Low Carbon Footprint Circuit Board
US$1.80-2.00 / Piece
View
  • Recommend for you
  • What is Flexible Four-Layer Rfpc Board for Camera Applications
  • What is Lead-Free Tin Board with Four Layers
  • What is High-Quality 4-Layer OSP Control Panel

What is High-Grade Six-Layer Circuit Board & FPC for Vehicle Cameras

About this Item
Details
Company Profile

Price

Purchase Qty. Reference FOB Price

10-999 Pieces US$2.00

1,000+ Pieces US$1.80

Sepcifications

  • Structure Multilayer Rigid PCB
  • Dielectric FR-4
  • Material Polyester Glass Fiber Mat Laminate
  • Application Consumer Electronics
  • Flame Retardant Properties V0
  • Processing Technology Electrolytic Foil
  • Production Process Subtractive Process
  • Base Material Copper
  • Insulation Materials Epoxy Resin
  • Brand Shengyi, Kb, Nanya, Ilm
  • Transport Package Vacuum Packaging
  • Specification 70*40mm
  • Trademark XMANDA
  • Origin Made in China
  • Criteria Aql II 0.65
  • Hole Sizes 0.25mm
  • Bevel Edge Yes
  • Impedance 50/90/100 Ohm
  • Trace Width(Min.) 4mil
  • Surfaec Treatment Enig

Product Description

We have professional team, using automation, digitization to greatly improve pcb production efficiency and reduce PCB procurement costs. High-quality raw material, advanced production equipment, intelligent systerm, strict inspection provides users with PCB products of higher quality, more ...

Learn More

Low Carbon Footprint Circuit Board Comparison
Transaction Info
Price US $ 1.80-2.00/ Piece US $ 0.80-1.00/ PCS US $ 1.73-4.21/ Piece US $ 0.50-10.00/ Piece US $ 0.50-9.90/ Piece
Min Order 10 Pieces 1 PCS 100 Pieces 1 Pieces 1 Pieces
Trade Terms - - - - -
Payment Terms T/T, Paypal L/C, T/T, Paypal T/T, Western Union, Paypal L/C, T/T, D/P, Western Union, Paypal, Money Gram L/C, T/T, D/P, Western Union, Paypal, Money Gram
Quality Control
Product Certification - - - RoHS, CCC, ISO, EPA RoHS, CCC, ISO, EPA
Management System Certification ISO 9001, ISO 14001, IATF16949 ISO 9001, ISO 9000, ISO 14001, ISO 14000, ISO 20000, OHSAS/ OHSMS 18001, IATF16949 ISO 9001, ISO 9000, ISO 14001, ISO 14000, IATF16949, HSE ISO 9001, ISO 14001, IATF16949, ISO 13485 ISO 9001, ISO 14001, IATF16949, ISO 13485
Trade Capacity
Export Markets - North America, South America, Eastern Europe, Southeast Asia, Oceania, Western Europe North America, Europe, Southeast Asia/ Mideast North America, South America, Eastern Europe, Southeast Asia, Mid East, Western Europe North America, South America, Eastern Europe, Southeast Asia, Mid East, Western Europe
Annual Export Revenue - - - - -
Business Model OEM, ODM OEM OEM, ODM OEM, ODM, Own Brand OEM, ODM, Own Brand
Average Lead Time - Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Product Attributes
Specification
Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Material: Polyester Glass Fiber Mat Laminate;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Subtractive Process;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Shengyi, Kb, Nanya, Ilm;
Criteria: Aql II 0.65;
Hole Sizes: 0.25mm;
Bevel Edge: Yes;
Impedance: 50/90/100 Ohm;
Trace Width(Min.): 4mil;
Surfaec Treatment: Enig;
Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Material: Polyester Glass Fiber Mat Laminate;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Processing Technology: Enig;
Production Process: Subtractive Process;
Base Material: Copper;
Insulation Materials: Organic Resin;
Board Layer: 10L;
Surface Finihsing: Immersion Gold;
Lead Time: 6-8 Working Days;
Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Material: Epoxy Paper Laminate;
Application: Communication;
Flame Retardant Properties: V0;
Processing Technology: HASL;
Production Process: Additive Process;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: 1;
Layer Count: 10L;
Min. Hole to Line: 7mil;
Min. Pad: 4mil;
Structure: Single-Sided Rigid PCB;
Dielectric: FR-4;
Material: Fr4;
Application: LED;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Immersion Gold;
Base Material: Aluminum;
Insulation Materials: Organic Resin;
Brand: R-5670;
Board Thickness: 1.7mm;
Copper Thickness: 2oz;
Test: Flying Probe & Fixture;
Solder Mask Type: Green;
Min.Line Width/Space: 0.2mm;
Min. Finished Hole Size: 3mm;
Customized: Customized;
Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Material: Fr4;
Application: Computer;
Flame Retardant Properties: V0;
Processing Technology: Delay Pressure Foil;
Production Process: Enig;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: It180A;
Board Thickness: 2.1mm;
Copper Thickness: 2oz;
Test: Flying Probe & Fixture;
Solder Mask Type: Green;
Min.Line Width/Space: 0.2mm;
Min. Finished Hole Size: 4mm;
Customized: Customized;
Supplier Name

Shenzhen Xinmanda Printed Circuit Board Co., Ltd.

China Supplier - Diamond Member Audited Supplier

Ucreate PCB Co., Ltd.

China Supplier - Diamond Member Audited Supplier

Shanghai Gawin Electronic Technology Co., Ltd.

China Supplier - Diamond Member Audited Supplier

Usun Electronics Limited.,

China Supplier - Gold Member Audited Supplier

Usun Electronics Limited.,

China Supplier - Gold Member Audited Supplier