Ceramic Capillary
US$4.00-5.00 / Piece
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What is Ceramic Capillary for Silver Wire Bonding

About this Item
Details
Company Profile

Price

Purchase Qty. Reference FOB Price

100-499 branch US$5.00

500-999 branch US$4.50

1,000+ branch US$4.00

Sepcifications

  • Material Zirconia Ceramics
  • Application Wire Bonding
  • Transport Package Plastic Tub and Boxes
  • Specification zirconia ceramics
  • Origin China

Product Description

Product Description Ceramic capillary is suitable for semiconductor packing of LED,IC chip and discrete devices Special semiconductor wire use/ball burning, tangent/ultrasonic heat transfer We a wide range of semiconductor bonding tools from Die Attach to Wire Bonding. This includes Die ...

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Ceramic Capillary Comparison
Transaction Info
Price US $ 4.00-5.00/ Piece US $ 0.10-0.25/ Piece US $ 0.10-0.25/ Piece US $ 0.10-0.25/ Piece US $ 190/ Piece
Min Order 100 branch 100 Pieces 100 Pieces 100 Pieces 720 Pieces
Trade Terms - - - - -
Payment Terms T/T T/T, Western Union, Paypal T/T, Western Union, Paypal T/T, Western Union, Paypal T/T
Quality Control
Management System Certification ISO 9001, ISO 14001, ISO 20000 ISO 9001 ISO 9001 ISO 9001 ISO 9001
Trade Capacity
Export Markets North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, Eastern Europe, Eastern Asia, Western Europe North America, Eastern Europe, Eastern Asia, Western Europe North America, Eastern Europe, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
Annual Export Revenue - - - - -
Business Model OEM, ODM, Own Brand Others Others Others OEM, ODM
Average Lead Time Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: 1-3 Month(s)
Off-season: within 15 Day(s)
Peak-season: 1-3 Month(s)
Off-season: within 15 Day(s)
Peak-season: 1-3 Month(s)
Off-season: within 15 Day(s)
Peak-season: 1 Month(s)
Product Attributes
Specification
Material: Zirconia Ceramics;
Application: Wire Bonding;
Manufacturing Technology: Discrete Device;
Material: Plastic;
Brand: 3m;
Manufacturing Technology: Discrete Device;
Material: Plastic/Metal;
Brand: Original;
Manufacturing Technology: Discrete Device;
Material: Plastic/Metal;
Brand: 3m;
Manufacturing Technology: Integrated Circuits Device;
Material: Element Semiconductor;
Supplier Name

Shenzhen Silver Technologies Ltd

China Supplier - Gold Member Audited Supplier

Emi International (Hk) Co. Ltd

China Supplier - Diamond Member Audited Supplier

Emi International (Hk) Co. Ltd

China Supplier - Diamond Member Audited Supplier

Emi International (Hk) Co. Ltd

China Supplier - Diamond Member Audited Supplier

R&O Industrial Technology Co., Limited

China Supplier - Gold Member Audited Supplier