8-Layer GPS Navigator
US$1.50-1.51 / Piece
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What is Advanced HDI 8-Layer GPS Navigator

About this Item
Details
Company Profile

Price

Purchase Qty. Reference FOB Price

10-999 Pieces US$1.51

1,000+ Pieces US$1.50

Sepcifications

  • Type Rigid Circuit Board
  • Dielectric FR-4
  • Material Fiberglass Epoxy
  • Application Consumer Electronics
  • Flame Retardant Properties V0
  • Mechanical Rigid Rigid
  • Processing Technology Electrolytic Foil
  • Base Material Copper
  • Insulation Materials Epoxy Resin
  • Brand Shengyi, Kb, Nanya, Ilm
  • Transport Package Vacuum Packaging
  • Specification 110*60mm
  • Trademark XMANDA
  • Origin Made in China
  • Criteria Aql II 0.65
  • Hole Sizes 0.25mm
  • Bevel Edge Yes
  • Impedance 50/90/100 Ohm
  • Trace Width(Min.) 0.069mm/0.076mm
  • Surfaec Treatment OSP

Product Description

Specifications: Layers:6 Thickness:1.0mm Material: FR-4 Size:110*60mm Surface treatment: OSP Line width/spacing:0.076/0.127mm Minimum aperture:0.2mm Solder mask color:Black Finished copper thickness: 1/1 OZ Features: 1. The integration of the board design is very high, the ...

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8-Layer GPS Navigator Comparison
Transaction Info
Price US $ 1.50-1.51/ Piece US $ 0.90-20.00/ Piece US $ 0.90-20.00/ Piece US $ 0.15-1.20/ Piece US $ 2.60-12.00/ Piece
Min Order 10 Pieces 1 Pieces 1 Pieces 100 Pieces 100 Pieces
Trade Terms - - - - -
Payment Terms T/T L/C, T/T, Western Union, Paypal, Money Gram L/C, T/T, Western Union, Paypal, Money Gram T/T, Western Union, Paypal T/T, Western Union, Paypal
Quality Control
Management System Certification ISO 9001, ISO 14001, IATF16949 ISO 9001, ISO 14001, OHSAS/ OHSMS 18001, IATF16949, ISO 13485 ISO 9001, ISO 14001, OHSAS/ OHSMS 18001, IATF16949, ISO 13485 ISO 9001, ISO 9000, ISO 14001, ISO 14000, IATF16949, HSE ISO 9001, ISO 9000, ISO 14001, ISO 14000, IATF16949, HSE
Trade Capacity
Export Markets - North America, Europe, Southeast Asia/ Mideast, East Asia(Japan/ South Korea), Domestic North America, Europe, Southeast Asia/ Mideast, East Asia(Japan/ South Korea), Domestic North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
Annual Export Revenue - - - - -
Business Model OEM, ODM - - OEM, ODM OEM, ODM
Average Lead Time - - - Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Product Attributes
Specification
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Shengyi, Kb, Nanya, Ilm;
Criteria: Aql II 0.65;
Hole Sizes: 0.25mm;
Bevel Edge: Yes;
Impedance: 50/90/100 Ohm;
Trace Width(Min.): 0.069mm/0.076mm;
Surfaec Treatment: OSP;
Type: Rigid Circuit Board;
Material: Fr4;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Hl PCB;
Surface Treatment: Immersion Gold;
Mini Hole Diameter: 0.2mm;
Borad Thickness: 1.6mm;
Count Layer: 8;
Inner/Outer Copper Thickness: 1oz/1oz;
Min Trace Width/Spacing: 4mil/4mil;
Special: High Tg Resin Plugg Vias Black Boards;
Type: Rigid Circuit Board;
Material: Fr4;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Hl PCB;
Surface Treatment: Immersion Gold;
Mini Hole Diameter: 0.2mm;
Borad Thickness: 1.6mm;
Count Layer: 8;
Inner/Outer Copper Thickness: 1oz/1oz;
Min Trace Width/Spacing: 4mil/4mil;
Special: High Tg Resin Plugg Vias Black Boards;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Paper Phenolic Copper Foil Substrate;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Fr4 Shengyi Material;
Insulation Materials: Epoxy Resin;
Certificates: RoHS CCC ISO;
Surface Finish: Immersion Gold;
Hole Wall Cu: Min. 20um;
Standard: Ipc II;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Paper Phenolic Copper Foil Substrate;
Application: Communication;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Fr4 Shengyi Material;
Insulation Materials: Epoxy Resin;
Layer Count: 16layer Through Hole Board;
Surface Finish: Immersion Gold;
Hole Wall Cu: Min. 25um;
Standard: Ipc II;
Certificates: RoHS CCC ISO;
Supplier Name

Shenzhen Xinmanda Printed Circuit Board Co., Ltd.

China Supplier - Diamond Member Audited Supplier

Shenzhen Honglian Circuit Co., Ltd.

China Supplier - Gold Member Audited Supplier

Shenzhen Honglian Circuit Co., Ltd.

China Supplier - Gold Member Audited Supplier

Shanghai Gawin Electronic Technology Co., Ltd.

China Supplier - Diamond Member Audited Supplier

Shanghai Gawin Electronic Technology Co., Ltd.

China Supplier - Diamond Member Audited Supplier