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US$0.10-0.30 / Piece
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Immersion Sliver PCB 4L Fr4 PCB Board for Electronic Product pictures & photos
Immersion Sliver PCB 4L Fr4 PCB Board for Electronic Product pictures & photos
Immersion Sliver PCB 4L Fr4 PCB Board for Electronic Product pictures & photos
Immersion Sliver PCB 4L Fr4 PCB Board for Electronic Product pictures & photos
Immersion Sliver PCB 4L Fr4 PCB Board for Electronic Product pictures & photos
Immersion Sliver PCB 4L Fr4 PCB Board for Electronic Product pictures & photos
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What is Immersion Sliver PCB 4L Fr4 PCB Board for Electronic Product

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About this Item
Details
Company Profile

Price

Purchase Qty. Reference FOB Price

1-9 Pieces US$0.30

10+ Pieces US$0.10

Sepcifications

  • Type Rigid Circuit Board
  • Dielectric AIN
  • Material Aluminum
  • Application Consumer Electronics
  • Flame Retardant Properties V0
  • Mechanical Rigid Rigid
  • Processing Technology Electrolytic Foil
  • Base Material Aluminum
  • Insulation Materials Metal Composite Materials
  • Brand UC
  • Transport Package Vacuum Package
  • Specification UL(US&Canada). ISO. RoHs, TS, SGS
  • Trademark UC
  • Origin Shenzhen, China
  • Layers 4 Layers Board
  • Thickness 1.6mm
  • Finished Copper Thickness 1/1 Oz
  • Base Copper
  • Solder Mask Color White
  • Surface Treatment Immersion Silver
  • Ipc Standards Ipc Class II
  • Lead Time 5-8 Working Days
  • Fast Turn 3 Working Days
  • PCB Testing E-Testing, Flying Probe Testing

Product Description

Welcome to Ucreate Ucreate is specialized in the production of a variety of single, double, high multi layers, HDI, the metallic substrate and FPC PCB. With laser drilling machine, CNC drilling machine, automatic machine, automatic exposure machine, large-scale lamination machine, Automatic flow ...

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Transaction Info
Price US $ 0.10-0.30/ Piece US $ 0.10-10.00/ Piece US $ 0.10-10.00/ Piece US $ 0.10-10.00/ Piece US $ 0.10-10.00/ Piece
Min Order 1 Pieces 1 Pieces 1 Pieces 1 Pieces 1 Pieces
Trade Terms - - - - -
Payment Terms L/C, T/T, Paypal L/C, T/T, D/P, Western Union, Paypal, XT L/C, T/T, D/P, Western Union, Paypal, XT L/C, T/T, D/P, Western Union, Paypal, XT L/C, T/T, D/P, Western Union, Paypal, XT
Quality Control
Management System Certification ISO 9001, ISO 9000, ISO 14001, ISO 14000, ISO 20000, OHSAS/ OHSMS 18001, IATF16949 - - - -
Trade Capacity
Export Markets North America, South America, Eastern Europe, Southeast Asia, Oceania, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
Annual Export Revenue - - - - -
Business Model OEM OEM, ODM, Own Brand OEM, ODM, Own Brand OEM, ODM, Own Brand OEM, ODM, Own Brand
Average Lead Time Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)		 Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)		 Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)		 Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)		 Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Product Attributes
Specification
Type: Rigid Circuit Board;
Dielectric: AIN;
Material: Aluminum;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Aluminum;
Insulation Materials: Metal Composite Materials;
Brand: UC;
Layers: 4 Layers Board;
Thickness: 1.6mm;
Finished Copper Thickness: 1/1 Oz;
Base: Copper;
Solder Mask Color: White;
Surface Treatment: Immersion Silver;
Ipc Standards: Ipc Class II;
Lead Time: 5-8 Working Days;
Fast Turn: 3 Working Days;
PCB Testing: E-Testing, Flying Probe Testing;
Type: Combining Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Aerospace;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Sy Fr4;
Insulation Materials: Organic Resin;
Brand: Kxpcba;
Material Brand: Sy / Rogers/ Arlon / Polymide / Aluminum / Kapt;
Copper Weights: 0.5oz~10oz;
Layer Count: 1-64 Layers;
Stack up: Control Dielectric/Control Impedance/Tdr Testing;
Surface Finish: HASL/Enig/Enepig/Hard Gold/Wire Bonded Gold/Immers;
Vias: Blind-Buried/Via-in-Pad/Pofv/Filled-Vias/Epoxy Res;
Stack Via: 5step;
Stagger Via: 5step;
Laser Via Hole Size: 0.1mm;
Filling Via Dimple Value: <=15um;
Laser Via Capture Pad Size: 0.25mm;
Type: Combining Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Aerospace;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Sy Fr4;
Insulation Materials: Organic Resin;
Brand: Kxpcba;
Material Brand: Sy / Rogers/ Arlon / Polymide / Aluminum / Kapt;
Copper Weights: 0.5oz~10oz;
Layer Count: 1-64 Layers;
Stack up: Control Dielectric/Control Impedance/Tdr Testing;
Surface Finish: HASL/Enig/Enepig/Hard Gold/Wire Bonded Gold/Immers;
Vias: Blind-Buried/Via-in-Pad/Pofv/Filled-Vias/Epoxy Res;
Stack Via: 5step;
Stagger Via: 5step;
Laser Via Hole Size: 0.1mm;
Filling Via Dimple Value: <=15um;
Laser Via Capture Pad Size: 0.25mm;
Type: Combining Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Aerospace;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Sy Fr4;
Insulation Materials: Organic Resin;
Brand: Kxpcba;
Material Brand: Sy / Rogers/ Arlon / Polymide / Aluminum / Kapt;
Copper Weights: 0.5oz~10oz;
Layer Count: 1-64 Layers;
Stack up: Control Dielectric/Control Impedance/Tdr Testing;
Surface Finish: HASL/Enig/Enepig/Hard Gold/Wire Bonded Gold/Immers;
Vias: Blind-Buried/Via-in-Pad/Pofv/Filled-Vias/Epoxy Res;
Stack Via: 5step;
Stagger Via: 5step;
Laser Via Hole Size: 0.1mm;
Filling Via Dimple Value: <=15um;
Laser Via Capture Pad Size: 0.25mm;
Type: Combining Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Aerospace;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Sy Fr4;
Insulation Materials: Organic Resin;
Brand: Kxpcba;
Material Brand: Sy / Rogers/ Arlon / Polymide / Aluminum / Kapt;
Copper Weights: 0.5oz~10oz;
Layer Count: 1-64 Layers;
Stack up: Control Dielectric/Control Impedance/Tdr Testing;
Surface Finish: HASL/Enig/Enepig/Hard Gold/Wire Bonded Gold/Immers;
Vias: Blind-Buried/Via-in-Pad/Pofv/Filled-Vias/Epoxy Res;
Stack Via: 5step;
Stagger Via: 5step;
Laser Via Hole Size: 0.1mm;
Filling Via Dimple Value: <=15um;
Laser Via Capture Pad Size: 0.25mm;
Supplier Name

Ucreate PCB Co., Ltd.

China Supplier - Diamond Member Audited Supplier

Shenzhen Jinxiong Electronic Co., Ltd

China Supplier - Gold Member Audited Supplier

Shenzhen Jinxiong Electronic Co., Ltd

China Supplier - Gold Member Audited Supplier

Shenzhen Jinxiong Electronic Co., Ltd

China Supplier - Gold Member Audited Supplier

Shenzhen Jinxiong Electronic Co., Ltd

China Supplier - Gold Member Audited Supplier

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