High-Density Interconnect Technology
US$3.04-3.05 / Piece
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Advanced 12-Layer HDI PCB for Arbitrary Layer Interconnect Pico Projector Video

About this Item
Details
Company Profile

Price

Purchase Qty. Reference FOB Price

10-999 Pieces US$3.05

1,000+ Pieces US$3.04

Sepcifications

  • Type Rigid Circuit Board
  • Dielectric FR-4
  • Material Fiberglass Epoxy
  • Application Consumer Electronics
  • Flame Retardant Properties V0
  • Mechanical Rigid Rigid
  • Processing Technology Electrolytic Foil
  • Base Material Copper
  • Insulation Materials Epoxy Resin
  • Brand Shengyi, Kb, Nanya, Ilm
  • Transport Package Vacuum Packaging
  • Specification 60*40mm
  • Trademark XMANDA
  • Origin Made in China
  • Criteria Aql II 0.65
  • Hole Sizes 0.2mm
  • Bevel Edge Yes
  • Impedance 50/90/100 Ohm
  • Trace Width(Min.) 0.069mm/0.076mm
  • Surfaec Treatment Enig

Product Description

Specifications: Layers:12 Thickness:0.8mm Material: FR-4 Size:60*40mm Surface treatment: ENIG+GOLD FINGER Line width/spacing:0.069mm/0.076mm Minimum aperture:0.2mm Solder mask color:Green Finished copper thickness: 1/1 OZ Features: 1. The integration of the board design is ...

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High-Density Interconnect Technology Comparison
Transaction Info
Price US $ 3.04-3.05/ Piece US $ 1.00-50.00/ Piece US $ 0.10-1.00/ Piece US $ 0.10-10.00/ Piece US $ 0.10-20.00/ Piece
Min Order 10 Pieces 1 Pieces 1 Pieces 1 Pieces 1 Pieces
Trade Terms - - - - -
Payment Terms T/T T/T, Paypal L/C, T/T, Western Union T/T L/C, T/T, Western Union, Paypal, Money Gram
Quality Control
Management System Certification ISO 9001, ISO 14001, IATF16949 ISO 9001, ISO 9000, BSCI ISO 9001 ISO 9001, ISO 9000, BSCI ISO 9001, ISO 14001, OHSAS/ OHSMS 18001, IATF16949, ISO 13485
Trade Capacity
Export Markets - North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe South America, Eastern Europe, Southeast Asia, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, Europe, Southeast Asia/ Mideast, East Asia(Japan/ South Korea), Domestic
Annual Export Revenue - - - - -
Business Model OEM, ODM OEM, ODM OEM, ODM OEM, ODM -
Average Lead Time - Off-season: within 15 Day(s)
Peak-season: 1-3 Month(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: 1-3 Month(s)
-
Product Attributes
Specification
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Shengyi, Kb, Nanya, Ilm;
Criteria: Aql II 0.65;
Hole Sizes: 0.2mm;
Bevel Edge: Yes;
Impedance: 50/90/100 Ohm;
Trace Width(Min.): 0.069mm/0.076mm;
Surfaec Treatment: Enig;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: OEM;
PCB Max Size: 400*310mm;
PCB Min Size: 20*10mm;
PCB Thickness: 0.4~1.5mm;
Impedance: 50~120 Ohm;
Hole Min Diameter: 0.1mm;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Immersion Gold;
Base Material: Fr4;
Insulation Materials: Epoxy Resin;
Copper Thickness: 3oz -105oz;
Surface Finish: Gold Finger;
Special Teck: Metal Edging;
Special 1: Blind Hole;
Special 2: Buried Vias;
Special 3: Flex-Rigid PCB;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Customize;
Brand: OEM;
Type: Rigid Circuit Board;
Material: Fr4;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Hl-PCB;
Surface Treatment: OSP;
Mini Hole Diameter: 0.3mm;
Borad Thickness: 1.6mm;
Count Layer: 4;
Inner/Outer Copper Thickness: 1oz/1oz;
Min Trace Width/Spacing: 0.2mm / 0.2mm;
Special: High Reliability;
Supplier Name

Shenzhen Xinmanda Printed Circuit Board Co., Ltd.

China Supplier - Diamond Member Audited Supplier

Kenling Electronics Co., Ltd.

China Supplier - Diamond Member Audited Supplier

Shenzhen Hemeixin Electronic Co., Limited

China Supplier - Diamond Member Audited Supplier

Kenling Electronics Co., Ltd.

China Supplier - Diamond Member Audited Supplier

Shenzhen Honglian Circuit Co., Ltd.

China Supplier - Gold Member Audited Supplier