Wafer Thinner

US$20,000.00-60,000.00 / Piece

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High Speed Thinning Equipment for Silicon Wafers, Ceramic Wafers, Quartz Crystals and Other Materials pictures & photos

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What is High Speed Thinning Equipment for Silicon Wafers, Ceramic Wafers, Quartz Crystals and Other Materials

Name: High Speed Thinning Equipment for Silicon Wafers, Ceramic Wafers, Quartz Crystals and Other Materials
Uploaded: 2023-11-30T19:00:27+08:00
Description: Why Ponda? Ponda has profound experience of lapping, polishing and thinning. We heretofore supplied more than 60, 000 lapping process solutions and appliances over the industries of machinery, electro

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About this Item

Price

Min. Order Reference FOB Price

1 Piece US$20,000.00-60,000.00 / Piece

Sepcifications

After-sales Service 12months
Warranty 12months
Type Surface Grinding Machine, Surface Grinding Machine
Processing Object Flat Workpieces
Abrasives Grinding Wheel
Controlling Mode PLC
Automatic Grade Semiautomatic
Cylindrical Grinder Type Surface Grinding Machine
Precision High Precision
Certification ISO 9001
Condition New
Transport Package Wood Crate
Trademark PONDA
Origin China
Power Source Electricity
Disc(Wheel) Type Grinding Disc
Variable Speed with Variable Speed
Object Sapphire Substrate, Silicon Wafer, Ceramic Wafer
Application Grinding Industry
Material Hard Brittle Materials of Nonmetals and Metals
Disc Diameter 320mm
Service Oversea Setup & After-Sale Avalaible
Class Thinner
Process Station 1
Abrasive Recyclable Water & Grinding Wheel
Wheel Rotate Speed 0-3000 Rpm
Workpiece Accuracy Control(Parallelism) 1um
Power of Grinding Wheel Motor 5.5kw

Product Description

Why Ponda? Ponda has profound experience of lapping, polishing and thinning. We heretofore supplied more than 60, 000 lapping process solutions and appliances over the industries of machinery, electronic, aerospace, aviation, automotive, atomic energy, optics; the substances of metal, SiC wafer, ...

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Shenzhen Ponda Grinding Technology Co.,Ltd.

Diamond Member Since 2021

Audited Supplier

Business Type Manufacturer/Factory & Trading Company
Main Products Lapping Machine, Polishing Machine, Grinding Machine,Wafer Grinder, Single Plate Lapping and Polishing Machine, Double Plate Lapping and Polishing Machine, Lapping and CMP Systm, Abrasive Tools and Consumables
Registered Capital 1.48 Million USD
Plant Area 11500 square meters
Main Markets North America, Europe, Southeast Asia/ Mideast, East Asia(Japan/ South Korea), Australia, Domestic
Average Lead Time Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays

Wafer Thinner Comparison

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Transaction Info
	Quick View High Speed Thinning Equipment for Silicon Wafers, Ceramic Wafers, Quartz Crystals and Other Materials Contact Now	Fully Automatic Inner Ring Rib Grinder Contact Now	Fully Automatic Outer Ring Rib Grinder Machine/Grinding Machine/CNC Machine Contact Now	Quick View 400L Horizontal Nanomaterial Energy Saving and Pollution-Free Sandmill Contact Now	Antishicnc M7150ax1000 Surface Grinding Machine Precision Surface Grinding Machine M7150 Surface Grinding Metal Grinder China Contact Now
Price	US $ 20,000.00-60,000.00/ Piece	US $ 20,000.00-80,000.00/ Piece	US $ 40,000.00-130,000.00/ Piece	US $ 220,000.00-250,000.00/ Set	US $ 25,620.00-28,620.00/ sets
Min Order	1 Pieces	1 Pieces	1 Pieces	1 Sets	1 sets
Trade Terms	-	-	-	-	-
Payment Terms	L/C, T/T, Western Union, Paypal	T/T	T/T	T/T	L/C, T/T, Western Union
Quality Control
Product Certification	ISO 9001	ISO 9001	ISO 9001	-	CE, ISO 9001
Management System Certification	-	ISO 9001	ISO 9001	ISO 9001	ISO 9001, ISO 14001
Trade Capacity
Export Markets	North America, Europe, Southeast Asia/ Mideast, East Asia(Japan/ South Korea), Australia, Domestic	North America, South America, Eastern Europe, Africa, Mid East, Western Europe	North America, South America, Eastern Europe, Africa, Mid East, Western Europe	Domestic	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
Annual Export Revenue	-	-	-	-	-
Business Model	Own Brand	OEM, ODM, Own Brand	OEM, ODM, Own Brand	OEM, ODM	OEM, ODM, Own Brand
Average Lead Time	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)	Off-season: 1-3 Month(s) Peak-season: 1-3 Month(s)	Off-season: 1-3 Month(s) Peak-season: 1-3 Month(s)	-	Off-season: within 15 Day(s) Peak-season: 1-3 Month(s)
Product Attributes
Specification	After-sales Service: 12months; Warranty: 12months; Type: Surface Grinding Machine, Surface Grinding Machine; Processing Object: Flat Workpieces; Abrasives: Grinding Wheel; Controlling Mode: PLC; Automatic Grade: Semiautomatic; Cylindrical Grinder Type: Surface Grinding Machine; Precision: High Precision; Condition: New; Power Source: Electricity; Disc(Wheel) Type: Grinding Disc; Variable Speed: with Variable Speed; Object: Sapphire Substrate, Silicon Wafer, Ceramic Wafer; Application: Grinding Industry; Material: Hard Brittle Materials of Nonmetals and Metals; Disc Diameter: 320mm; Service: Oversea Setup & After-Sale Avalaible; Class: Thinner; Process Station: 1; Abrasive: Recyclable Water & Grinding Wheel; Wheel Rotate Speed: 0-3000 Rpm; Workpiece Accuracy Control(Parallelism): 1um; Power of Grinding Wheel Motor: 5.5kw;	After-sales Service: Technical Support/Spare Parts Service/Maintenance; Warranty: 1 Year; Type: Internal Grinding Machine; Processing Object: Bearing; Abrasives: Grinding Wheel; Controlling Mode: CNC; Automatic Grade: Automatic; Cylindrical Grinder Type: Bearing Inner Diameter Grinder; Precision: High Precision; Condition: New; Total Power: 15-20 Kw; Lathe Bed: Ht300 Casting(Normalizing and Tempering); Control System: Siemens/Japan Sodick; Processing Rhythm: Germany Heidenhain;	After-sales Service: Technical Support/Spare Parts Service/Maintenance; Warranty: 1 Year; Type: External Grinding Machine; Processing Object: Bearing; Abrasives: Grinding Wheel; Controlling Mode: CNC; Automatic Grade: Automatic; Cylindrical Grinder Type: Bearing Outer Diameter Grinder; Precision: High Precision; Condition: New; Total Power: 20-60 Kw; Lathe Bed: Ht300 Casting(Normalizing and Tempering); Control System: Yingzoom; Processing Rhythm: Shawe/Heidenhain;	After-sales Service: Good After-Sales Service; Warranty: 1 Year; Type: Multi-Use Grinding Machine; Processing Object: Carbon Nanotubes, Lithium Iron Phosphate,Alumina; Controlling Mode: Electric Control System; Automatic Grade: Semiautomatic; Precision: High Precision; Condition: New; Function: Wet Grinding/ Milling; Dynamic System: Energy-Saving Motor; Mode of Operation: Smart Large Screen; Fineness of Grinding: 100 - 1500 Nm; Solvent System: Water-Based/Oil-Based; Zirconia Bead: 0.1-2.0 mm; Motor Power: 315-Kw; Grinding Volume: 400L; Minimum Production Lot: 800 L; Cooling Water Consumption: 20-25 M³/H; Dispersion Shaft Speed: 0-400 R/Min; Weight: 7000 Kg;	After-sales Service: Yes; Warranty: 1 Year; Type: Surface Grinding Machine; Processing Object: Metal Parts; Abrasives: Grinding Wheel; Controlling Mode: Artificial; Automatic Grade: Manual; Cylindrical Grinder Type: Surface Grinding Machine; Precision: High Precision; Condition: New; Table Travel (Y) (mm): 500; Weight (Kg): 8500; T-Slot of Table(No.Width): 322mm; Table Size(mm): 1000500/1600500/2200500;* Surface Roughness(Um): 0.63 Um; Dimension(LWH): 680228252cm; Spindle Speed(Step-Less): 1440 R/Min; Distance From Spindle Center to Table: 700mm; Grinding Length(mm): 2200; Wheel Size(OdWidthID): 40040127mm; Max.Grinding Size of Work Piece(LW): 1000500/1600500/2200500mm; Table Size(LW): 1000500/1600500/2200500mm; Table Travel (X) (mm): 2200; Power (Kw): 12.25; Wheel Size(mm): 400;
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