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What is Texas Instruments Msp430f563X Mixed-Signal Microcontrollers

About this Item
Details
Company Profile

Price

Purchase Qty. Reference FOB Price

1-9 Pieces US$0.50

10-99 Pieces US$0.40

100+ Pieces US$0.10

Sepcifications

  • Manufacturing Technology Optoelectronic Semiconductor
  • Material Compound Semiconductor
  • Type Unipolar Integrated Circuit
  • Package DIP(Dual In-line Package)
  • Signal Processing Digital
  • Model Msp430f563X
  • Batch Number 2023
  • Brand Msp430f563X
  • Transport Package Tray, Reel, Foam, Tube, Box
  • Trademark TI
  • Origin England
  • Series Kintex®-7
  • Mounting Style SMD/SMT
  • Package Case Bbga
  • Mounting Type Surface Mount
  • Base Product No. Msp430f563X
  • Subcategory Fpgas (Field Programmable Gate Array)

Product Description

Product Attribute Attribute Value Select Attribute Manufacturer: Texas Instruments Product Category: 16-bit Microcontrollers - MCU RoHS: Details Core: MSP430 Program Memory Size: 256 kB Data RAM Size: 16 kB Package/Case: LQFP-100 Maximum Clock Frequency: 20 ...

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Transaction Info
Price US $ 0.10-0.50/ Piece US $ 1.00-100.00/ Piece US $ 1.00-100.00/ Piece US $ 1.00-100.00/ Piece US $ 1.00-100.00/ Piece
Min Order 1 Pieces 25 Pieces 25 Pieces 25 Pieces 25 Pieces
Trade Terms - - - - -
Payment Terms L/C, T/T, D/P, Western Union, Paypal, Money Gram T/T, Western Union, Paypal T/T, Western Union, Paypal T/T, Western Union, Paypal T/T, Western Union, Paypal
Quality Control
Management System Certification ISO 9001, ISO 14001, IATF16949, ISO 13485 ISO 9001 ISO 9001 ISO 9001 ISO 9001
Trade Capacity
Export Markets North America, South America, Eastern Europe, Southeast Asia, Mid East, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
Annual Export Revenue - - - - -
Business Model OEM, ODM, Own Brand Own Brand Own Brand Own Brand Own Brand
Average Lead Time Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Product Attributes
Specification
Manufacturing Technology: Optoelectronic Semiconductor;
Material: Compound Semiconductor;
Type: Unipolar Integrated Circuit;
Package: DIP(Dual In-line Package);
Signal Processing: Digital;
Model: Msp430f563X;
Batch Number: 2023;
Brand: Msp430f563X;
Series: Kintex®-7;
Mounting Style: SMD/SMT;
Package Case: Bbga;
Mounting Type: Surface Mount;
Base Product No.: Msp430f563X;
Subcategory: Fpgas (Field Programmable Gate Array);
Manufacturing Technology: Optoelectronic Semiconductor;
Material: Compound Semiconductor;
Type: Intrinsic Semiconductor;
Package: SMD;
Signal Processing: Analog Digital Composite and Function;
Application: LED;
Growth Method: CZ and Fz;
Orientation: 111 or 100;
Resistivity: 0.0005 to 150;
Surface: Double Side Polished or Single Side Polished;
Dopant: N Type and P Type;
Particles: <30 at 0.3um;
Bow: < 30 Um;
Ttv: <15 Um;
Manufacturing Technology: Optoelectronic Semiconductor;
Material: Compound Semiconductor;
Type: Intrinsic Semiconductor;
Package: SMD;
Signal Processing: Analog Digital Composite and Function;
Application: LED;
Growth Method: CZ and Fz;
Orientation: 111 or 100;
Resistivity: 0.0005 to 150;
Surface: Double Side Polished or Single Side Polished;
Dopant: N Type and P Type;
Particles: <30 at 0.3um;
Bow: < 30 Um;
Ttv: <15 Um;
Manufacturing Technology: Optoelectronic Semiconductor;
Material: Compound Semiconductor;
Type: Intrinsic Semiconductor;
Package: SMD;
Signal Processing: Analog Digital Composite and Function;
Application: LED;
Growth Method: CZ and Fz;
Orientation: 111 or 100;
Resistivity: 0.0005 to 150;
Surface: Double Side Polished or Single Side Polished;
Dopant: N Type and P Type;
Particles: <30 at 0.3um;
Bow: < 30 Um;
Ttv: <15 Um;
Manufacturing Technology: Optoelectronic Semiconductor;
Material: Compound Semiconductor;
Type: Intrinsic Semiconductor;
Package: SMD;
Signal Processing: Analog Digital Composite and Function;
Application: LED;
Growth Method: CZ and Fz;
Orientation: 111 or 100;
Resistivity: 0.0005 to 150;
Surface: Double Side Polished or Single Side Polished;
Dopant: N Type and P Type;
Particles: <30 at 0.3um;
Bow: < 30 Um;
Ttv: <15 Um;
Supplier Name

Usun Electronics Limited.,

China Supplier - Gold Member Audited Supplier

Jiaozuo Commercial Finewin Co., Ltd.

China Supplier - Gold Member Audited Supplier

Jiaozuo Commercial Finewin Co., Ltd.

China Supplier - Gold Member Audited Supplier

Jiaozuo Commercial Finewin Co., Ltd.

China Supplier - Gold Member Audited Supplier

Jiaozuo Commercial Finewin Co., Ltd.

China Supplier - Gold Member Audited Supplier