Price Concessions Professional High-Precision Single-Sided Silicon Wafer Grinding and Polishing Equipment Video

Name: Price Concessions Professional High-Precision Single-Sided Silicon Wafer Grinding and Polishing Equipment
Uploaded: 2024-03-08T17:42:26+08:00
Description: Why Ponda? Ponda has profound experience of lapping, polishing and thinning. We heretofore supplied more than 60, 000 lapping process solutions and appliances over the industries of machinery, electro

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About this Item

Price

Min. Order Reference FOB Price

1 Piece US$8,000.00-20,000.00 / Piece

Sepcifications

After-sales Service 12months
Warranty 12months
Type Surface Grinding Machine
Processing Object Flat Workpieces
Abrasives Grinding Wheel
Controlling Mode PLC
Automatic Grade Semiautomatic
Cylindrical Grinder Type Surface Grinding Machine
Precision High Precision
Certification ISO 9001
Condition New
Transport Package Wood Crate
Trademark PONDA
Origin China
Power Source Electricity
Disc(Wheel) Type Grinding Disc
Variable Speed with Variable Speed
Material Metal and Non-Metal
Service Oversea Setup & After-Sale Avalaible
Class Single Plate
Process Station 3
Pressure Source Pneumatic or Weight Block
Abrasive Slurry

Product Description

Why Ponda? Ponda has profound experience of lapping, polishing and thinning. We heretofore supplied more than 60, 000 lapping process solutions and appliances over the industries of machinery, electronic, aerospace, aviation, automotive, atomic energy, optics; the substances of metal, SiC wafer, ...

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Shenzhen Ponda Grinding Technology Co.,Ltd.

Diamond Member Since 2021

Audited Supplier

Business Type Manufacturer/Factory & Trading Company
Main Products Lapping Machine, Polishing Machine, Grinding Machine,Wafer Grinder, Single Plate Lapping and Polishing Machine, Double Plate Lapping and Polishing Machine, Lapping and CMP Systm, Abrasive Tools and Consumables
Registered Capital 1.48 Million USD
Plant Area 11500 square meters
Main Markets North America, Europe, Southeast Asia/ Mideast, East Asia(Japan/ South Korea), Australia, Domestic
Average Lead Time Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays

Silicon Wafer Grinding and Polishing Comparison

	Quick View Price Concessions Professional High-Precision Single-Sided Silicon Wafer Grinding and Polishing Equipment Contact Now	Quick View Universal Multi-Purpose Tool Grinding Machine (2M9120A) Contact Now	Quick View Hydraulic Automatic Feeding Saddle Moving Surface Grinder (SGA3063) Contact Now	Quick View My1224 China Surface Grinding Machine Manufacturer Contact Now	Quick View Sg60160ahd High Precision Surface Grinding Machine Contact Now

Transaction Info
	Quick View Price Concessions Professional High-Precision Single-Sided Silicon Wafer Grinding and Polishing Equipment Contact Now	Quick View Universal Multi-Purpose Tool Grinding Machine (2M9120A) Contact Now	Quick View Hydraulic Automatic Feeding Saddle Moving Surface Grinder (SGA3063) Contact Now	Quick View My1224 China Surface Grinding Machine Manufacturer Contact Now	Quick View Sg60160ahd High Precision Surface Grinding Machine Contact Now
Price	US $ 8,000.00-20,000.00/ Piece	US $ 6,000.00-14,000.00/ Piece	US $ 5,100.00-15,100.00/ Piece	US $ 1/ Piece	US $ 1/ Piece
Min Order	1 Pieces	1 Pieces	1 Pieces	1 Pieces	1 Pieces
Trade Terms	-	-	-	-	-
Payment Terms	L/C, T/T, Western Union, Paypal	L/C, T/T, D/P, Western Union, Paypal, Money Gram	L/C, T/T, D/P, Western Union, Paypal, Money Gram	L/C, T/T, D/P	L/C, T/T, D/P
Quality Control
Product Certification	ISO 9001	GS, CE, RoHS, ISO 9001	GS, CE, RoHS, ISO 9001	CE, ISO 9001	CE, ISO 9001
Management System Certification	-	ISO 9001	ISO 9001	ISO 9001	ISO 9001
Trade Capacity
Export Markets	North America, Europe, Southeast Asia/ Mideast, East Asia(Japan/ South Korea), Australia, Domestic	North America, Southeast Asia/ Mideast	North America, Southeast Asia/ Mideast	North America, Southeast Asia/ Mideast	North America, Southeast Asia/ Mideast
Annual Export Revenue	-	-	-	-	-
Business Model	Own Brand	Own Brand	Own Brand	Own Brand	Own Brand
Average Lead Time	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)	Off-season: 1 Month(s) Peak-season: 1-3 Month(s)	Off-season: 1 Month(s) Peak-season: 1-3 Month(s)	Off-season: 1 Month(s) Peak-season: 1-3 Month(s)	Off-season: 1 Month(s) Peak-season: 1-3 Month(s)
Product Attributes
Specification	After-sales Service: 12months; Warranty: 12months; Type: Surface Grinding Machine; Processing Object: Flat Workpieces; Abrasives: Grinding Wheel; Controlling Mode: PLC; Automatic Grade: Semiautomatic; Cylindrical Grinder Type: Surface Grinding Machine; Precision: High Precision; Condition: New; Power Source: Electricity; Disc(Wheel) Type: Grinding Disc; Variable Speed: with Variable Speed; Material: Metal and Non-Metal; Service: Oversea Setup & After-Sale Avalaible; Class: Single Plate; Process Station: 3; Pressure Source: Pneumatic or Weight Block; Abrasive: Slurry;	Type: Tool Grinding Machine; Processing Object: Tools; Abrasives: Grinding Wheel; Controlling Mode: Artificial; Automatic Grade: Semiautomatic; Cylindrical Grinder Type: Tool Grinding Machine; Precision: High Precision; Condition: New; Name: Universal Multi-Purpose Tool Grinding Machine; Grinding Diameter: 200mm; Workpiece Length (Max.): 500mm; Workpiece Weight (Max.): 10 Kg; Grinding Length: 200mm; Tool Grinding Measure: 200X500mm; Table Swivel Range (Max.): +45 Degree/-30 Degree; Machine Drive Capacity: 2.525kw; Motor Rating Main Drive: 1.1kw; Grinding Wheels Dimensions: 200X20X75mm;	Type: Surface Grinding Machine; Processing Object: Crank Shaft; Abrasives: Grinding Wheel; Controlling Mode: Artificial; Automatic Grade: Semiautomatic; Cylindrical Grinder Type: Surface Grinding Machine; Precision: High Precision; Condition: New; Name: Hydraulic Automatic Surface Grinding Machine; Model: Sga3063; Table Size: 305X635mm; Max Longitudinal Travel: 765mm; Max Cross Travel: 340mm; Electro Magnetic Chuck Size: 300X600mm; Grinding Wheel Size: 350X40X127mm; Spindle Motor: 5.5kw; Hydraulic Motor: 2.2kw; Cooling Pump Motor: 0.125kw;	Type: Surface Grinding Machine; Processing Object: Flat Surface; Abrasives: Whetstone; Controlling Mode: Artificial; Automatic Grade: Semiautomatic; Cylindrical Grinder Type: Surface Grinding; Precision: High Precision; Condition: New; China Surface Grinding Machine Manufactu: My1224; Table Size: 600X300mm; Table Travel: 630X320mm; Max. Distance From Spindle to Table: 530mm; Table Slide Way: Double V Type; Wheel Size: 250X25X76.2 mm; Main Motor: 2.2kw; Max. Capacity of Fluete: 20; Fuel Tank Size: 80; Color: Customerized;	Type: Surface Grinding Machine; Processing Object: Flat Surface; Abrasives: Whetstone; Controlling Mode: Artificial; Automatic Grade: Semiautomatic; Cylindrical Grinder Type: Surface Grinding; Precision: High Precision; Condition: New; China Surface Grinding Machine Manufactu: Sg60160SD; Table Size: 610X1600; Table Travel: 610X1600; Max. Distance From Table to Spindle Cent: 820mm; Magnetic Chuck Size: 600X800X2mm; Wheel Size: 500X75X305mm; Main Motor: 28.5kw; Height of Machine: 2700mm; Max. Loading Weight: 1230 mm; Color: Customerized;
Supplier Name	Shenzhen Ponda Grinding Technology Co.,Ltd.	Tengzhou Uni-Tech Co., Ltd.	Tengzhou Uni-Tech Co., Ltd.	Tengzhou Uni-Tech Co., Ltd.	Tengzhou Uni-Tech Co., Ltd.
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