Printed Circuit Board

US$0.11-2.18 / Piece

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6 Layers Blind Via Immersion Gold Bluetooth Speaker Circuit Board pictures & photos

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What is 6 Layers Blind Via Immersion Gold Bluetooth Speaker Circuit Board

Name: 6 Layers Blind Via Immersion Gold Bluetooth Speaker Circuit Board
Uploaded: 2024-03-11T17:00:16+08:00
Description: Company Profile Shenzexin electronic company is a comprehensive PCB solution service provider, offering a complete range of services including PCBA and PCB fabrication. With a specialized focus on pri

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Price

Min. Order Reference FOB Price

1 Piece US$0.11-2.18 / Piece

Sepcifications

Type Rigid Circuit Board
Dielectric FR-4
Material Fiberglass Epoxy
Application Consumer Electronics
Flame Retardant Properties V0
Mechanical Rigid Rigid
Processing Technology Electrolytic Foil
Base Material Copper
Insulation Materials Epoxy Resin
Brand Szx
Transport Package Carton
Specification 40cmX35cmX35CM
Origin China
Layers Multilayer
Surface Treatment HASL, Immersion Gold, OSP, etc.
Service Providing PCB Production, PCB Assembly, Components Sourcing
Solder Marsk Green, Black, Blue, Red, Yellow, White etc.
Hole Mechanical Hole, Laser Hole

Product Description

Company Profile Shenzexin electronic company is a comprehensive PCB solution service provider, offering a complete range of services including PCBA and PCB fabrication. With a specialized focus on printed circuit board production and surface mount technology (SMT), we provide turnkey solutions from ...

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Shenzexin Electronic (Hongkong) Co., Ltd.

Gold Member Since 2024

Audited Supplier

Business Type Manufacturer/Factory
Main Products PCB, PCB Board, PCBA, PCB Assembly, Parts and Components, Metal Based PCB Board, Aluminum PCB, Fr4 PCB
Registered Capital 10000000 RMB
Plant Area >2000 square meters
Management System Certification ISO 9001, ISO 14001, IATF16949
Average Lead Time Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays

Printed Circuit Board Comparison

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Transaction Info
	Quick View 6 Layers Blind Via Immersion Gold Bluetooth Speaker Circuit Board Contact Now	Quick View PCBA EMS Electronic Manufacturing PCB Assembly From SMT Line and Wave-Soldering Contact Now	Quick View Aluminum LED Professional PCB and PCBA Manufacturer in Shenzhen Contact Now	Quick View PCB Assembly Main Board with ISO9001 Circuit Board PCB Manufacturer Contact Now	Quick View High Precision Box Building Service ODM OEM EMS BMS PCBA Bom Gerber Files PCB Assembly Printed Circuit Board Assembly PCBA for New Energy Vehicle Industry Contact Now
Price	US $ 0.11-2.18/ Piece	US $ 0.15-20.00/ Piece	US $ 0.15-20.00/ Piece	US $ 0.87-5.00/ Piece	US $ 0.67-10.00/ Piece
Min Order	1 Pieces	10 Pieces	10 Pieces	10 Pieces	10 Pieces
Trade Terms	-	-	-	-	-
Payment Terms	T/T, Western Union, Paypal, Money Gram	T/T, D/P, Paypal, Money Gram	T/T, D/P, Paypal, Money Gram	T/T	T/T
Quality Control
Product Certification	-	RoHS, CCC, ISO	RoHS, CCC, ISO	RoHS, CCC, ISO	RoHS, CCC, ISO
Management System Certification	ISO 9001, ISO 14001, IATF16949	ISO 9001, IATF16949, ISO 13485	ISO 9001, IATF16949, ISO 13485	ISO 9001, IATF16949, ISO 13485	ISO 9001, IATF16949, ISO 13485
Trade Capacity
Export Markets	North America, South America, Eastern Europe, Southeast Asia, Africa, Mid East, Eastern Asia, Western Europe	Domestic	Domestic	Domestic	Domestic
Annual Export Revenue	-	-	-	-	-
Business Model	OEM, ODM	OEM, ODM	OEM, ODM	OEM, ODM	OEM, ODM
Average Lead Time	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)	Off-season: 1 Month(s) Peak-season: 1-3 Month(s)	Off-season: 1 Month(s) Peak-season: 1-3 Month(s)	Off-season: 1 Month(s) Peak-season: 1-3 Month(s)	Off-season: 1 Month(s) Peak-season: 1-3 Month(s)
Product Attributes
Specification	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Consumer Electronics; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Copper; Insulation Materials: Epoxy Resin; Brand: Szx; Layers: Multilayer; Surface Treatment: HASL, Immersion Gold, OSP, etc.; Service Providing: PCB Production, PCB Assembly, Components Sourcing; Solder Marsk: Green, Black, Blue, Red, Yellow, White etc.; Hole: Mechanical Hole, Laser Hole;	Type: Customized; Dielectric: FR-4; Material: Aluminum Covered Copper Foil Layer; Application: Consumer Electronics; Flame Retardant Properties: V0; Mechanical Rigid: Customized; Processing Technology: Customized; Base Material: Aluminum; Insulation Materials: Organic Resin; Brand: OEM/ODM; PCBA-Testing: X-ray, Aoi; Processing: Electrolytic Foil; SMT Capacity: >2 Million Points/Day; DIP Capacity: >100K Parts/Day; Min. Space of BGA: +/- 0.3mm; Min.Pin Space of IC: 0.3mm; Max.Precision of IC Assembly: 0.03mm; Surface Finishing: Lead-Free HASL; Number of Layers: 4-10 Layer; Board Thickness: 1.6mm;	Type: Customized; Dielectric: FR-4; Material: Aluminum Covered Copper Foil Layer; Application: Consumer Electronics; Flame Retardant Properties: V0; Mechanical Rigid: Customized; Processing Technology: Customized; Base Material: Aluminum; Insulation Materials: Organic Resin; Brand: OEM/ODM; PCBA-Testing: X-ray, Aoi; Processing: Electrolytic Foil; SMT Capacity: >2 Million Points/Day; DIP Capacity: >100K Parts/Day; Min. Space of BGA: +/- 0.3mm; Min.Pin Space of IC: 0.3mm; Max.Precision of IC Assembly: 0.03mm; Surface Finishing: Lead-Free HASL; Number of Layers: 4-10 Layer; Board Thickness: 1.6mm;	Type: Customized; Dielectric: FR-4; Material: Aluminum Covered Copper Foil Layer; Application: Consumer Electronics; Flame Retardant Properties: V0; Mechanical Rigid: Customized; Processing Technology: Customized; Base Material: Aluminum; Insulation Materials: Organic Resin; Brand: OEM/ODM; PCBA-Testing: X-ray, Aoi; Processing: Electrolytic Foil; SMT Capacity: >2 Million Points/Day; DIP Capacity: >100K Parts/Day; Min. Space of BGA: +/- 0.3mm; Min.Pin Space of IC: 0.3mm; Max.Precision of IC Assembly: 0.03mm; Surface Finishing: Lead-Free HASL; Number of Layers: 4-10 Layer; Board Thickness: 1.6mm;	Type: Customized; Dielectric: FR-4; Material: Aluminum Covered Copper Foil Layer; Application: Consumer Electronics; Flame Retardant Properties: V0; Mechanical Rigid: Customized; Processing Technology: Customized; Base Material: Aluminum; Insulation Materials: Organic Resin; Brand: OEM/ODM; PCBA-Testing: X-ray, Aoi; Processing: Electrolytic Foil; SMT Capacity: >2 Million Points/Day; DIP Capacity: >100K Parts/Day; Min. Space of BGA: +/- 0.3mm; Min.Pin Space of IC: 0.3mm; Max.Precision of IC Assembly: 0.03mm; Surface Finishing: Lead-Free HASL; Number of Layers: 4-10 Layer; Board Thickness: 1.6mm;
Supplier Name	Shenzexin Electronic (Hongkong) Co., Ltd.	Shenzhen Hongzhou Smart Technology Co., Ltd.	Shenzhen Hongzhou Smart Technology Co., Ltd.	Shenzhen Hongzhou Smart Technology Co., Ltd.	Shenzhen Hongzhou Smart Technology Co., Ltd.
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