Fr4 Air Conditioner Universal PCB Board pictures & photos

Fr4 Air Conditioner Universal PCB Board

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Price

Min. Order Reference FOB Price

1 Piece US$60.00-80.00 / Piece

Sepcifications

Type Rigid Circuit Board
Dielectric FR-4
Material Paper Phenolic Copper Foil Substrate
Flame Retardant Properties V0
Mechanical Rigid Rigid
Processing Technology Electrolytic Foil
Base Material Copper
Insulation Materials Epoxy Resin
Transport Package Vacuum Package
Specification Normal
Trademark XJY
Origin China
Copper Thickness 1oz
Surface Finishing OSP
Solder Mask Type Blue
Silkscreen White
Board Thickness 1.6mm
Min. Hole Size 0.2mm
Min. Line Spacing 0.15mm
Min. Line Width 0.15mm
Solder Mask Green
Legend Mask White

Product Description

------------Welcome to our website! ! XinJiaye is able to offer one stop 1 to 24 Layer PCB fabrication, PCB manufacturing, component sourcing,PCB Assembly, PCBA Test, Reverse engineering service; FPC fabrication, Aluminium base fabrication, Inverter Circuit PCB,Double Side PCB.,Cooker PCB ...

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Shenzhen Xinjiaye Electronics Technology Co., Ltd.

Gold Member Since 2013

Audited Supplier

Business Type Manufacturer/Factory, Trading Company
Main Products PCB, PCB Board, Aluminum PCB, FPC, PCBA, LED PCB, PCB Assembly, Printed Circuit Board, Rigid PCB, MCPCB
Terms of Payment LC, T/T, D/P, PayPal, Western Union, Small-amount payment, Money Gram
Average Lead Time Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays

Air Conditioner PCB Board Comparison

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Transaction Info
	Fr4 Air Conditioner Universal PCB Board Contact Now	Quick View Custom Big Size HDI Multilayer Board with 0.1mm Laser Vias in Shenzhen Pads File Hard Disk PCB Price Contact Now	Quick View OEM Small Size Multilayer High Precision Assembly Service PCBA Manufacture HDD Donor PCB with Provided Gerber Contact Now	Quick View Rigid-Flex PCB Board 94V-0 RoHS 0.2mm Thickness Multilayer Flex Circuits PCB with America DuPont Material Contact Now	Quick View Shenzhen OEM Car Multilayer PCBA 94V0 RoHS PCBA Board SMD Electronic Service HDI PCB Any Layer with Reasonable Price Contact Now
Price	US $ 60.00-80.00/ Piece	US $ 0.10-10.00/ Piece	US $ 0.10-10.00/ Piece	US $ 0.10-10.00/ Piece	US $ 0.10-10.00/ Piece
Min Order	1 Pieces	1 Pieces	1 Pieces	1 Pieces	1 Pieces
Trade Terms	FOB, CFR, EXW, CIF, DAT, FAS, DDP, DAP, CIP, CPT, FCA	-	-	-	-
Payment Terms	L/C, T/T, D/P, Western Union, Paypal, Money Gram	L/C, T/T, D/P, Western Union, Paypal, XT	L/C, T/T, D/P, Western Union, Paypal, XT	L/C, T/T, D/P, Western Union, Paypal, XT	L/C, T/T, D/P, Western Union, Paypal, XT
Quality Control
Management System Certification	ISO 9001, ISO 14001	-	-	-	-
Trade Capacity
Export Markets	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
Annual Export Revenue	-	-	-	-	-
Business Model	OEM, ODM	OEM, ODM, Own Brand	OEM, ODM, Own Brand	OEM, ODM, Own Brand	OEM, ODM, Own Brand
Average Lead Time	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)
Product Attributes
Specification	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Paper Phenolic Copper Foil Substrate; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Copper; Insulation Materials: Epoxy Resin; Copper Thickness: 1oz; Surface Finishing: OSP; Solder Mask Type: Blue; Silkscreen: White; Board Thickness: 1.6mm; Min. Hole Size: 0.2mm; Min. Line Spacing: 0.15mm; Min. Line Width: 0.15mm; Solder Mask: Green; Legend Mask: White;	Type: Combining Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Aerospace; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Sy Fr4; Insulation Materials: Organic Resin; Brand: Kxpcba; Material Brand: Sy / Rogers/ Arlon / Polymide / Aluminum / Kapt; Copper Weights: 0.5oz~10oz; Layer Count: 1-64 Layers; Stack up: Control Dielectric/Control Impedance/Tdr Testing; Surface Finish: HASL/Enig/Enepig/Hard Gold/Wire Bonded Gold/Immers; Vias: Blind-Buried/Via-in-Pad/Pofv/Filled-Vias/Epoxy Res; Stack Via: 5step; Stagger Via: 5step; Laser Via Hole Size: 0.1mm; Filling Via Dimple Value: <=15um; Laser Via Capture Pad Size: 0.25mm;	Type: Combining Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Aerospace; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Sy Fr4; Insulation Materials: Organic Resin; Brand: Kxpcba; Material Brand: Sy / Rogers/ Arlon / Polymide / Aluminum / Kapt; Copper Weights: 0.5oz~10oz; Layer Count: 1-64 Layers; Stack up: Control Dielectric/Control Impedance/Tdr Testing; Surface Finish: HASL/Enig/Enepig/Hard Gold/Wire Bonded Gold/Immers; Vias: Blind-Buried/Via-in-Pad/Pofv/Filled-Vias/Epoxy Res; Stack Via: 5step; Stagger Via: 5step; Laser Via Hole Size: 0.1mm; Filling Via Dimple Value: <=15um; Laser Via Capture Pad Size: 0.25mm;	Type: Combining Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Aerospace; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Sy Fr4; Insulation Materials: Organic Resin; Brand: Kxpcba; Material Brand: Sy / Rogers/ Arlon / Polymide / Aluminum / Kapt; Copper Weights: 0.5oz~10oz; Layer Count: 1-64 Layers; Stack up: Control Dielectric/Control Impedance/Tdr Testing; Surface Finish: HASL/Enig/Enepig/Hard Gold/Wire Bonded Gold/Immers; Vias: Blind-Buried/Via-in-Pad/Pofv/Filled-Vias/Epoxy Res; Stack Via: 5step; Stagger Via: 5step; Laser Via Hole Size: 0.1mm; Filling Via Dimple Value: <=15um; Laser Via Capture Pad Size: 0.25mm;	Type: Combining Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Aerospace; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Sy Fr4; Insulation Materials: Organic Resin; Brand: Kxpcba; Material Brand: Sy / Rogers/ Arlon / Polymide / Aluminum / Kapt; Copper Weights: 0.5oz~10oz; Layer Count: 1-64 Layers; Stack up: Control Dielectric/Control Impedance/Tdr Testing; Surface Finish: HASL/Enig/Enepig/Hard Gold/Wire Bonded Gold/Immers; Vias: Blind-Buried/Via-in-Pad/Pofv/Filled-Vias/Epoxy Res; Stack Via: 5step; Stagger Via: 5step; Laser Via Hole Size: 0.1mm; Filling Via Dimple Value: <=15um; Laser Via Capture Pad Size: 0.25mm;
Supplier Name	Shenzhen Xinjiaye Electronics Technology Co., Ltd.	Shenzhen Jinxiong Electronic Co., Ltd	Shenzhen Jinxiong Electronic Co., Ltd	Shenzhen Jinxiong Electronic Co., Ltd	Shenzhen Jinxiong Electronic Co., Ltd
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