High-Density Mobile PCB
US$4.70-4.80 / Piece
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What is High-Density PCB for Mobile Phones

About this Item
Details
Company Profile

Price

Purchase Qty. Reference FOB Price

10-999 Pieces US$4.80

1,000+ Pieces US$4.70

Sepcifications

  • Type Rigid Circuit Board
  • Dielectric FR-4
  • Material Fiberglass Epoxy
  • Application Consumer Electronics
  • Flame Retardant Properties V0
  • Mechanical Rigid Rigid
  • Processing Technology Electrolytic Foil
  • Base Material Copper
  • Insulation Materials Epoxy Resin
  • Brand Shengyi, Kb, Nanya, Ilm
  • Transport Package Vacuum Packaging
  • Specification 39*45mm
  • Trademark XMANDA
  • Origin Made in China
  • Criteria Aql II 0.65
  • Hole Sizes 0.25mm
  • Bevel Edge Yes
  • Impedance 50/90/100 Ohm
  • Trace Width(Min.) 4mil
  • Surfaec Treatment Enig+OSP

Product Description

Specifications: Layers: 10 Thickness:1.6mm Material: FR4 KB6160 Size:39*45mm Surface treatment: ENIG+OSP Line width/spacing: 0.076/0.102mm Minimum aperture: 0.2mm Solder mask color: Black Finished copper thickness: 1/1 OZ Features: 1. The integration of the board design is very ...

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High-Density Mobile PCB Comparison
Transaction Info
Price US $ 4.70-4.80/ Piece US $ 0.39-2.19/ Piece US $ 0.99/ Piece US $ 0.39-2.19/ Piece US $ 0.39-2.19/ Piece
Min Order 10 Pieces 1 Pieces 1 Pieces 1 Pieces 1 Pieces
Trade Terms - - - - -
Payment Terms T/T T/T, Western Union, Paypal, Money Gram L/C, T/T, Paypal T/T, Western Union, Paypal, Money Gram T/T, Western Union, Paypal, Money Gram
Quality Control
Management System Certification ISO 9001, ISO 14001, IATF16949 ISO 9001, ISO 14001, IATF16949 ISO 9001, ISO 9000, ISO 14001, ISO 14000, ISO 20000, IATF16949 ISO 9001, ISO 14001, IATF16949 ISO 9001, ISO 14001, IATF16949
Trade Capacity
Export Markets - North America, South America, Eastern Europe, Southeast Asia, Africa, Mid East, Eastern Asia, Western Europe - North America, South America, Eastern Europe, Southeast Asia, Africa, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Mid East, Eastern Asia, Western Europe
Annual Export Revenue - - - - -
Business Model OEM, ODM OEM, ODM OEM, ODM OEM, ODM OEM, ODM
Average Lead Time - Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
- Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Product Attributes
Specification
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Shengyi, Kb, Nanya, Ilm;
Criteria: Aql II 0.65;
Hole Sizes: 0.25mm;
Bevel Edge: Yes;
Impedance: 50/90/100 Ohm;
Trace Width(Min.): 4mil;
Surfaec Treatment: Enig+OSP;
Type: Rigid Circuit Board, Rigid Circuit Board;
Dielectric: FR-4, Fr-4;
Material: Fiberglass Epoxy Resin + Polyimide Resin, Fiberglass Epoxy Resin + Polyimide Resin;
Application: Medical Instruments, Communication;
Flame Retardant Properties: V2, V1;
Mechanical Rigid: Rigid, Rigid;
Processing Technology: Electrolytic Foil, Electrolytic Foil;
Base Material: Copper, Copper;
Insulation Materials: Epoxy Resin, Epoxy Resin;
Brand: Szx, Szx;
Layers: Multilayer;
Solder Marsk: Green, Black, Blue, Red, Yellow, White;
Hole: Mechanical Hole, Laser Hole;
Assembly: Components;
Processing: SMT and DIP;
Surface Treatment: HASL, Immersion Gold, OSP;
Service Providing: PCB Production, PCB Assembly, Components Sourcing;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Complex;
Application: Consumer Electronics;
Flame Retardant Properties: HB;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: Tecircuit;
Type: Rigid Circuit Board, Rigid Circuit Board;
Dielectric: FR-4, Fr-4;
Material: Fiberglass Epoxy Resin + Polyimide Resin, Fiberglass Epoxy Resin + Polyimide Resin;
Application: Medical Instruments, Communication;
Flame Retardant Properties: V2, V1;
Mechanical Rigid: Rigid, Rigid;
Processing Technology: Electrolytic Foil, Electrolytic Foil;
Base Material: Copper, Copper;
Insulation Materials: Epoxy Resin, Epoxy Resin;
Brand: Szx, Szx;
Layers: Multilayer;
Solder Marsk: Green, Black, Blue, Red, Yellow, White;
Hole: Mechanical Hole, Laser Hole;
Assembly: Components;
Processing: SMT and DIP;
Surface Treatment: HASL, Immersion Gold, OSP;
Service Providing: PCB Production, PCB Assembly, Components Sourcing;
Type: Rigid Circuit Board, Rigid Circuit Board;
Dielectric: FR-4, Fr-4;
Material: Fiberglass Epoxy Resin + Polyimide Resin, Fiberglass Epoxy;
Application: Medical Instruments, Consumer Electronics;
Flame Retardant Properties: V2, V1;
Mechanical Rigid: Rigid, Rigid;
Processing Technology: Electrolytic Foil, Electrolytic Foil;
Base Material: Copper, Copper;
Insulation Materials: Epoxy Resin, Epoxy Resin;
Brand: Szx, Szx;
Model: PCB;
Layers: Multilayer;
Solder Marsk: Green, Black, Blue, Red, Yellow, White;
Hole: Mechanical Hole, Laser Hole;
Assembly: Components;
Processing: SMT and DIP;
Surface Treatment: HASL, Immersion Gold, OSP;
Service Providing: PCB Production, PCB Assembly, Components Sourcing;
Supplier Name

Shenzhen Xinmanda Printed Circuit Board Co., Ltd.

China Supplier - Diamond Member Audited Supplier

Shenzexin Electronic (Hongkong) Co., Ltd.

China Supplier - Gold Member Audited Supplier

Shenzhen Tecircuit Electronic Limited

China Supplier - Gold Member Audited Supplier

Shenzexin Electronic (Hongkong) Co., Ltd.

China Supplier - Gold Member Audited Supplier

Shenzexin Electronic (Hongkong) Co., Ltd.

China Supplier - Gold Member Audited Supplier