Specification |
Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Material: Polyester Glass Fiber Mat Laminate;
Application: Consumer Electronics;
Flame Retardant Properties: V1;
Processing Technology: Electrolytic Foil;
Production Process: Subtractive Process;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Szx;
Type: Rigid Circuit Board;
Mechanical Rigid: Rigid;
Layers: Multilayer;
Solder Marsk: Green, Black, Blue, Red, Yellow, White;
Hole: Mechanical Hole, Laser Hole;
Assembly: Components;
Processing: SMT and DIP;
Surface Treatment: HASL, Immersion Gold, OSP;
Service Providing: PCB Production, PCB Assembly, Components Sourcing;
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Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Base Material: Fr-4;
Insulation Materials: Organic Resin;
Brand: Kb;
Surface: OSP,Immersion Gold,Hal Lead Free,Hal;
Solder Mask: Green,Red,Yellow,White,Black,Blue,etc;
Shipment: Air,Sea,Express(DHL TNT FedEx EMS UPS);
Sample Date: 3-5 Days;
MOQ: 10PCS;
Delivery Time: 15 Days;
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Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Base Material: Fr-4;
Insulation Materials: Organic Resin;
Brand: Kb;
Surface: OSP,Immersion Gold,Hal Lead Free,Hal;
Solder Mask: Green,Red,Yellow,White,Black,Blue,etc;
Shipment: Air,Sea,Express(DHL TNT FedEx EMS UPS);
Sample Date: 3-5 Days;
MOQ: 10PCS;
Delivery Time: 15 Days;
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Structure: Double-Sided Rigid PCB;
Dielectric: FR-4;
Material: Epoxide Woven Glass Fabric Laminate;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Standard: Ipc Class 3;
Thickness: 2.0mm;
Solder Mask: Green;
Silk: White;
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Structure: Double-Sided Rigid PCB;
Dielectric: FR-4;
Material: Kb;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Base Material: Kb;
Insulation Materials: Epoxy Resin;
Brand: Abis;
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