PCB Assembly

US$0.19-1.78 / Piece

View

New Original PCB to MID-Volume Printed Circuit Board Assembly pictures & photos

Recommend for you
What is PCBA Manufacturers Supply Customized Electric Hair Clipper LCD PCB Circuit
What is Mini Drone Controller Board Designing PCB with Customer
What is Custom Fabrication Medical Equipment Electronic PCB with OEM

What is New Original PCB to MID-Volume Printed Circuit Board Assembly

Name: New Original PCB to MID-Volume Printed Circuit Board Assembly
Uploaded: 2024-05-13T15:20:43+08:00
Description: Company Profile Shenzexin electronic company is a comprehensive PCB solution service provider, offering a complete range of services including PCBA and PCB fabrication. With a specialized focus on pri

Contact Now

Get Latest Price

About this Item

Price

Min. Order Reference FOB Price

1 Piece US$0.19-1.78 / Piece

Sepcifications

Structure Multilayer Rigid PCB
Dielectric FR-4
Material Polyester Glass Fiber Mat Laminate
Application Consumer Electronics
Flame Retardant Properties V1
Processing Technology Electrolytic Foil
Production Process Subtractive Process
Base Material Copper
Insulation Materials Epoxy Resin
Brand Szx
Transport Package Carton
Specification 40cmX35cmX35CM
Trademark szx
Origin China
Type Rigid Circuit Board
Mechanical Rigid Rigid
Layers Multilayer
Solder Marsk Green, Black, Blue, Red, Yellow, White
Hole Mechanical Hole, Laser Hole
Assembly Components
Processing SMT and DIP
Surface Treatment HASL, Immersion Gold, OSP
Service Providing PCB Production, PCB Assembly, Components Sourcing

Product Description

Company Profile Shenzexin electronic company is a comprehensive PCB solution service provider, offering a complete range of services including PCBA and PCB fabrication. With a specialized focus on printed circuit board production and surface mount technology (SMT), we provide turnkey solutions from ...

Learn More

Shenzexin Electronic (Hongkong) Co., Ltd.

Gold Member Since 2024

Audited Supplier

Business Type Manufacturer/Factory
Main Products PCB, PCB Board, PCBA, PCB Assembly, Parts and Components, Metal Based PCB Board, Aluminum PCB, Fr4 PCB
Registered Capital 10000000 RMB
Plant Area >2000 square meters
Management System Certification ISO 9001, ISO 14001, IATF16949
Average Lead Time Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays

PCB Assembly Comparison

	Quick View New Original PCB to MID-Volume Printed Circuit Board Assembly Contact Now	Quick View Motherboard 10layer Enig PCB with Gold Fingers Tg170 Impedance Control for Telecommunication Contact Now	Quick View Lf-HASL Enig Immersion Gold 10layer Printed Circuit Board 10layer PCB Contact Now	Quick View 10L Lf-HASL Tg170 Impedance Control PCB for Telecommunication Electronics Contact Now	Quick View 10layer 1.2mm Thickness HASL with Gold Fingers High Quality PCB for Could Computing Contact Now

Transaction Info
	Quick View New Original PCB to MID-Volume Printed Circuit Board Assembly Contact Now	Quick View Motherboard 10layer Enig PCB with Gold Fingers Tg170 Impedance Control for Telecommunication Contact Now	Quick View Lf-HASL Enig Immersion Gold 10layer Printed Circuit Board 10layer PCB Contact Now	Quick View 10L Lf-HASL Tg170 Impedance Control PCB for Telecommunication Electronics Contact Now	Quick View 10layer 1.2mm Thickness HASL with Gold Fingers High Quality PCB for Could Computing Contact Now
Price	US $ 0.19-1.78/ Piece	US $ 0.758-4.96/ Piece	US $ 0.912-2.49/ Piece	US $ 2.51-6.27/ Piece	US $ 3.64-7.23/ Piece
Min Order	1 Pieces	100 Pieces	100 Pieces	100 Pieces	100 Pieces
Trade Terms	-	-	-	-	-
Payment Terms	T/T, Western Union, Paypal, Money Gram	T/T, Western Union, Paypal	T/T, Western Union, Paypal	T/T, Western Union, Paypal	T/T, Western Union, Paypal
Quality Control
Management System Certification	ISO 9001, ISO 14001, IATF16949	ISO 9001, ISO 9000, ISO 14001, ISO 14000, IATF16949, HSE	ISO 9001, ISO 9000, ISO 14001, ISO 14000, IATF16949, HSE	ISO 9001, ISO 9000, ISO 14001, ISO 14000, IATF16949, HSE	ISO 9001, ISO 9000, ISO 14001, ISO 14000, IATF16949, HSE
Trade Capacity
Export Markets	North America, South America, Eastern Europe, Southeast Asia, Africa, Mid East, Eastern Asia, Western Europe	North America, Europe, Southeast Asia/ Mideast	North America, Europe, Southeast Asia/ Mideast	North America, Europe, Southeast Asia/ Mideast	North America, Europe, Southeast Asia/ Mideast
Annual Export Revenue	-	-	-	-	-
Business Model	OEM, ODM	OEM, ODM	OEM, ODM	OEM, ODM	OEM, ODM
Average Lead Time	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)
Product Attributes
Specification	Structure: Multilayer Rigid PCB; Dielectric: FR-4; Material: Polyester Glass Fiber Mat Laminate; Application: Consumer Electronics; Flame Retardant Properties: V1; Processing Technology: Electrolytic Foil; Production Process: Subtractive Process; Base Material: Copper; Insulation Materials: Epoxy Resin; Brand: Szx; Type: Rigid Circuit Board; Mechanical Rigid: Rigid; Layers: Multilayer; Solder Marsk: Green, Black, Blue, Red, Yellow, White; Hole: Mechanical Hole, Laser Hole; Assembly: Components; Processing: SMT and DIP; Surface Treatment: HASL, Immersion Gold, OSP; Service Providing: PCB Production, PCB Assembly, Components Sourcing;	Structure: Multilayer Rigid PCB; Dielectric: FR-4; Material: Epoxy Paper Laminate; Application: Communication; Flame Retardant Properties: V0; Processing Technology: Immersion Gold+Gold Fingers; Production Process: Additive Process; Base Material: Copper; Insulation Materials: Epoxy Resin; Brand: 1; Layer Count: 10L; Min. Hole to Line: 6mil; Inner Core Material: 0.2mm;	Structure: Multilayer Rigid PCB; Dielectric: FR-4; Material: Epoxy Paper Laminate; Application: Communication; Flame Retardant Properties: V0; Processing Technology: HASL-Lf; Production Process: Additive Process; Base Material: Copper; Insulation Materials: Epoxy Resin; Layer Count: 10L; Min. Hole to Line: 6mil; Inner Core Material: 0.2mm;	Structure: Multilayer Rigid PCB; Dielectric: FR-4; Material: Epoxy Paper Laminate; Application: Communication; Flame Retardant Properties: V0; Processing Technology: HASL-Lf; Production Process: Additive Process; Base Material: Copper; Insulation Materials: Epoxy Resin; Brand: 1; Layer Count: 10L; Min. Hole to Line: 6mil; Inner Core Material: 0.2mm;	Structure: Multilayer Rigid PCB; Dielectric: FR-4; Material: Epoxy Paper Laminate; Application: Communication; Flame Retardant Properties: V0; Processing Technology: HASL-Lf+Gold Fingers; Production Process: Additive Process; Base Material: Copper; Insulation Materials: Epoxy Resin; Brand: 1; Layer Count: 10L; Min. Hole to Line: 9mil; Inner Core Material: 0.2mm;
Supplier Name	Shenzexin Electronic (Hongkong) Co., Ltd.	Shanghai Gawin Electronic Technology Co., Ltd.	Shanghai Gawin Electronic Technology Co., Ltd.	Shanghai Gawin Electronic Technology Co., Ltd.	Shanghai Gawin Electronic Technology Co., Ltd.
Select All

Contact Now

Hot Search