1900mm*600mm;
Profiling Punching: Routing, V-Cut, Beveling;
Surface Finishing: HASL/HASL Lead Free, Chemical Tin, Chemical Gold;
PCB Type: Rigid PCB, HDI PCB, Flexible PCB, Rigid-Flexible;
Test: X-ray, Aoi, in-Circuit Test (Ict), Functional Test;
PCBA Packaging: ESD Packaging, Shockproof Packaging, Anti-Drop;
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Metal Coating: Tin;
Mode of Production: SMT;
Layers: Single-Layer;
Customized: Customized;
Condition: New;
Color: Grey;
Package: 500g/Bottle;
Melting Point: 138ºC;
Sample: Sn42bi58-100g;
Welding Method: Manual Welding, Automatic Soldering;
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Metal Coating: Gold;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Production Time: Within 4 Weeks;
Copper Thickness: 1-4oz;
Keywords: Multilayer Electronic Circuit Board;
Certificate: ISO 13485;
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Metal Coating: Gold;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: Used;
Mulitalyer: PCBA;
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