Wafer Thinning Ceramic Silicon Carbide Precision Thinning Machine pictures & photos

Wafer Thinning Ceramic Silicon Carbide Precision Thinning Machine

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Price

Min. Order Reference FOB Price

1 Piece US$20,000.00-60,000.00 / Piece

Sepcifications

After-sales Service 12months
Warranty 12months
Type Surface Grinding Machine
Processing Object Flat Workpieces
Abrasives Grinding Wheel
Controlling Mode PLC
Automatic Grade Semiautomatic
Cylindrical Grinder Type Surface Grinding Machine
Precision High Precision
Certification ISO 9001
Condition New
Transport Package Wood Crate
Trademark PONDA
Origin China
Power Source Electricity
Disc(Wheel) Type Grinding Disc
Variable Speed with Variable Speed
Application Semiconductor Industry
Disc Diameter 220mm
Service Oversea Setup & After-Sale Avalaible
Class Thinner
Process Station 1
Abrasive Recyclable Water & Grinding Wheel
Wheel Rotate Speed 0-3000 Rpm
Workpiece Accuracy Control(Parallelism) 1um
Power of Grinding Wheel Motor 5.5kw

Product Description

Why Ponda? Ponda has profound experience of lapping, polishing and thinning. We heretofore supplied more than 60, 000 lapping process solutions and appliances over the industries of machinery, electronic, aerospace, aviation, automotive, atomic energy, optics; the substances of metal, SiC wafer, ...

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Shenzhen Ponda Grinding Technology Co.,Ltd.

Diamond Member Since 2021

Audited Supplier

Business Type Manufacturer/Factory & Trading Company
Main Products Lapping Machine, Polishing Machine, Grinding Machine,Wafer Grinder, Single Plate Lapping and Polishing Machine, Double Plate Lapping and Polishing Machine, Lapping and CMP Systm, Abrasive Tools and Consumables
Registered Capital 1.48 Million USD
Plant Area 11500 square meters
Main Markets North America, Europe, Southeast Asia/ Mideast, East Asia(Japan/ South Korea), Australia, Domestic
Average Lead Time Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays

Reducing Machine Comparison

	Wafer Thinning Ceramic Silicon Carbide Precision Thinning Machine Contact Now	Quick View Large Conventional Cylindrical Grinding Grinder Machine M1363X3000 Contact Now	Quick View Large Conventional Cylindrical Grinding Grinder Machine M1363X4000 Contact Now	Quick View Coventional Large Cylindrical Grinding Grinder Machine M1363X5000 Contact Now	Cylinder Block Surface Grinding Milling Machine 3m9735b130/3m9735b150 Contact Now

Transaction Info
	Wafer Thinning Ceramic Silicon Carbide Precision Thinning Machine Contact Now	Quick View Large Conventional Cylindrical Grinding Grinder Machine M1363X3000 Contact Now	Quick View Large Conventional Cylindrical Grinding Grinder Machine M1363X4000 Contact Now	Quick View Coventional Large Cylindrical Grinding Grinder Machine M1363X5000 Contact Now	Cylinder Block Surface Grinding Milling Machine 3m9735b130/3m9735b150 Contact Now
Price	US $ 20,000.00-60,000.00/ Piece	US $ 50,000.00-70,000.00/ set	US $ 50,000.00-70,000.00/ set	US $ 50,000.00-70,000.00/ set	US $ 9,300.00-10,000.00/ Piece
Min Order	1 Pieces	1 set	1 set	1 set	1 Pieces
Trade Terms	-	-	-	-	-
Payment Terms	L/C, T/T, Western Union, Paypal	T/T	T/T	T/T	L/C, T/T, Money Gram
Quality Control
Product Certification	ISO 9001	CE, ISO 9001	CE, ISO 9001	CE, ISO 9001	CE, RoHS, ISO 9001
Management System Certification	-	ISO 9001, ISO 9000	ISO 9001, ISO 9000	ISO 9001, ISO 9000	-
Trade Capacity
Export Markets	North America, Europe, Southeast Asia/ Mideast, East Asia(Japan/ South Korea), Australia, Domestic	North America, South America, Western Europe	North America, South America, Western Europe	North America, South America, Western Europe	North America, South America, Europe, Southeast Asia/ Mideast, Africa, East Asia(Japan/ South Korea), Australia, Domestic
Annual Export Revenue	-	-	-	-	-
Business Model	Own Brand	OEM	OEM	OEM	-
Average Lead Time	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)	Off-season: 1-3 Month(s) Peak-season: 3-6 Month(s)	Off-season: 1-3 Month(s) Peak-season: 3-6 Month(s)	Off-season: 1-3 Month(s) Peak-season: 3-6 Month(s)	Off-season: within 15 Day(s) Peak-season: 1 Month(s)
Product Attributes
Specification	After-sales Service: 12months; Warranty: 12months; Type: Surface Grinding Machine; Processing Object: Flat Workpieces; Abrasives: Grinding Wheel; Controlling Mode: PLC; Automatic Grade: Semiautomatic; Cylindrical Grinder Type: Surface Grinding Machine; Precision: High Precision; Condition: New; Power Source: Electricity; Disc(Wheel) Type: Grinding Disc; Variable Speed: with Variable Speed; Application: Semiconductor Industry; Disc Diameter: 220mm; Service: Oversea Setup & After-Sale Avalaible; Class: Thinner; Process Station: 1; Abrasive: Recyclable Water & Grinding Wheel; Wheel Rotate Speed: 0-3000 Rpm; Workpiece Accuracy Control(Parallelism): 1um; Power of Grinding Wheel Motor: 5.5kw;	Type: External Grinding Machine; Processing Object: Cylindrical or Conical External Surface; Abrasives: Grinding Wheel; Controlling Mode: Artificial; Automatic Grade: Semiautomatic; Cylindrical Grinder Type: Universal Cylindrical Grinder; Precision: Precision; Condition: New; Cylindrical Diameter: 30-630mm; Workpiece Length: 3000mm; Roundness: 0.0025; Max. Workpiece Weight: 2000kg; Machine Center Height: 335mm; Wheel Speed: 35m/S; Headstock Center: Metric #80; Tailstock Center: Metric #80; Total Motor Power: 34.5kw;	Type: External Grinding Machine; Processing Object: Cylindrical or Conical External Surface; Abrasives: Grinding Wheel; Controlling Mode: Artificial; Automatic Grade: Semiautomatic; Cylindrical Grinder Type: Universal Cylindrical Grinder; Precision: Precision; Condition: New; Cylindrical Diameter: 30-630mm; Workpiece Length: 4000mm; Roundness: 0.0025; Max. Workpiece Weight: 2000kg; Machine Center Height: 335mm; Wheel Speed: 35m/S; Headstock Center: Metric #80; Tailstock Center: Metric #80; Total Motor Power: 34.5kw;	Type: External Grinding Machine; Processing Object: Cylindrical or Conical External Surface; Abrasives: Grinding Wheel; Controlling Mode: Artificial; Automatic Grade: Semiautomatic; Cylindrical Grinder Type: Universal Cylindrical Grinder; Precision: Precision; Condition: New; Cylindrical Diameter: 30-630mm; Workpiece Length: 5000mm; Roundness: 0.0025; Max. Workpiece Weight: 2000kg; Machine Center Height: 335mm; Wheel Speed: 35m/S; Headstock Center: Metric #80; Tailstock Center: Metric #80; Total Motor Power: 34.5kw;	Type: Tool Grinding Machine; Processing Object: Crank Shaft; Abrasives: Grinding Wheel; Controlling Mode: CNC; Automatic Grade: Automatic; Precision: Precision; Condition: New; Working Table Size: 1300500/1000500mm; Max.Length of Grinding: 1300/1500mm; Max.Width of Grinding: 350mm; Max. Height of Grinding: 800mm; Main Motor Power: 1.5/2.4kw;
Supplier Name	Shenzhen Ponda Grinding Technology Co.,Ltd.	Dalian ZT Machinery Co., Ltd.	Dalian ZT Machinery Co., Ltd.	Dalian ZT Machinery Co., Ltd.	Anhui Chizhou Household Machine Tool Co., Ltd.
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