Rigid Circuit Board
US$0.10 / Piece
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About this Item
Details
Company Profile

Price

Min. Order Reference FOB Price

1 Piece US$0.10 / Piece

Sepcifications

  • Structure Metal Base Rigid PCB
  • Dielectric FR-4
  • Material Polyester Glass Fiber Mat Laminate
  • Application Consumer Electronics
  • Flame Retardant Properties V0
  • Processing Technology Electrolytic Foil
  • Production Process Subtractive Process
  • Base Material Fr4
  • Insulation Materials Epoxy Resin
  • Transport Package Vacuum Package
  • Specification Normal
  • Trademark XJYPCB
  • Origin China
  • Surface Finishing Lf-Hal
  • Copper Thickness 1oz
  • Board Thickness 1.6mm
  • Min. Hole Size 0.2mm
  • Min. Line Wigth 0.15mm
  • Min. Line Spacing 0.15mm
  • Color White
  • Size 52*1.6mm
  • Certificate RoHS, UL, SGS, Ect
  • Package Vacuum

Product Description

WELCOME TO XJY------------------------ Shenzhen Xinjiaye Electronics Technology Co., Ltd is a professional pcb manufacturer has over 10 years experience. We are able to offer 1 to 24 Layer PCB, ranging from pcb produce, components purchase, pcb assembly, pcb copy service.Our products are widely ...

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Rigid Circuit Board Comparison
Transaction Info
Price US $ 0.1/ Piece US $ 0.08/ PCS US $ 0.06-0.08/ PCS US $ 0.06-0.08/ PCS US $ 0.08/ PCS
Min Order 1 Pieces 1 PCS 1 PCS 1 PCS 2 PCS
Trade Terms FOB, CFR, CIF, DAT, FAS, DDP, DAP, CIP, CPT, FCA, EXW FOB, DAT, DDP, DAP, CIP, CPT, EXW FOB, DAT, DDP, DAP, CIP, CPT, EXW FOB, DAT, DDP, DAP, CIP, CPT, EXW FOB, DAT, DDP, DAP, CIP, CPT, EXW
Payment Terms L/C, T/T, D/P, Western Union, Paypal, Money Gram L/C, T/T, D/P, Paypal L/C, T/T, D/P, Paypal L/C, T/T, D/P, Paypal L/C, T/T, D/P, Paypal
Quality Control
Product Certification RoHS, UL, SGS, Ect - - - -
Management System Certification ISO 9001, ISO 14001 ISO 9001, ISO 9000, ISO 14001, ISO 14000, ISO 20000, OHSAS/ OHSMS 18001, IATF16949 ISO 9001, ISO 9000, ISO 14001, ISO 14000, ISO 20000, OHSAS/ OHSMS 18001, IATF16949 ISO 9001, ISO 9000, ISO 14001, ISO 14000, ISO 20000, OHSAS/ OHSMS 18001, IATF16949 ISO 9001, ISO 9000, ISO 14001, ISO 14000, ISO 20000, OHSAS/ OHSMS 18001, IATF16949
Trade Capacity
Export Markets North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Oceania, Western Europe North America, South America, Eastern Europe, Southeast Asia, Oceania, Western Europe North America, South America, Eastern Europe, Southeast Asia, Oceania, Western Europe North America, South America, Eastern Europe, Southeast Asia, Oceania, Western Europe
Annual Export Revenue - - - - -
Business Model OEM, ODM OEM OEM OEM OEM
Average Lead Time Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Product Attributes
Specification
Structure: Metal Base Rigid PCB;
Dielectric: FR-4;
Material: Polyester Glass Fiber Mat Laminate;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Subtractive Process;
Base Material: Fr4;
Insulation Materials: Epoxy Resin;
Surface Finishing: Lf-Hal;
Copper Thickness: 1oz;
Board Thickness: 1.6mm;
Min. Hole Size: 0.2mm;
Min. Line Wigth: 0.15mm;
Min. Line Spacing: 0.15mm;
Color: White;
Size: 52*1.6mm;
Package: Vacuum;
Structure: Single-Sided Rigid PCB;
Dielectric: AIN;
Material: Epoxide Woven Glass Fabric Laminate;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Subtractive Process;
Base Material: Aluminum;
Insulation Materials: Epoxy Resin;
Surface Finihsing: Lf HASL;
Board Layer: 1 Layers;
Lead Time: 6 Working Days;
Structure: Single-Sided Rigid PCB;
Dielectric: AIN;
Material: Epoxide Woven Glass Fabric Laminate;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Subtractive Process;
Base Material: Aluminum;
Insulation Materials: Epoxy Resin;
Brand: Ucreate;
Surface Finihsing: Lf HASL;
Board Layer: 1 Layers;
Lead Time: 6 Working Days;
Structure: Single-Sided Rigid PCB;
Dielectric: CEM-3;
Material: Epoxide Woven Glass Fabric Laminate;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Subtractive Process;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Ucreate;
Surface Finihsing: Lf HASL;
Board Layer: 1 Layers;
Lead Time: 6 Working Days;
Structure: Double-Sided Rigid PCB;
Dielectric: AIN;
Material: Epoxide Woven Glass Fabric Laminate;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Subtractive Process;
Base Material: Aluminum;
Insulation Materials: Epoxy Resin;
Brand: Ucreate;
Surface Finihsing: Immersion/ Chemical Gold;
Board Layer: 2 Layers;
Lead Time: 6 Working Days;
Supplier Name

Shenzhen Xinjiaye Electronics Technology Co., Ltd.

China Supplier - Gold Member Audited Supplier

Ucreate PCB Co., Ltd.

China Supplier - Diamond Member Audited Supplier

Ucreate PCB Co., Ltd.

China Supplier - Diamond Member Audited Supplier

Ucreate PCB Co., Ltd.

China Supplier - Diamond Member Audited Supplier

Ucreate PCB Co., Ltd.

China Supplier - Diamond Member Audited Supplier