Welding Submerged Arc Welding Flux, Sj501/401/601/101 pictures & photos

Welding Submerged Arc Welding Flux, Sj501/401/601/101

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Price

Purchase Qty. Reference FOB Price

5-9 Tons US$380.00

10-19 Tons US$370.00

20+ Tons US$360.00

Sepcifications

state Solid
pH Alkaline
Type Organic
Melting Point >600℃
Chemical Composition SiO₂=10%-30%
Function Remove Oxides, Protect Weld Metal
Application Submerged-arc Welding, Electroslag Welding
Manufacturing Method Agglomerated
Transport Package 25kg Paper Bag or 200kg Drum
Specification 10-60 mesh
Trademark LIT
Origin China
Keywords Welding Flux, Saw Flux, Welding Material
Keywords2 Sj-101, Sj-301, Sj-501 Submerged Arc Welding Flux
Sample Available
Matching Wire EL12, Em12K, Eh14 Fcw Wires etc.
MOQ 1 Ton

Product Description

Low Alloy Steel Submerged Arc Welding Flux AWS A5.17 f7a2 em12k STANDARD: GB/T5293 GB/T12470 F5A2-H08MnA F4A2-H08A EQUIV: AWS-A5.17 F6A2-EL12 F7A2-EM12K SJ501 is an active flux which features good welding properties, easy slag removal, good bead appearance, and insensitive to rust and ...

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JINAN LIT INDUSTRY CO., LTD.

Gold Member Since 2020

Audited Supplier

Business Type Manufacturer/Factory, Trading Company
Main Products Welding Wire, Welding Flux, Wear Plate, Carpet and Mat
Registered Capital 2000000 RMB
Plant Area 101~500 square meters
Management System Certification ISO 9001, ISO 9000, ISO 14001
Main Markets North America, South America, Southeast Asia, Oceania, Western Europe

Welding Flux Comparison

	Welding Submerged Arc Welding Flux, Sj501/401/601/101 Contact Now	Quick View Best BGA Ppd AG Style Welding Aim Om 340 Alpha Cookson Lead Free Solder Paste for Electronics SMD Reflow Reballing Contact Now	Quick View Tin Lead Halide Free Flux Soldering and Fct Felder Fluxite Fryolux Fusion Goot Henkel Heraeus Hercules Eutectic Solder Paste Contact Now	Quick View Instant Indium Innolot Inventec Johnson Jyd Kek Kester Ep256 Jet Printing Jetting Lead Free Solder Paste for Electronics Contact Now	Quick View Liquid Jb Weld Jaycar Koki Koocu Loctite Lotfett Iron IC Reballing Soldering Hot Air Leaded Solder Paste for Semiconductor Contact Now

Transaction Info
	Welding Submerged Arc Welding Flux, Sj501/401/601/101 Contact Now	Quick View Best BGA Ppd AG Style Welding Aim Om 340 Alpha Cookson Lead Free Solder Paste for Electronics SMD Reflow Reballing Contact Now	Quick View Tin Lead Halide Free Flux Soldering and Fct Felder Fluxite Fryolux Fusion Goot Henkel Heraeus Hercules Eutectic Solder Paste Contact Now	Quick View Instant Indium Innolot Inventec Johnson Jyd Kek Kester Ep256 Jet Printing Jetting Lead Free Solder Paste for Electronics Contact Now	Quick View Liquid Jb Weld Jaycar Koki Koocu Loctite Lotfett Iron IC Reballing Soldering Hot Air Leaded Solder Paste for Semiconductor Contact Now
Price	US $ 360.00-380.00/ Ton	US $ 40/ kg	US $ 30/ kg	US $ 40/ kg	US $ 30/ kg
Min Order	5 Tons	50 kg	50 kg	50 kg	50 kg
Trade Terms	-	-	-	-	-
Payment Terms	L/C, T/T, Western Union, Paypal, Money Gram	T/T, Western Union, Paypal, Money Gram	T/T, Western Union, Paypal, Money Gram	T/T, Western Union, Paypal, Money Gram	T/T, Western Union, Paypal, Money Gram
Quality Control
Product Certification	-	RoHS	-	RoHS Lead Free	-
Management System Certification	ISO 9001, ISO 9000, ISO 14001	ISO 9001, ISO 14001	ISO 9001, ISO 14001	ISO 9001, ISO 14001	ISO 9001, ISO 14001
Trade Capacity
Export Markets	North America, South America, Southeast Asia, Oceania, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
Annual Export Revenue	-	-	-	-	-
Business Model	OEM	OEM, ODM, Own Brand	OEM, ODM, Own Brand	OEM, ODM, Own Brand	OEM, ODM, Own Brand
Average Lead Time	-	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)
Product Attributes
Specification	state: Solid; pH: Alkaline; Type: Organic; Melting Point: >600℃; Chemical Composition: SiO₂=10%-30%; Function: Remove Oxides, Protect Weld Metal; Application: Submerged-arc Welding, Electroslag Welding; Manufacturing Method: Agglomerated; Keywords: Welding Flux, Saw Flux, Welding Material; Keywords2: Sj-101, Sj-301, Sj-501 Submerged Arc Welding Flux; Sample: Available; Matching Wire: EL12, Em12K, Eh14 Fcw Wires etc.; MOQ: 1 Ton;	state: Liquid; pH: Neutral; Type: Solder Paste; Melting Point: <200℃; Chemical Composition: Sn-Bi; Function: Make the Liquid Solder Flow; Application: SMT; Manufacturing Method: Smelting; Alloy: Lead Free; Powder Size: Type 3: 25 to 45 Microns; Powder Size 2: Type 4: 20 to 38 Microns; Flux: No Clean Flux; Alloy 2: Sac305 Sn96.5AG3.0cu0.5; Alloy 3: Sac0307 Sn99AG0.3cu0.7; Alloy 4: Sn42bi58 Low Temperature; Packing: Jar; Packing 2: Syringe; Shipping: Courier / Air Freight; Shelf Life: 6months; Storage: 0 to 10 Degree Celsius; Application 2: SMD;	state: Liquid; pH: Neutral; Type: Organic; Melting Point: <200℃; Chemical Composition: Tin; Function: Make the Liquid Solder Flow; Manufacturing Method: Smelting; Alloy: Tin Lead; Powder Size: Type 3: 25 to 45 Microns; Powder Size 2: Type 4: 20 to 38 Microns; Flux: No Clean Flux; Alloy 2: Sn63pb37; Alloy 3: Sn60pb40; Alloy 4: Sn55pb45; Alloy 5: Sn50pb50; Packing: Jar; Packing 2: Syringe; Shipping: Courier / Air Freight; Shelf Life: 6months; Storage: 0 to 10 Degree Celsius; Application 2: for SMT Reflow Soldering; Application 3: for PCB Assembly Soldering;	state: Liquid; pH: Neutral; Type: Solder Paste; Melting Point: <200℃; Chemical Composition: Sn-Bi; Function: Make the Liquid Solder Flow; Application: SMT; Manufacturing Method: Smelting; Alloy: Lead Free; Powder Size: Type 3: 25 to 45 Microns; Powder Size 2: Type 4: 20 to 38 Microns; Flux: No Clean Flux; Alloy 2: Sac305 Sn96.5AG3.0cu0.5; Alloy 3: Sac0307 Sn99AG0.3cu0.7; Alloy 4: Sn42bi58 Low Temperature; Packing: Jar; Packing 2: Syringe; Shipping: Courier / Air Freight; Shelf Life: 6months; Storage: 0 to 10 Degree Celsius; Application 2: for SMD SMT PCB Soldering; Application 3: for Jet Printing Jetting Soldering;	state: Liquid; pH: Neutral; Type: Organic; Melting Point: <200℃; Chemical Composition: Tin; Function: Make the Liquid Solder Flow; Manufacturing Method: Smelting; Alloy: Tin Lead; Powder Size: Type 3: 25 to 45 Microns; Powder Size 2: Type 4: 20 to 38 Microns; Flux: No Clean Flux; Alloy 2: Sn63pb37; Alloy 3: Sn60pb40; Alloy 4: Sn55pb45; Alloy 5: Sn50pb50; Packing: Jar; Packing 2: Syringe; Shipping: Courier / Air Freight; Shelf Life: 6months; Storage: 0 to 10 Degree Celsius; Application 2: for Semiconductor Soldering; Application 3: for PCB SMD Soldering;
Supplier Name	JINAN LIT INDUSTRY CO., LTD.	Foshan Xi Feng Tin Products Co., Ltd.	Foshan Xi Feng Tin Products Co., Ltd.	Foshan Xi Feng Tin Products Co., Ltd.	Foshan Xi Feng Tin Products Co., Ltd.
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