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US$3.91-3.92 / Piece
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What is Ten Multilayer PCB Mother Board for Mobile Phones with Immersion Gold

About this Item
Details
Company Profile

Price

Purchase Qty. Reference FOB Price

10-999 Pieces US$3.92

1,000+ Pieces US$3.91

Sepcifications

  • Type Rigid Circuit Board
  • Dielectric FR-4
  • Material Fiberglass Epoxy
  • Flame Retardant Properties V0
  • Mechanical Rigid Rigid
  • Processing Technology Electrolytic Foil
  • Base Material Copper
  • Insulation Materials Epoxy Resin
  • Brand Shengyi, Kb, Nanya, Ilm
  • Transport Package Vacuum Packaging
  • Specification 100*90mm
  • Trademark XMANDA
  • Origin Made in China
  • Criteria Aql II 0.65
  • Hole Sizes 0.25mm
  • Bevel Edge Yes
  • Impedance 50/90/100 Ohm
  • Trace Width(Min.) 4mil
  • Surfaec Treatment Immersion Gold

Product Description

Specifications: Layers: 6 Thickness:1.6mm Material: FR4 KB6165 Size: 100*90mm Surface treatment:HASL Line width/spacing: 4/4mil Minimum aperture: 0.25mm Solder mask color: Blue Finished copper thickness: inner layer 1 OZ, outer layer 1 OZ Features: 1. The integration of the ...

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Transaction Info
Price US $ 3.91-3.92/ Piece US $ 0.90-20.00/ Piece US $ 0.10-20.00/ Piece US $ 0.10-20.00/ Piece US $ 0.10-20.00/ Piece
Min Order 10 Pieces 1 Pieces 1 Pieces 1 Pieces 1 Pieces
Trade Terms - - - - -
Payment Terms T/T T/T, Western Union, Paypal, Money Gram T/T, Western Union, Paypal, Money Gram T/T, Western Union, Paypal, Money Gram L/C, T/T, Western Union, Paypal, Money Gram
Quality Control
Management System Certification ISO 9001, ISO 14001, IATF16949 ISO 9001, ISO 14001, OHSAS/ OHSMS 18001, IATF16949, ISO 13485 ISO 9001, ISO 14001, OHSAS/ OHSMS 18001, IATF16949, ISO 13485 ISO 9001, ISO 14001, OHSAS/ OHSMS 18001, IATF16949, ISO 13485 ISO 9001, ISO 14001, OHSAS/ OHSMS 18001, IATF16949, ISO 13485
Trade Capacity
Export Markets - North America, Europe, Southeast Asia/ Mideast, East Asia(Japan/ South Korea), Domestic North America, Europe, Southeast Asia/ Mideast, East Asia(Japan/ South Korea), Domestic North America, Europe, Southeast Asia/ Mideast, East Asia(Japan/ South Korea), Domestic North America, Europe, Southeast Asia/ Mideast, East Asia(Japan/ South Korea), Domestic
Annual Export Revenue - - - - -
Business Model OEM, ODM - - - -
Average Lead Time - - - - -
Product Attributes
Specification
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Shengyi, Kb, Nanya, Ilm;
Criteria: Aql II 0.65;
Hole Sizes: 0.25mm;
Bevel Edge: Yes;
Impedance: 50/90/100 Ohm;
Trace Width(Min.): 4mil;
Surfaec Treatment: Immersion Gold;
Type: Rigid Circuit Board;
Material: Fr4-S1141;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Hl-PCB;
Surface Treatment: Immersion Gold;
Mini Hole Diameter: 0.2mm;
Borad Thickness: 1.6mm;
Count Layer: 6;
Inner/Outer Copper Thickness: 1oz/1oz;
Min Trace Width/Spacing: 4mil/4mil;
Certificated: ISO9001, ISO14001, CQC, IATF16949, UL, RoHS etc.;
Special: Impedance Control, Halogen Free Board, Resin Plug;
Type: Rigid Circuit Board;
Material: Fr4-S1141;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Hl-PCB;
Surface Treatment: Lead Free HASL;
Mini Hole Diameter: 0.3mm;
Borad Thickness: 1.6mm;
Count Layer: 4;
Inner/Outer Copper Thickness: 3oz/3oz;
Min Trace Width/Spacing: 10mil/10mil;
Special: High Reliability, 3oz Thick Cu Power Supply;
Certificated: ISO9001, ISO14001, CQC, IATF16949, UL, RoHS etc.;
Type: Rigid Circuit Board;
Material: Fr4-Kb;
Application: Automative Light;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Hl-PCB;
Surface Treatment: Immersion Au;
Mini Hole Diameter: 0.3mm;
Borad Thickness: 1.2mm;
Count Layer: 2;
Inner/Outer Copper Thickness: 1oz;
Min Trace Width/Spacing: 8mil/8mil;
Special: Printing Mark Clearly, Strict Tolerance;
Certificated: ISO9001, ISO14001, CQC, IATF16949, UL, RoHS etc.;
Type: Combining Rigid Circuit Board;
Material: Cu Substrate;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Hl-PCB;
Surface Treatment: OSP;
Mini Hole Diameter: 0.5mm;
Borad Thickness: 1.6mm;
Count Layer: 2;
Inner/Outer Copper Thickness: 1oz/1oz;
Min Trace Width/Spacing: 10mil/10mil;
Special: Cu Substrate, Good Heat Dissipation for Power;
Certificated: ISO9001, ISO14001, IATF16949, UL, RoHS, CQC etc.;
Supplier Name

Shenzhen Xinmanda Printed Circuit Board Co., Ltd.

China Supplier - Diamond Member Audited Supplier

Shenzhen Honglian Circuit Co., Ltd.

China Supplier - Gold Member Audited Supplier

Shenzhen Honglian Circuit Co., Ltd.

China Supplier - Gold Member Audited Supplier

Shenzhen Honglian Circuit Co., Ltd.

China Supplier - Gold Member Audited Supplier

Shenzhen Honglian Circuit Co., Ltd.

China Supplier - Gold Member Audited Supplier