PCB Board
US$0.70-1.20 / PCS
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What is High Quality PCB Board for Mobile Phone with Ce RoHS

About this Item
Details
Company Profile

Price

Purchase Qty. Reference FOB Price

1-99 PCS US$1.20

100-499 PCS US$1.00

500+ PCS US$0.70

Sepcifications

  • Structure Multilayer Rigid PCB
  • Dielectric FR-4
  • Material Polyester Glass Fiber Mat Laminate
  • Application Consumer Electronics
  • Flame Retardant Properties V0
  • Processing Technology Enig
  • Production Process Subtractive Process
  • Base Material Copper
  • Insulation Materials Organic Resin
  • Transport Package Vacuum Packing
  • Specification IP class -2
  • Trademark Ucreate PCB
  • Origin Shenzhen
  • Board Layer 10L
  • Surface Finihsing Immersion Gold
  • Lead Time 6-8 Working Days

Product Description

Welcome to Ucreate Ucreate is specialized in the production of a variety of single, double, high multi layers, HDI, the metallic substrate and FPC PCB. With laser drilling machine, CNC drilling machine, automatic machine, automatic exposure machine, large-scale lamination machine, Automatic flow ...

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PCB Board Comparison
Transaction Info
Price US $ 0.70-1.20/ PCS US $ 0.13-2.32/ Piece US $ 0.099-1.20/ Piece US $ 0.80-6.80/ Piece US $ 0.156-0.80/ Piece
Min Order 1 PCS 100 Pieces 100 Pieces 1 Pieces 100 Pieces
Trade Terms - - - - -
Payment Terms L/C, T/T, D/P, Paypal T/T, Western Union, Paypal T/T, Western Union, Paypal L/C, T/T, D/P, Western Union, Paypal, Money Gram T/T, Western Union, Paypal
Quality Control
Management System Certification ISO 9001, ISO 9000, ISO 14001, ISO 14000, ISO 20000, OHSAS/ OHSMS 18001, IATF16949 ISO 9001, ISO 9000, ISO 14001, ISO 14000, IATF16949, HSE ISO 9001, ISO 9000, ISO 14001, ISO 14000, IATF16949, HSE ISO 9001, ISO 9000, ISO 14001, IATF16949, ISO 13485, ISO 17025 ISO 9001, ISO 9000, ISO 14001, ISO 14000, IATF16949, HSE
Trade Capacity
Export Markets North America, South America, Eastern Europe, Southeast Asia, Oceania, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
Annual Export Revenue - - - - -
Business Model OEM OEM, ODM OEM, ODM OEM, ODM OEM, ODM
Average Lead Time Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: 1 Month(s)
Peak-season: 1 Month(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Product Attributes
Specification
Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Material: Polyester Glass Fiber Mat Laminate;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Processing Technology: Enig;
Production Process: Subtractive Process;
Base Material: Copper;
Insulation Materials: Organic Resin;
Board Layer: 10L;
Surface Finihsing: Immersion Gold;
Lead Time: 6-8 Working Days;
Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Material: Epoxy Paper Laminate;
Application: Industrial Control;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Additive Process;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: 1;
Layer Count: 4L up to 60L;
Board Thickness: 2.0mm up to 8mm;
Min Hole Size: 0.5mm;
Min. Hole Wall Cu: 25um;
Finished Copper: 56um;
Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Material: Epoxy Paper Laminate;
Application: Industrial Control;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Additive Process;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Layer Count: 4L up to 60L;
Board Thickness: 2.0mm up to 8mm;
Min Hole Size: 0.4mm;
Min. Hole Wall Cu: 25um;
Finished Copper: 35um;
Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Material: Polyester Glass Fiber Mat Laminate;
Application: Medical Instruments;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Semi-Additive Process;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: OEM;
PCBA-Testing: X-ray, Aoi;
Small Order: Acceptable;
Type: Main Board;
Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Material: Epoxy Paper Laminate;
Application: Military;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Additive Process;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Layer Count: 6L up to 60L;
Board Thickness: 1.4mm up to 8mm;
Min Hole Size: 0.2mm;
Min. Hole Wall Cu: 20um;
Finished Copper: 35um;
Min. Trace/Space: 5/4mil;
Supplier Name

Ucreate PCB Co., Ltd.

China Supplier - Diamond Member Audited Supplier

Shanghai Gawin Electronic Technology Co., Ltd.

China Supplier - Diamond Member Audited Supplier

Shanghai Gawin Electronic Technology Co., Ltd.

China Supplier - Diamond Member Audited Supplier

Shenzhen Grandtop Electronics Co., Ltd.

China Supplier - Diamond Member Audited Supplier

Shanghai Gawin Electronic Technology Co., Ltd.

China Supplier - Diamond Member Audited Supplier