PCB Board
US$0.80-6.00 / Piece
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What is High Quality Factory Price Multilayer PCB Printed Circuit Boards Manufacture Blind and Buried Via

About this Item
Details
Company Profile

Price

Min. Order Reference FOB Price

1 Piece US$0.80-6.00 / Piece

Sepcifications

  • Type Rigid Circuit Board
  • Dielectric FR-4
  • Material Fiberglass Epoxy
  • Application Consumer Electronics
  • Flame Retardant Properties V0
  • Mechanical Rigid Rigid
  • Processing Technology Electrolytic Foil
  • Base Material Fr4
  • Insulation Materials Organic Resin
  • Brand Topfast
  • Transport Package Vacuum Package and Foam Protected
  • Specification Custom Multilayer PCB
  • Trademark Topfast
  • Origin Shenzhen
  • Certification RoHS, UL CE, GS
  • Keyword Multilayer PCB

Product Description

PCB Assembly Capability Item Capability Advantages ----Professional Surface-mounting and Through-hole soldering technology ----Various sizes like 1206,0805,0603 components SMT technology ----ICT(In Circuit Test),FCT(Functional Circuit Test) ----PCB Assembly With UL,CE,FCC,Rohs Approval ...

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PCB Board Comparison
Transaction Info
Price US $ 0.80-6.00/ Piece US $ 0.01-10.00/ Piece US $ 30.00-100.00/ Piece US $ 0.1/ Piece US $ 0.01-10.00/ Piece
Min Order 1 Pieces 1 Pieces 1 Pieces 1 Pieces 1 Pieces
Trade Terms - FOB, CFR, CIF, DAT, FAS, DDP, DAP, CIP, CPT, FCA, EXW FOB, CFR, EXW, CIF, DAT, FAS, DDP, DAP, CIP, CPT, FCA FOB, CFR, EXW, CIF, DAT, FAS, DDP, DAP, CIP, CPT, FCA FOB, CFR, CIF, DAT, FAS, DDP, DAP, CIP, CPT, FCA, EXW
Payment Terms L/C, T/T, D/P, Western Union, Money Gram L/C, T/T, D/P, Western Union, Paypal, Money Gram L/C, T/T, D/P, Western Union, Paypal, Money Gram L/C, T/T, D/P, Western Union, Paypal, cash L/C, T/T, D/P, Western Union, Paypal, Money Gram
Quality Control
Product Certification RoHS, UL CE, GS SGS,ISO, UL,RoHS - UL, RoHS, SGS, ISO 9001, Ect SGS,ISO, UL,RoHS
Management System Certification ISO 9001, ISO 14001, ISO 20000, IATF16949, ISO 14064 ISO 9001, ISO 14001 ISO 9001, ISO 14001 ISO 9001, ISO 14001 ISO 9001, ISO 14001
Trade Capacity
Export Markets North America, South America, Eastern Europe, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
Annual Export Revenue - - - - -
Business Model OEM OEM, ODM OEM, ODM OEM, ODM OEM, ODM
Average Lead Time Off-season: within 15 Day(s)
Peak-season: 1 Month(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Product Attributes
Specification
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Fr4;
Insulation Materials: Organic Resin;
Brand: Topfast;
Keyword: Multilayer PCB;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Paper Phenolic Copper Foil Substrate;
Flame Retardant Properties: V0;
Copper Thickness: 1oz;
Surface Finishing: OSP;
Solder Mask Type: Blue;
Silkscreen: White;
Board Thickness: 1.6mm;
Min. Hole Size: 0.2mm;
Min. Line Spacing: 0.15mm;
Min. Line Width: 0.15mm;
Shipping: DHL, UPS, Ect;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Paper Phenolic Copper Foil Substrate;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Fr4;
Insulation Materials: Epoxy Resin;
Board Thickness: 1.6mm;
Copper Thickness: 1oz;
Surface Finishing: Immersion Gold;
Solder Mask Type: Green;
Silkscreen: White;
Min. Hole Size: 0.2mm;
Min. Line Width: 0.1mm;
Min. Line Spacing: 0.1mm;
Certificates: UL, RoHS, SGS, ISO9001;
Shipping: DHL, UPS, TNT, FedEx, etc;
Type: Rigid Circuit Board;
Dielectric: CEM-1;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Fr4;
Insulation Materials: Organic Resin;
Surface Finishing: HASL;
Copper Thickness: 35um;
Board Thickness: 1.6mm;
Min. Hole Size: 0.1mm;
Min. Line Wigth: 0.075mm;
Min. Line Spacing: 0.075mm;
Layer: 1 to 18;
Package: Vacuum;
Shipping: UPS, FedEx, DHL, Ect;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Paper Phenolic Copper Foil Substrate;
Flame Retardant Properties: V0;
Copper Thickness: 1oz;
Surface Finishing: OSP;
Solder Mask Type: Blue;
Silkscreen: White;
Board Thickness: 1.6mm;
Min. Hole Size: 0.2mm;
Min. Line Spacing: 0.15mm;
Min. Line Width: 0.15mm;
Shipping: DHL, UPS, Ect;
Supplier Name

Topfast (Guangdong) Technology Co., Ltd.

China Supplier - Gold Member Audited Supplier

Shenzhen Xinjiaye Electronics Technology Co., Ltd.

China Supplier - Gold Member Audited Supplier

Shenzhen Xinjiaye Electronics Technology Co., Ltd.

China Supplier - Gold Member Audited Supplier

Shenzhen Xinjiaye Electronics Technology Co., Ltd.

China Supplier - Gold Member Audited Supplier

Shenzhen Xinjiaye Electronics Technology Co., Ltd.

China Supplier - Gold Member Audited Supplier