Surface Lapping

US$8,000.00-20,000.00 / Piece

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Fonda 460lx Precision Grinding Machine for Silicon Wafer, Mold, Optical Guide Plate, Fiber Connector, Valve Plate pictures & photos

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What is Fonda 460lx Precision Grinding Machine for Silicon Wafer, Mold, Optical Guide Plate, Fiber Connector, Valve Plate

Name: Fonda 460lx Precision Grinding Machine for Silicon Wafer, Mold, Optical Guide Plate, Fiber Connector, Valve Plate
Uploaded: 2023-11-30T17:58:57+08:00
Description: Why Ponda? Ponda has profound experience of lapping, polishing and thinning. We heretofore supplied more than 60, 000 lapping process solutions and appliances over the industries of machinery, electro

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About this Item

Price

Min. Order Reference FOB Price

1 Piece US$8,000.00-20,000.00 / Piece

Sepcifications

After-sales Service 12months
Warranty 12months
Type Surface Grinding Machine, Lapping Machine
Processing Object Flat Workpieces
Abrasives Grinding Wheel
Controlling Mode PLC
Automatic Grade Semiautomatic
Cylindrical Grinder Type Surface Grinding Machine
Precision High Precision
Certification ISO 9001
Condition New
Transport Package Wood Crate
Trademark PONDA
Origin China
Power Source Electricity
Disc(Wheel) Type Grinding Disc
Working Style Grain
Variable Speed with Variable Speed
Application Grinding Industry
Material Metal and Non-Metal
Disc Diameter Φ610 mm / 24 Inches
Service Oversea Setup & After-Sale Avalaible
Class Single Plate
Process Station 3
Pressure Source Pneumatic or Weight Block
Plate Material Metal & Non-Metal
Abrasive Slurry
Weight 1000kg

Product Description

Why Ponda? Ponda has profound experience of lapping, polishing and thinning. We heretofore supplied more than 60, 000 lapping process solutions and appliances over the industries of machinery, electronic, aerospace, aviation, automotive, atomic energy, optics; the substances of metal, SiC wafer, ...

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Shenzhen Ponda Grinding Technology Co.,Ltd.

Diamond Member Since 2021

Audited Supplier

Business Type Manufacturer/Factory & Trading Company
Main Products Lapping Machine, Polishing Machine, Grinding Machine,Wafer Grinder, Single Plate Lapping and Polishing Machine, Double Plate Lapping and Polishing Machine, Lapping and CMP Systm, Abrasive Tools and Consumables
Registered Capital 1.48 Million USD
Plant Area 11500 square meters
Main Markets North America, Europe, Southeast Asia/ Mideast, East Asia(Japan/ South Korea), Australia, Domestic
Average Lead Time Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays

Surface Lapping Comparison

	Quick View Fonda 460lx Precision Grinding Machine for Silicon Wafer, Mold, Optical Guide Plate, Fiber Connector, Valve Plate Contact Now	Quick View Gantry Program-Controlled Fixed Beam Type Grinding Machine Contact Now	Quick View High Quality Gantry Program-Controlled Fixed Beam Type Grinder Contact Now	Quick View High Quality Gantry Program-Controlled Fixed Beam Type Grinding Machine Contact Now	Quick View Programing CNC Controlled Fixed Beam Type Grinder Contact Now

Transaction Info
	Quick View Fonda 460lx Precision Grinding Machine for Silicon Wafer, Mold, Optical Guide Plate, Fiber Connector, Valve Plate Contact Now	Quick View Gantry Program-Controlled Fixed Beam Type Grinding Machine Contact Now	Quick View High Quality Gantry Program-Controlled Fixed Beam Type Grinder Contact Now	Quick View High Quality Gantry Program-Controlled Fixed Beam Type Grinding Machine Contact Now	Quick View Programing CNC Controlled Fixed Beam Type Grinder Contact Now
Price	US $ 8,000.00-20,000.00/ Piece	US $ 15,900.00-95,600.00/ Piece	US $ 15,900.00-95,600.00/ Piece	US $ 15,900.00-95,600.00/ Piece	US $ 15,900.00-95,600.00/ Piece
Min Order	1 Pieces	1 Pieces	1 Pieces	1 Pieces	1 Pieces
Trade Terms	-	-	-	-	-
Payment Terms	L/C, T/T, Western Union, Paypal	L/C, T/T, Western Union, Paypal, Money Gram	L/C, T/T, Western Union, Paypal, Money Gram	L/C, T/T, Western Union, Paypal, Money Gram	L/C, T/T, Western Union, Paypal, Money Gram
Quality Control
Product Certification	ISO 9001	GS, CE, ISO 9001	GS, CE, ISO 9001	GS, CE, ISO 9001	GS, CE, ISO 9001
Management System Certification	-	ISO 9001, ISO 14001, ISO 22000	ISO 9001, ISO 14001, ISO 22000	ISO 9001, ISO 14001, ISO 22000	ISO 9001, ISO 14001, ISO 22000
Trade Capacity
Export Markets	North America, Europe, Southeast Asia/ Mideast, East Asia(Japan/ South Korea), Australia, Domestic	North America, South America, Europe, Southeast Asia/ Mideast, Africa, Domestic	North America, South America, Europe, Southeast Asia/ Mideast, Africa, Domestic	North America, South America, Europe, Southeast Asia/ Mideast, Africa, Domestic	North America, South America, Europe, Southeast Asia/ Mideast, Africa, Domestic
Annual Export Revenue	-	-	-	-	-
Business Model	Own Brand	-	-	-	-
Average Lead Time	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)	Off-season: 6-12 Month(s) Peak-season: 1-3 Month(s)	Off-season: 6-12 Month(s) Peak-season: 1-3 Month(s)	Off-season: 6-12 Month(s) Peak-season: 1-3 Month(s)	Off-season: 6-12 Month(s) Peak-season: 1-3 Month(s)
Product Attributes
Specification	After-sales Service: 12months; Warranty: 12months; Type: Surface Grinding Machine, Lapping Machine; Processing Object: Flat Workpieces; Abrasives: Grinding Wheel; Controlling Mode: PLC; Automatic Grade: Semiautomatic; Cylindrical Grinder Type: Surface Grinding Machine; Precision: High Precision; Condition: New; Power Source: Electricity; Disc(Wheel) Type: Grinding Disc; Working Style: Grain; Variable Speed: with Variable Speed; Application: Grinding Industry; Material: Metal and Non-Metal; Disc Diameter: Φ610 mm / 24 Inches; Service: Oversea Setup & After-Sale Avalaible; Class: Single Plate; Process Station: 3; Pressure Source: Pneumatic or Weight Block; Plate Material: Metal & Non-Metal; Abrasive: Slurry; Weight: 1000kg;	Type: Surface Grinding Machine; Processing Object: Curve; Abrasives: Grinding Wheel; Controlling Mode: CNC; Automatic Grade: Automatic; Cylindrical Grinder Type: Universal Cylindrical Grinder; Precision: High Precision; Condition: New;	Type: Surface Grinding Machine; Processing Object: Curve; Abrasives: Grinding Wheel; Controlling Mode: CNC; Automatic Grade: Automatic; Cylindrical Grinder Type: Universal Cylindrical Grinder; Precision: High Precision; Condition: New;	Type: Surface Grinding Machine; Processing Object: Curve; Abrasives: Grinding Wheel; Controlling Mode: CNC; Automatic Grade: Automatic; Cylindrical Grinder Type: Universal Cylindrical Grinder; Precision: High Precision; Condition: New;	Type: Surface Grinding Machine; Processing Object: Curve; Abrasives: Grinding Wheel; Controlling Mode: CNC; Automatic Grade: Automatic; Cylindrical Grinder Type: Universal Cylindrical Grinder; Precision: High Precision; Condition: New;
Supplier Name	Shenzhen Ponda Grinding Technology Co.,Ltd.	NANTONG YIJI MACHINERY CO., LTD.	NANTONG YIJI MACHINERY CO., LTD.	NANTONG YIJI MACHINERY CO., LTD.	NANTONG YIJI MACHINERY CO., LTD.
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