PCB Manufacturer/ PCB Design /PCB Assembly

About this Item
Details
Company Profile

Price

Min. Order Reference FOB Price

1 Piece US$0.10 / Piece

Sepcifications

  • Type Combining Rigid Circuit Board
  • Dielectric FR-4
  • Material Fiberglass Epoxy
  • Application Consumer Electronics
  • Flame Retardant Properties V0
  • Mechanical Rigid Rigid
  • Processing Technology Electrolytic Foil
  • Base Material Fr4
  • Insulation Materials Organic Resin
  • Transport Package Vacuum Package
  • Specification Normal
  • Trademark XJYPCB
  • Origin China
  • Surface Finishing HASL Lead Free
  • Copper Thickness 1oz
  • Board Thickness 1.6mm
  • Min. Hole Size 0.2mm
  • Min. Line Width 0.2mm
  • Min. Line Spacing 0.2mm
  • Wrap and Twist 5%
  • Color Blue
  • Max Board Size 1200mm*600mm
  • Certificate UL, RoHS, SGS, ISO 9001, Ect

Product Description

Welcome to XJY---------- XinJiaye is able to offer one stop 1 to 24 Layer PCB fabrication, PCB manufacturing, component sourcing, PCB Assembly, PCBA Test, Reverse engineering service; FPC fabrication, Aluminium base fabrication, High Frequency Board fabrica-tion. ====++++====Quick ...

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PCB Manufacture Comparison
Transaction Info
Price US $ 0.1/ Piece US $ 1/ Piece US $ 1/ Piece US $ 1/ Piece US $ 1/ Piece
Min Order 1 Pieces 1000 Pieces 1000 Pieces 1000 Pieces 1000 Pieces
Trade Terms FOB, CFR, EXW, CIF, DAT, FAS, DDP, DAP, CIP, CPT, FCA - - - -
Payment Terms L/C, T/T, D/P, Western Union, Paypal, Money Gram L/C, T/T, Western Union, Paypal L/C, T/T, Western Union, Paypal L/C, T/T, Western Union, Paypal L/C, T/T, Western Union, Paypal
Quality Control
Product Certification UL, RoHS, SGS, ISO 9001, Ect RoHS RoHS RoHS RoHS
Management System Certification ISO 9001, ISO 14001 ISO 9001, ISO 20000 ISO 9001, ISO 20000 ISO 9001, ISO 20000 ISO 9001, ISO 20000
Trade Capacity
Export Markets North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe South America, Europe, Africa South America, Europe, Africa South America, Europe, Africa South America, Europe, Africa
Annual Export Revenue - - - - -
Business Model OEM, ODM OEM, ODM OEM, ODM OEM, ODM OEM, ODM
Average Lead Time Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: 6-12 Month(s)
Peak-season: 6-12 Month(s)
Off-season: 6-12 Month(s)
Peak-season: 6-12 Month(s)
Off-season: 6-12 Month(s)
Peak-season: 6-12 Month(s)
Off-season: 6-12 Month(s)
Peak-season: 6-12 Month(s)
Product Attributes
Specification
Type: Combining Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Fr4;
Insulation Materials: Organic Resin;
Surface Finishing: HASL Lead Free;
Copper Thickness: 1oz;
Board Thickness: 1.6mm;
Min. Hole Size: 0.2mm;
Min. Line Width: 0.2mm;
Min. Line Spacing: 0.2mm;
Wrap and Twist: 5%;
Color: Blue;
Max Board Size: 1200mm*600mm;
Type: Combining Rigid Circuit Board;
Dielectric: FR-4;
Material: Aluminum Covered Copper Foil Layer;
Application: Communication;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: Sum;
PCB Layer: 2-4 Layers;
Baser Material: Fr4;
Board Thickness: 1mm;
Copper Thickness: 0.35mm;
Type: Combining Rigid Circuit Board;
Dielectric: FR-4;
Material: Aluminum Covered Copper Foil Layer;
Application: Communication;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: Sum;
PCB Layer: 2-4 Layers;
Baser Material: Fr4;
Board Thickness: 1mm;
Copper Thickness: 0.35mm;
Type: Combining Rigid Circuit Board;
Dielectric: FR-4;
Material: Aluminum Covered Copper Foil Layer;
Application: Communication;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: Sum;
PCB Layer: 2-4 Layers;
Baser Material: Fr4;
Board Thickness: 1mm;
Copper Thickness: 0.35mm;
Type: Combining Rigid Circuit Board;
Dielectric: FR-4;
Material: Aluminum Covered Copper Foil Layer;
Application: Communication;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: Sum;
PCB Layer: 2-4 Layers;
Baser Material: Fr4;
Board Thickness: 1mm;
Copper Thickness: 0.35mm;
Supplier Name

Shenzhen Xinjiaye Electronics Technology Co., Ltd.

China Supplier - Gold Member Audited Supplier

Yueqing Page Electrical Co., Ltd.

China Supplier - Gold Member Audited Supplier

Yueqing Page Electrical Co., Ltd.

China Supplier - Gold Member Audited Supplier

Yueqing Page Electrical Co., Ltd.

China Supplier - Gold Member Audited Supplier

Yueqing Page Electrical Co., Ltd.

China Supplier - Gold Member Audited Supplier