IC Electronic Components
US$1.47 / Piece
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Sop Encapsulated Chip Black Ceramic 16 Wire Housing Video

About this Item
Details
Company Profile

Price

Min. Order Reference FOB Price

500 Pieces US$1.47 / Piece

Sepcifications

  • shape Flat
  • Conductive Type 1
  • Integration 1
  • Technics Semiconductor IC
  • Transport Package Carton
  • Specification 4.3mm*6mm
  • Origin China

Product Description

Integrated Circuit Ceramic Flat Package(SOP type and CQFP type) Black ceramic cryogenic glass packaging is a technology that uses low melting point glass and black alumina ceramics as materials to package and protect IC chips, small size, with good mechanical, electrical and chemical properties, ...

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IC Electronic Components Comparison
Transaction Info
Price US $ 1.47/ Piece US $ 0.10-1.00/ Piece US $ 0.10-1.00/ Piece US $ 0.10-1.00/ Piece US $ 0.44-1.21/ Piece
Min Order 500 Pieces 1000 Pieces 1000 Pieces 1000 Pieces 1 Pieces
Trade Terms - - - - -
Payment Terms L/C, T/T, D/P, Western Union, Paypal, Money Gram T/T, Western Union, Paypal T/T, Western Union, Paypal T/T, Western Union, Paypal L/C, T/T, D/P, Western Union, Paypal, Money Gram
Quality Control
Product Certification - - - - ISO9001/RoHS/ISO14001/ISO13485/Ts16949
Management System Certification - ISO 9001, ISO 9000, ISO 14001, ISO 14000, IATF16949, HSE ISO 9001, ISO 9000, ISO 14001, ISO 14000, IATF16949, HSE ISO 9001, ISO 9000, ISO 14001, ISO 14000, IATF16949, HSE ISO 9001, ISO 14001, IATF16949, ISO 13485
Trade Capacity
Export Markets North America, South America, Europe, Southeast Asia/ Mideast North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, Europe, Southeast Asia/ Mideast, East Asia(Japan/ South Korea)
Annual Export Revenue - - - - -
Business Model - OEM, ODM OEM, ODM OEM, ODM OEM, ODM
Average Lead Time - Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
-
Product Attributes
Specification
shape: Flat;
Conductive Type: 1;
Integration: 1;
Technics: Semiconductor IC;
shape: Flat;
Conductive Type: Unipolar Integrated Circuit;
Integration: GSI;
Technics: Thick Film IC;
Category: Ferrite Beads and Chips;
Packing Qty: 4000PCS;
Mounting Type: Surface Mount;
Package: Tape & Reel (Tr);
Series: Maf;
shape: Flat;
Conductive Type: Unipolar Integrated Circuit;
Integration: GSI;
Technics: Thick Film IC;
Category: Ferrite Beads and Chips;
Packing Qty: 4000PCS;
Mounting Type: Surface Mount;
Package: Tape & Reel (Tr);
Series: Maf;
shape: Flat;
Conductive Type: Unipolar Integrated Circuit;
Integration: GSI;
Technics: Thick Film IC;
Category: Ferrite Beads and Chips;
Packing Qty: 4000PCS;
Mounting Type: Surface Mount;
Package: Tape & Reel (Tr);
Series: Maf;
shape: DIP;
Conductive Type: Unipolar Integrated Circuit;
Integration: GSI;
Technics: Semiconductor IC;
MOQ: 1PCS;
Condition: 100% New and Original;
Installation: SMD SMT DIP;
Product Name: Electronics Components;
Supplier Name

Fuzhou Xinxu Technology Co., Ltd

China Supplier - Gold Member Audited Supplier

Shanghai Gawin Electronic Technology Co., Ltd.

China Supplier - Diamond Member Audited Supplier

Shanghai Gawin Electronic Technology Co., Ltd.

China Supplier - Diamond Member Audited Supplier

Shanghai Gawin Electronic Technology Co., Ltd.

China Supplier - Diamond Member Audited Supplier

Mu Star (shenzhen) Industry Co., Ltd.

China Supplier - Diamond Member Audited Supplier