| Specification |
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Board Thickness: 1.6mm;
Copper Thickness: 2oz;
Test: Flying Probe & Fixture;
Solder Mask Type: Green;
Min.Line Width/Space: 0.1mm;
Min. Hole Size: 0.2mm;
One Stop Service: PCB Assembly,Component Supply;
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Metal Coating: Copper;
Mode of Production: SMT and Tht PCB Assembly;
Layers: Single/Double Layer/Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
MOQ: 1 PCS;
Layer: Single/Double Layer/Multilayer;
Surface Finishing: HASL-Lead Free/Enig(Gold);
Copper Thickness: 1oz;
Board Thickness: 1.6mm;
Min.Hole Size: 0.1mm (4 Mil);
Min.Line Spacing: 0.1mm (4 Mil);
PCBA QC: X-ray, Aoi Test, Function Test(100% Test);
Specialised: LED, Medical, Industrial, Control Board;
Delivery: PCB: 7-10 Days; PCB Assembly: 2-3weeks;
Service: Fr-4 Circuit Board Custom PCB Assembly;
Other Service: PCBA Layout and Design, Engineering Support;
Products Name: PCB Assembly PCBA for Disposable Vape;
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Metal Coating: Gold;
Mode of Production: DIP;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: Original Made;
Board Thickness: 1.2~2.0mm;
Surface Finihsing: Immersional Gold;
Lead Time: 6-8 Working Days;
Certificate: ISO, UL, RoHS,CE,IATF;
PCB Testing: E-Testing; Flying Probe Testing;
Mask Ink Color: White/Black/Green/Red/Yellow/Blue;
Color: Green/Yellow/Black/White/Red/Blue;
Number of Layers: Multilayer;
Copper Thickness: 0.5-7.0oz;
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Metal Coating: Tin;
Mode of Production: SMT;
Layers: Single-Layer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Alloy: Tin Lead;
Powder Size: Type 3: 25 to 45 Microns;
Powder Size 2: Type 4: 20 to 38 Microns;
Flux: No Clean Flux;
Alloy 2: Sn63pb37;
Alloy 3: Sn60pb40;
Alloy 4: Sn55pb45;
Alloy 5: Sn50pb50;
Packing: Jar;
Packing 2: Syringe;
Shipping: Courier / Air Freight;
Shelf Life: 6months;
Storage: 0 to 10 Degree Celsius;
Application 2: for SMT SMD PCB Soldering;
Application 3: for EMS Electronics Manufacturing Service;
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Metal Coating: Tin;
Mode of Production: SMT;
Layers: Double-Layer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Alloy: Tin Lead;
Powder Size: Type 3: 25 to 45 Microns;
Powder Size 2: Type 4: 20 to 38 Microns;
Flux: No Clean Flux;
Alloy 2: Sn63pb37;
Alloy 3: Sn60pb40;
Alloy 4: Sn55pb45;
Alloy 5: Sn50pb50;
Packing: Jar;
Packing 2: Syringe;
Shipping: Courier / Air Freight;
Shelf Life: 6months;
Storage: 0 to 10 Degree Celsius;
Application: SMT;
Application 2: SMD;
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