Saw Submerged Arc Welding Flux Sj101 Sj101g Sj301 Sj431 Sj501 Sjf174 Sj38 Powder Wire Em12K H08A Em12 Eh14 Em13K Eh12K Material pictures & photos

Saw Submerged Arc Welding Flux Sj101 Sj101g Sj301 Sj431 Sj501 Sjf174 Sj38 Powder Wire Em12K H08A Em12 Eh14 Em13K Eh12K Material

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Price

Purchase Qty. Reference FOB Price

5-9 Tons US$380.00

10-19 Tons US$370.00

20+ Tons US$360.00

Sepcifications

state Solid
pH Alkaline
Type Organic
Melting Point >600℃
Chemical Composition SiO₂=10%-30%
Function Remove Oxides, Protect Weld Metal
Application Submerged-arc Welding, Electroslag Welding
Manufacturing Method Sintered
Transport Package 25kg Paper Bag or 200kg Drum
Specification 10-60 mesh
Trademark LIT
Origin China

Product Description

AWS A5.23 Low Alloy Steel High Impact Property Welding consumables, SAW flux (SJ101G) Standard conforming to: GB /T5293 F5A2-H08MnA F5A4-H10Mn2 Standard equivalent to: AWS-A5.17 F7A4-EH14 F7A4-EM12K F7A4-EA2 DIN BFB 165AC12MHP5 Description and application: GJ-SJ101G is a ...

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JINAN LIT INDUSTRY CO., LTD.

Gold Member Since 2020

Audited Supplier

Business Type Manufacturer/Factory, Trading Company
Main Products Welding Wire, Welding Flux, Wear Plate, Carpet and Mat
Registered Capital 2000000 RMB
Plant Area 101~500 square meters
Management System Certification ISO 9001, ISO 9000, ISO 14001
Main Markets North America, South America, Southeast Asia, Oceania, Western Europe

Saw Flux Comparison

	Saw Submerged Arc Welding Flux Sj101 Sj101g Sj301 Sj431 Sj501 Sjf174 Sj38 Powder Wire Em12K H08A Em12 Eh14 Em13K Eh12K Material Contact Now	Quick View RoHS Pewter Pai Relief Relife Ppd Rl 405 Om 340 5100 No 5 PCB Reflow Lead Pb Free Solder Paste 138c for Stencil Printing Contact Now	Quick View Best BGA Ppd AG Style Welding Aim Om 340 Alpha Cookson Lead Free Solder Paste for Electronics SMD Reflow Reballing Contact Now	Quick View Tin Lead Halide Free Flux Soldering and Fct Felder Fluxite Fryolux Fusion Goot Henkel Heraeus Hercules Eutectic Solder Paste Contact Now	Quick View Instant Indium Innolot Inventec Johnson Jyd Kek Kester Ep256 Jet Printing Jetting Lead Free Solder Paste for Electronics Contact Now

Transaction Info
	Saw Submerged Arc Welding Flux Sj101 Sj101g Sj301 Sj431 Sj501 Sjf174 Sj38 Powder Wire Em12K H08A Em12 Eh14 Em13K Eh12K Material Contact Now	Quick View RoHS Pewter Pai Relief Relife Ppd Rl 405 Om 340 5100 No 5 PCB Reflow Lead Pb Free Solder Paste 138c for Stencil Printing Contact Now	Quick View Best BGA Ppd AG Style Welding Aim Om 340 Alpha Cookson Lead Free Solder Paste for Electronics SMD Reflow Reballing Contact Now	Quick View Tin Lead Halide Free Flux Soldering and Fct Felder Fluxite Fryolux Fusion Goot Henkel Heraeus Hercules Eutectic Solder Paste Contact Now	Quick View Instant Indium Innolot Inventec Johnson Jyd Kek Kester Ep256 Jet Printing Jetting Lead Free Solder Paste for Electronics Contact Now
Price	US $ 360.00-380.00/ Ton	US $ 30.00-80.00/ kg	US $ 30.00-80.00/ kg	US $ 20.00-60.00/ kg	US $ 30.00-80.00/ kg
Min Order	5 Tons	30 kg	30 kg	30 kg	30 kg
Trade Terms	-	-	-	-	-
Payment Terms	L/C, T/T, Western Union, Paypal, Money Gram	T/T, Western Union, Paypal, Money Gram	T/T, Western Union, Paypal, Money Gram	T/T, Western Union, Paypal, Money Gram	T/T, Western Union, Paypal, Money Gram
Quality Control
Product Certification	-	RoHS	RoHS	-	RoHS Lead Free
Management System Certification	ISO 9001, ISO 9000, ISO 14001	ISO 9001, ISO 14001	ISO 9001, ISO 14001	ISO 9001, ISO 14001	ISO 9001, ISO 14001
Trade Capacity
Export Markets	North America, South America, Southeast Asia, Oceania, Western Europe	North America, South America, Europe, Africa, Australia, Domestic, Others	North America, South America, Europe, Africa, Australia, Domestic, Others	North America, South America, Europe, Africa, Australia, Domestic, Others	North America, South America, Europe, Africa, Australia, Domestic, Others
Annual Export Revenue	-	-	-	-	-
Business Model	OEM	OEM, ODM, Own Brand	OEM, ODM, Own Brand	OEM, ODM, Own Brand	OEM, ODM, Own Brand
Average Lead Time	-	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)
Product Attributes
Specification	state: Solid; pH: Alkaline; Type: Organic; Melting Point: >600℃; Chemical Composition: SiO₂=10%-30%; Function: Remove Oxides, Protect Weld Metal; Application: Submerged-arc Welding, Electroslag Welding; Manufacturing Method: Sintered;	state: Liquid; pH: Neutral; Type: Solder Paste; Melting Point: <200℃; Chemical Composition: Sn-Bi; Function: Make the Liquid Solder Flow; Application: SMT; Manufacturing Method: Smelting; Alloy: Lead Free; Powder Size: Type 3: 25 to 45 Microns; Powder Size 2: Type 4: 20 to 38 Microns; Flux: No Clean Flux; Alloy 2: Sac305 Sn96.5AG3.0cu0.5; Alloy 3: Sac0307 Sn99AG0.3cu0.7; Alloy 4: Sn42bi58 Low Temperature; Packing: Jar; Packing 2: Syringe; Shipping: Courier / Air Freight; Shelf Life: 6months; Storage: 0 to 10 Degree Celsius; Application 2: for SMD SMT Component Reflow Soldering; Application 3: for Electronics Assembly by Stencil Printing;	state: Liquid; pH: Neutral; Type: Solder Paste; Melting Point: <200℃; Chemical Composition: Sn-Bi; Function: Make the Liquid Solder Flow; Application: SMT; Manufacturing Method: Smelting; Alloy: Lead Free; Powder Size: Type 3: 25 to 45 Microns; Powder Size 2: Type 4: 20 to 38 Microns; Flux: No Clean Flux; Alloy 2: Sac305 Sn96.5AG3.0cu0.5; Alloy 3: Sac0307 Sn99AG0.3cu0.7; Alloy 4: Sn42bi58 Low Temperature; Packing: Jar; Packing 2: Syringe; Shipping: Courier / Air Freight; Shelf Life: 6months; Storage: 0 to 10 Degree Celsius; Application 2: SMD;	state: Liquid; pH: Neutral; Type: Organic; Melting Point: <200℃; Chemical Composition: Tin; Function: Make the Liquid Solder Flow; Manufacturing Method: Smelting; Alloy: Tin Lead; Powder Size: Type 3: 25 to 45 Microns; Powder Size 2: Type 4: 20 to 38 Microns; Flux: No Clean Flux; Alloy 2: Sn63pb37; Alloy 3: Sn60pb40; Alloy 4: Sn55pb45; Alloy 5: Sn50pb50; Packing: Jar; Packing 2: Syringe; Shipping: Courier / Air Freight; Shelf Life: 6months; Storage: 0 to 10 Degree Celsius; Application 2: for SMT Reflow Soldering; Application 3: for PCB Assembly Soldering;	state: Liquid; pH: Neutral; Type: Solder Paste; Melting Point: <200℃; Chemical Composition: Sn-Bi; Function: Make the Liquid Solder Flow; Application: SMT; Manufacturing Method: Smelting; Alloy: Lead Free; Powder Size: Type 3: 25 to 45 Microns; Powder Size 2: Type 4: 20 to 38 Microns; Flux: No Clean Flux; Alloy 2: Sac305 Sn96.5AG3.0cu0.5; Alloy 3: Sac0307 Sn99AG0.3cu0.7; Alloy 4: Sn42bi58 Low Temperature; Packing: Jar; Packing 2: Syringe; Shipping: Courier / Air Freight; Shelf Life: 6months; Storage: 0 to 10 Degree Celsius; Application 2: for SMD SMT PCB Soldering; Application 3: for Jet Printing Jetting Soldering;
Supplier Name	JINAN LIT INDUSTRY CO., LTD.	Foshan Xi Feng Tin Products Co., Ltd.	Foshan Xi Feng Tin Products Co., Ltd.	Foshan Xi Feng Tin Products Co., Ltd.	Foshan Xi Feng Tin Products Co., Ltd.
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