Integrated Circuit Sop Multilayer Ceramic 14 Wire Packaging Melt Sealed Semiconductor Housing pictures & photos

Integrated Circuit Sop Multilayer Ceramic 14 Wire Packaging Melt Sealed Semiconductor Housing

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Price

Min. Order Reference FOB Price

300 Pieces US$25.00 / Piece

Sepcifications

shape Flat
Conductive Type 1
Integration 1
Technics Semiconductor IC
Transport Package Carton
Origin China
ODM OEM

Product Description

Integrated circuit black ceramic low-temperature glass double row narrow body base Black ceramic low-temperature glass packaging is a technology that uses low melting point glass and black alumina ceramic as materials to package and protect IC chips. Black ceramic is an ideal material for various ...

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Fuzhou Xinxu Technology Co., Ltd

Gold Member Since 2023

Audited Supplier

Business Type Trading Company
Main Products Chip packaging carrier
Number of Employees 5
Year of Establishment 2022-09-21
Management System Certification The company have the quality management system
Average Lead Time Peak Season Lead Time: one month
Off Season Lead Time: within 15 workdays

IC Electronic Components Comparison

	Integrated Circuit Sop Multilayer Ceramic 14 Wire Packaging Melt Sealed Semiconductor Housing Contact Now	Quick View Chipsun Best Quality Electronic Circuit Components Si52111-B3-GM2r Contact Now	Quick View Chipsun Best Seller Electronic Components Assembly Machine 9dB833agilf Contact Now	Quick View Chipsun Promotion Sale Electronic Components Distributor 9dB833agilf Contact Now	Quick View Chipsun Hot Sale Electric Components Electronic 9dB833agilf Contact Now

Transaction Info
	Integrated Circuit Sop Multilayer Ceramic 14 Wire Packaging Melt Sealed Semiconductor Housing Contact Now	Quick View Chipsun Best Quality Electronic Circuit Components Si52111-B3-GM2r Contact Now	Quick View Chipsun Best Seller Electronic Components Assembly Machine 9dB833agilf Contact Now	Quick View Chipsun Promotion Sale Electronic Components Distributor 9dB833agilf Contact Now	Quick View Chipsun Hot Sale Electric Components Electronic 9dB833agilf Contact Now
Price	US $ 25/ Piece	US $ 1.59-3.03/ Piece	US $ 3.30-6.80/ Piece	US $ 3.30-5.63/ Piece	US $ 3.30-4.88/ Piece
Min Order	300 Pieces	1 Pieces	1 Pieces	25 Pieces	100 Pieces
Trade Terms	-	-	-	-	-
Payment Terms	L/C, T/T, D/P, Western Union, Paypal, Money Gram	T/T, Western Union, Paypal	T/T, Western Union, Paypal	T/T, Western Union, Paypal	T/T, Western Union, Paypal
Quality Control
Management System Certification	-	ISO 9001	ISO 9001	ISO 9001	ISO 9001
Trade Capacity
Export Markets	North America, South America, Europe, Southeast Asia/ Mideast	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
Annual Export Revenue	-	-	-	-	-
Business Model	-	Own Brand	Own Brand	Own Brand	Own Brand
Average Lead Time	-	Off-season: within 15 Day(s) Peak-season: 1-3 Month(s)	Off-season: within 15 Day(s) Peak-season: 1-3 Month(s)	Off-season: within 15 Day(s) Peak-season: 1-3 Month(s)	Off-season: within 15 Day(s) Peak-season: 1-3 Month(s)
Product Attributes
Specification	shape: Flat; Conductive Type: 1; Integration: 1; Technics: Semiconductor IC; ODM: OEM;	shape: -; Conductive Type: -; Integration: Standard Edition; Technics: Standard Edition;	shape: -; Conductive Type: Standard Edition; Integration: Standard; Technics: Standard;	shape: -; Conductive Type: Standard; Integration: -; Technics: Standard;	shape: -; Conductive Type: Standard; Integration: -; Technics: Standard;
Supplier Name	Fuzhou Xinxu Technology Co., Ltd	Chip Sun Technology Co., Ltd.	Chip Sun Technology Co., Ltd.	Chip Sun Technology Co., Ltd.	Chip Sun Technology Co., Ltd.
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