PCB Solder Paste
US$30.00 / kg
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What is T3 T4 PCB LED Reballing Printing Soldering Solder Paste Sn62.8pb36.8AG0.4

About this Item
Details
Company Profile

Price

Min. Order Reference FOB Price

50 kg US$30.00 / kg

Sepcifications

  • Metal Coating Tin
  • Mode of Production SMT
  • Layers Double-Layer
  • Base Material FR-4
  • Certification ISO
  • Customized Customized
  • Condition New
  • Transport Package Foam Box
  • Specification 100g to 1000g
  • Trademark XF Solder
  • Origin China
  • Alloy Tin Lead
  • Powder Size Type 3: 25 to 45 Microns
  • Powder Size 2 Type 4: 20 to 38 Microns
  • Flux No Clean Flux
  • Alloy 2 Sn63pb37
  • Alloy 3 Sn60pb40
  • Alloy 4 Sn55pb45
  • Alloy 5 Sn50pb50
  • Packing Jar
  • Packing 2 Syringe
  • Shipping Courier / Air Freight
  • Shelf Life 6months
  • Storage 0 to 10 Degree Celsius
  • Application SMT
  • Application 2 SMD

Product Description

T3 T4 PCB LED Reballing Printing Soldering Solder Paste Sn62.8Pb36.8Ag0.4 We produce differenty types of solder paste: Lead Free Solder Paste: Sn96.5Ag3.0Cu0.5, Sn99Ag0.3Cu0.7, Sn42Bi58 etc Leaded Solder Paste: Sn63Pb37, Sn60Pb40, Sn50Pb50 etc Applications of Tin Lead Solder Paste Sn63Pb37 ...

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PCB Solder Paste Comparison
Transaction Info
Price US $ 30/ kg US $ 0.10-5.00/ Piece US $ 0.10-10.00/ Piece Negotiable US $ 1.2/ PCS
Min Order 50 kg 1 Pieces 1 Pieces 1 PCS 1 PCS
Trade Terms - - - - -
Payment Terms T/T, Western Union, Paypal, Money Gram L/C, T/T, D/P, Western Union, Paypal, Money Gram T/T, Paypal, Discussion L/C, T/T, Paypal L/C, T/T, Paypal
Quality Control
Product Certification ISO RoHS, CCC, ISO RoHS, CCC, ISO RoHS, ISO, UL RoHS, ISO, UL
Management System Certification ISO 9001, ISO 14001 ISO 9001, ISO 14001, IATF16949, ISO 13485 ISO 9001, ISO 9000, BSCI ISO 9001, ISO 9000, ISO 14001, ISO 14000, ISO 20000, OHSAS/ OHSMS 18001, IATF16949 ISO 9001, ISO 9000, ISO 14001, ISO 14000, ISO 20000, OHSAS/ OHSMS 18001, IATF16949
Trade Capacity
Export Markets North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Mid East, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Oceania, Western Europe North America, South America, Eastern Europe, Southeast Asia, Oceania, Western Europe
Annual Export Revenue - - - - -
Business Model OEM, ODM, Own Brand OEM, ODM, Own Brand OEM, ODM OEM OEM
Average Lead Time Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: 1-3 Month(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Product Attributes
Specification
Metal Coating: Tin;
Mode of Production: SMT;
Layers: Double-Layer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Alloy: Tin Lead;
Powder Size: Type 3: 25 to 45 Microns;
Powder Size 2: Type 4: 20 to 38 Microns;
Flux: No Clean Flux;
Alloy 2: Sn63pb37;
Alloy 3: Sn60pb40;
Alloy 4: Sn55pb45;
Alloy 5: Sn50pb50;
Packing: Jar;
Packing 2: Syringe;
Shipping: Courier / Air Freight;
Shelf Life: 6months;
Storage: 0 to 10 Degree Celsius;
Application: SMT;
Application 2: SMD;
Metal Coating: Copper;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Board Thickness: 1.7mm;
Copper Thickness: 1oz;
Test: Flying Probe & Fixture;
Solder Mask Type: Green;
Min.Line Width/Space: 0.2mm;
Metal Coating: Copper;
Mode of Production: SMT;
Layers: Double-Layer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
PCB/PCBA Max Size: 400*310mm;
Production Lines: SMT &DIP Production Lines , Assembly Lines;
Order Qty: No Limited;
Shipping Method: by Air, by Sea, by Land;
Metal Coating: Copper;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: CEM-4;
Customized: Customized;
Condition: New;
Board Layer: 6L;
Surface Finihsing: Immersion Gold;
Lead Time: 6-8 Working Days;
Board Thickness: 0.5mm-7.0mm;
Material: Fr-4, Cem-1/Cem-3, Pi,High Tg,Rogers;
Max Panel Size: 32"×48"(800mm×1200mm);
Min Hole Size: 0.02mm;
Min Line Width: 3mil(0.075mm);
Copper Thickness: 0.2-7.0oz;
Soldermask: Green/Yellow/Black/White/Red/Blue;
Silkscreen: Red/Yellow/Black/White;
Min Pad: 5mil(0.13mm);
Certificate: UL,ISO 9001,ISO14001,IATF16949;
Material Suppilers: Shengyi, Kb, Nanya, Iteq,etc.;
Metal Coating: Copper;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Board Layer: 8L;
Surface Finihsing: Immersion Gold;
Lead Time: 6-8 Working Days;
Board Thickness: 0.5mm-7.0mm;
Material: Fr-4, Cem-1/Cem-3, Pi, High Tg, Rogers;
Max Panel Size: 32"×48"(800mm×1200mm);
Min Hole Size: 0.02mm;
Min Line Width: 3mil(0.075mm);
Copper Thickness: 0.2-7.0oz;
Soldermask: Green/Yellow/Black/White/Red/Blue;
Silkscreen: Red/Yellow/Black/White;
Min Pad: 5mil(0.13mm);
Certificate: UL, ISO 9001, ISO14001, IATF16949;
Material Suppilers: Shengyi, Kb, Nanya, Iteq, etc.;
Supplier Name

Foshan Xi Feng Tin Products Co., Ltd.

China Supplier - Gold Member Audited Supplier

Usun Electronics Limited.,

China Supplier - Gold Member Audited Supplier

Kenling Electronics Co., Ltd.

China Supplier - Diamond Member Audited Supplier

Ucreate PCB Co., Ltd.

China Supplier - Diamond Member Audited Supplier

Ucreate PCB Co., Ltd.

China Supplier - Diamond Member Audited Supplier