Multilayer PCB

US$0.50-10.00 / Piece

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Ebyte PCB Manufacturing Custom PCBA Prototype Design Service OEM ODM PCB Printed Circuit Board Manufacturer in China pictures & photos

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What is Ebyte PCB Manufacturing Custom PCBA Prototype Design Service OEM ODM PCB Printed Circuit Board Manufacturer in China

Name: Ebyte PCB Manufacturing Custom PCBA Prototype Design Service OEM ODM PCB Printed Circuit Board Manufacturer in China
Uploaded: 2023-11-03T20:05:16+08:00
Description: Detailed Photos In strict accordance with the drilling process PIN - drilling - check control hole quality; Exquisite copper sinking process to produce high quality printed circuit boards to meet v

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Price

Min. Order Reference FOB Price

1 Piece US$0.50-10.00 / Piece

Sepcifications

Structure Multilayer Rigid PCB
Dielectric FR-4
Material Epoxy Resin
Application Communication
Processing Technology Electrolytic Foil
Production Process Immersion Gold
Base Material It180A
Transport Package Bubble Pack+Aluminum Foil Pack
Origin China
Board Thickness 1.6mm
Copper Thickness 2oz
Test Flying Probe & Fixture
Solder Mask Type Green
Min.Line Width/Space 0.1mm
Min. Hole Size 0.2mm
Certification RoHS, CCC, ISO, EPA
Customized Customized

Product Description

Detailed Photos In strict accordance with the drilling process PIN - drilling - check control hole quality; Exquisite copper sinking process to produce high quality printed circuit boards to meet various application requirements. PCB copper sinking process beyond customer requirements. Rigid ...

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Usun Electronics Limited.,

Gold Member Since 2023

Audited Supplier

Business Type Manufacturer/Factory, Trading Company, Group Corporation
Main Products Multilayer Pcbs, Rigid PCB, FPC & Rigid Flex PCB, MCPCB, SMT/PCBA
Management System Certification ISO 9001, ISO 14001, IATF16949, ISO 13485
Export Year 2013-05-23
Average Lead Time Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
OEM/ODM Availability Yes

Multilayer PCB Comparison

	Quick View Ebyte PCB Manufacturing Custom PCBA Prototype Design Service OEM ODM PCB Printed Circuit Board Manufacturer in China Contact Now	Quick View Fr4 Tg150 1.5mm 8layer Immersion Gold Min. Space 3.9mil Circuit Board PCB Contact Now	Quick View Imm Gold Min. Hole to Line 7mil Impedance Control 8layer Motherboard PCB Contact Now	Quick View Enig Impedance Control PCB BGA to Line 3.5mil 8layer Circuit Board PCB Contact Now	Quick View 1.5mm Enig Min. Trace Line&Space 3.9mil 8layer PCB for Router/Modem/Switch Contact Now

Transaction Info
	Quick View Ebyte PCB Manufacturing Custom PCBA Prototype Design Service OEM ODM PCB Printed Circuit Board Manufacturer in China Contact Now	Quick View Fr4 Tg150 1.5mm 8layer Immersion Gold Min. Space 3.9mil Circuit Board PCB Contact Now	Quick View Imm Gold Min. Hole to Line 7mil Impedance Control 8layer Motherboard PCB Contact Now	Quick View Enig Impedance Control PCB BGA to Line 3.5mil 8layer Circuit Board PCB Contact Now	Quick View 1.5mm Enig Min. Trace Line&Space 3.9mil 8layer PCB for Router/Modem/Switch Contact Now
Price	US $ 0.50-10.00/ Piece	US $ 0.28-3.10/ Piece	US $ 0.295-3.30/ Piece	US $ 0.275-3.60/ Piece	US $ 0.265-3.55/ Piece
Min Order	1 Pieces	100 Pieces	100 Pieces	100 Pieces	100 Pieces
Trade Terms	-	-	-	-	-
Payment Terms	L/C, T/T, D/P, Western Union, Paypal, Money Gram	T/T, Western Union, Paypal	T/T, Western Union, Paypal	T/T, Western Union, Paypal	T/T, Western Union, Paypal
Quality Control
Product Certification	RoHS, CCC, ISO, EPA	-	-	-	-
Management System Certification	ISO 9001, ISO 14001, IATF16949, ISO 13485	ISO 9001, ISO 9000, ISO 14001, ISO 14000, IATF16949, HSE	ISO 9001, ISO 9000, ISO 14001, ISO 14000, IATF16949, HSE	ISO 9001, ISO 9000, ISO 14001, ISO 14000, IATF16949, HSE	ISO 9001, ISO 9000, ISO 14001, ISO 14000, IATF16949, HSE
Trade Capacity
Export Markets	North America, South America, Eastern Europe, Southeast Asia, Mid East, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
Annual Export Revenue	-	-	-	-	-
Business Model	OEM, ODM, Own Brand	OEM, ODM	OEM, ODM	OEM, ODM	OEM, ODM
Average Lead Time	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)
Product Attributes
Specification	Structure: Multilayer Rigid PCB; Dielectric: FR-4; Material: Epoxy Resin; Application: Communication; Processing Technology: Electrolytic Foil; Production Process: Immersion Gold; Base Material: It180A; Board Thickness: 1.6mm; Copper Thickness: 2oz; Test: Flying Probe & Fixture; Solder Mask Type: Green; Min.Line Width/Space: 0.1mm; Min. Hole Size: 0.2mm; Customized: Customized;	Structure: Multilayer Rigid PCB; Dielectric: FR-4; Material: Epoxy Paper Laminate; Application: Communication; Flame Retardant Properties: V0; Processing Technology: Immersion Gold; Production Process: Additive Process; Base Material: Copper; Insulation Materials: Epoxy Resin; Brand: 1; Layer Count: 8L; Other: Fr4 Tg150; Min. Space: 3.9mil;	Structure: Multilayer Rigid PCB; Dielectric: FR-4; Material: Epoxy Paper Laminate; Application: Communication; Flame Retardant Properties: V0; Processing Technology: Immersion Gold; Production Process: Additive Process; Base Material: Copper; Insulation Materials: Epoxy Resin; Brand: 1; Layer Count: 8L; Other: Impedance Control; Min. Hole to Line: 7mil;	Structure: Multilayer Rigid PCB; Dielectric: FR-4; Material: Epoxy Paper Laminate; Application: Communication; Flame Retardant Properties: V0; Processing Technology: Immersion Gold; Production Process: Additive Process; Base Material: Copper; Insulation Materials: Epoxy Resin; Brand: 1; Layer Count: 8L; Other: Impedance Control; BGA to Line: 3.5mil;	Structure: Multilayer Rigid PCB; Dielectric: FR-4; Material: Epoxy Paper Laminate; Application: Communication; Flame Retardant Properties: V0; Processing Technology: Immersion Gold; Production Process: Additive Process; Base Material: Copper; Insulation Materials: Epoxy Resin; Brand: 1; Layer Count: 8L; Min. Trace Line&Space: 3.9mil; Inner Core Material: 0.1mm;
Supplier Name	Usun Electronics Limited.,	Shanghai Gawin Electronic Technology Co., Ltd.	Shanghai Gawin Electronic Technology Co., Ltd.	Shanghai Gawin Electronic Technology Co., Ltd.	Shanghai Gawin Electronic Technology Co., Ltd.
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