17 Years Manufacturer for Quick Turn PCB Board with Double Sided Multilayer PCB

About this Item
Details
Company Profile

Price

Min. Order Reference FOB Price

1 Piece US$0.10-1.10 / Piece

Sepcifications

  • Type Rigid Circuit Board
  • Dielectric FR-4
  • Material Fiberglass Epoxy
  • Application Consumer Electronics
  • Flame Retardant Properties V0
  • Mechanical Rigid Rigid
  • Processing Technology Electrolytic Foil
  • Base Material Copper
  • Insulation Materials Epoxy Resin
  • Transport Package Vacuum Package
  • Origin China
  • Certificate ISO/Cqciatf/UL/RoHS/etc
  • Layer 1-20

Product Description

We provide high-quality PCB (Printed Circuit Board) . We use advanced technology and reliable materials to ensure excellent performance and stability as well as meet the latest industry standards and requirements We offer multi-layer PCB solutions suitable for various application areas such as ...

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Multilayer PCB Comparison
Transaction Info
Price US $ 0.10-1.10/ Piece US $ 3.91-3.92/ Piece US $ 3.91-3.92/ Piece US $ 0.10-10.00/ Piece US $ 0.55-0.60/ Piece
Min Order 1 Pieces 10 Pieces 10 Pieces 1 Pieces 10 Pieces
Trade Terms - - - - -
Payment Terms T/T, Western Union, Paypal, Money Gram T/T T/T L/C, T/T, D/P, Western Union, Paypal, XT T/T
Quality Control
Product Certification ISO/Cqciatf/UL/RoHS/etc - - - -
Management System Certification ISO 9001, ISO 14001, IATF16949 ISO 9001, ISO 14001, IATF16949 ISO 9001, ISO 14001, IATF16949 - ISO 9001, ISO 14001, IATF16949
Trade Capacity
Export Markets North America, South America, Europe, Southeast Asia/ Mideast, Africa, East Asia(Japan/ South Korea), Australia, Domestic - - North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe -
Annual Export Revenue - - - - -
Business Model OEM, ODM, Own Brand OEM, ODM OEM, ODM OEM, ODM, Own Brand OEM, ODM
Average Lead Time Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
- - Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
-
Product Attributes
Specification
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Layer: 1-20;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Shengyi, Kb, Nanya, Ilm;
Criteria: Aql II 0.65;
Hole Sizes: 0.25mm;
Bevel Edge: Yes;
Impedance: 50/90/100 Ohm;
Trace Width(Min.): 4mil;
Surfaec Treatment: Immersion Gold;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Shengyi, Kb, Nanya, Ilm;
Criteria: Aql II 0.65;
Hole Sizes: 0.25mm;
Bevel Edge: Yes;
Impedance: 50/90/100 Ohm;
Trace Width(Min.): 4mil;
Surfaec Treatment: Immersion Gold;
Type: Combining Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Aerospace;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Sy Fr4;
Insulation Materials: Organic Resin;
Brand: Kxpcba;
Material Brand: Sy / Rogers/ Arlon / Polymide / Aluminum / Kapt;
Copper Weights: 0.5oz~10oz;
Layer Count: 1-64 Layers;
Stack up: Control Dielectric/Control Impedance/Tdr Testing;
Surface Finish: HASL/Enig/Enepig/Hard Gold/Wire Bonded Gold/Immers;
Vias: Blind-Buried/Via-in-Pad/Pofv/Filled-Vias/Epoxy Res;
Stack Via: 5step;
Stagger Via: 5step;
Laser Via Hole Size: 0.1mm;
Filling Via Dimple Value: <=15um;
Laser Via Capture Pad Size: 0.25mm;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Computer;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Xmd;
Criteria: Aql II 0.65;
Hole Sizes: 0.25mm;
Bevel Edge: Yes;
Impedance: 50/90/100 Ohm;
Trace Width(Min.): 4mil;
Surfaec Treatment: Enig;
Supplier Name

Jian Unice Pcb Technique Co., Ltd

China Supplier - Gold Member Audited Supplier

Shenzhen Xinmanda Printed Circuit Board Co., Ltd.

China Supplier - Diamond Member Audited Supplier

Shenzhen Xinmanda Printed Circuit Board Co., Ltd.

China Supplier - Diamond Member Audited Supplier

Shenzhen Jinxiong Electronic Co., Ltd

China Supplier - Gold Member Audited Supplier

Shenzhen Xinmanda Printed Circuit Board Co., Ltd.

China Supplier - Diamond Member Audited Supplier