What is Advanced 4-Layer PC Power Printed Circuit Board

Name: Advanced 4-Layer PC Power Printed Circuit Board
Uploaded: 2024-05-27T18:16:42+08:00
Description: Specifications: Layers: 4 Thickness:1.6mm Material: FR4 KB6160 Size:115*115mm Surface treatment: ENIG Line width/spacing: 5/5mil Minimum aperture: 0.25mm Solder mask color: Black Finished copper thick

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Price

Purchase Qty. Reference FOB Price

10-999 Pieces US$1.63

1,000+ Pieces US$1.58

Sepcifications

Structure Multilayer Rigid PCB
Dielectric FR-4
Material Polyester Glass Fiber Mat Laminate
Application Industrial Control
Flame Retardant Properties V0
Processing Technology Electrolytic Foil
Production Process Subtractive Process
Base Material Copper
Insulation Materials Epoxy Resin
Brand Shengyi, Kb, Nanya, Ilm
Transport Package Vacuum Packaging
Specification 115*115mm
Trademark XMANDA
Origin Made in China
Criteria Aql II 0.65
Hole Sizes 0.25mm
Bevel Edge Yes
Impedance 50/90/100 Ohm
Trace Width(Min.) 4mil
Surfaec Treatment Enig

Product Description

Specifications: Layers: 4 Thickness:1.6mm Material: FR4 KB6160 Size:115*115mm Surface treatment: ENIG Line width/spacing: 5/5mil Minimum aperture: 0.25mm Solder mask color: Black Finished copper thickness: 1/1 OZ Features: 1. The integration of the board design is very high, ...

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Shenzhen Xinmanda Printed Circuit Board Co., Ltd.

Diamond Member Since 2023

Audited Supplier

Business Range Consumer Electronics, Electrical & Electronics, Instruments & Meters
Main Products PCB, Double-Sided PCB, Multilayer PCB, Printed Circuit Board, Aluminum PCB, PCB Assembly, PCBA, Flexible PCB, Electronic Component, PCB Circuit
OEM/ODM Availability Yes

Tablet Computer Circuit Board Comparison

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Transaction Info
	Quick View Advanced 4-Layer PC Power Printed Circuit Board Contact Now	Quick View Security Network All-in-One Motherboard 6layer Immersion Gold Technology Contact Now	Quick View Em-825 Material Security Network All-in-One Multifunction Equipment Mainboard Contact Now	Quick View 3oz Heavy Copper 6layer Immersion Gold PCB for Power UPS Contact Now	Quick View Power Source Motherboard 8layer Enig 3oz Cu Material It158 Contact Now
Price	US $ 1.58-1.63/ Piece	US $ 0.769-3.38/ Piece	US $ 0.77-3.39/ Piece	US $ 1.83-4.66/ Piece	US $ 2.13-4.87/ Piece
Min Order	10 Pieces	100 Pieces	100 Pieces	100 Pieces	100 Pieces
Trade Terms	-	-	-	-	-
Payment Terms	T/T	T/T, Western Union, Paypal	T/T, Western Union, Paypal	T/T, Western Union, Paypal	T/T, Western Union, Paypal
Quality Control
Management System Certification	ISO 9001, ISO 14001, IATF16949	ISO 9001, ISO 9000, ISO 14001, ISO 14000, IATF16949, HSE	ISO 9001, ISO 9000, ISO 14001, ISO 14000, IATF16949, HSE	ISO 9001, ISO 9000, ISO 14001, ISO 14000, IATF16949, HSE	ISO 9001, ISO 9000, ISO 14001, ISO 14000, IATF16949, HSE
Trade Capacity
Export Markets	-	North America, Europe, Southeast Asia/ Mideast	North America, Europe, Southeast Asia/ Mideast	North America, Europe, Southeast Asia/ Mideast	North America, Europe, Southeast Asia/ Mideast
Annual Export Revenue	-	-	-	-	-
Business Model	OEM, ODM	OEM, ODM	OEM, ODM	OEM, ODM	OEM, ODM
Average Lead Time	-	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)
Product Attributes
Specification	Structure: Multilayer Rigid PCB; Dielectric: FR-4; Material: Polyester Glass Fiber Mat Laminate; Application: Industrial Control; Flame Retardant Properties: V0; Processing Technology: Electrolytic Foil; Production Process: Subtractive Process; Base Material: Copper; Insulation Materials: Epoxy Resin; Brand: Shengyi, Kb, Nanya, Ilm; Criteria: Aql II 0.65; Hole Sizes: 0.25mm; Bevel Edge: Yes; Impedance: 50/90/100 Ohm; Trace Width(Min.): 4mil; Surfaec Treatment: Enig;	Structure: Multilayer Rigid PCB; Dielectric: FR-4; Material: Epoxy Paper Laminate; Application: Security PCB; Flame Retardant Properties: V0; Processing Technology: Electrolytic Foil; Production Process: Additive Process; Base Material: Copper; Insulation Materials: Epoxy Resin; Layer Count: 6L up to 24L; Board Thickness: 1.6mm up to 8mm; Min Hole Size: 0.25mm; Min. Trace/Space: 3mil; Finished Copper: 1/1 Oz;	Structure: Multilayer Rigid PCB; Dielectric: FR-4; Material: Epoxy Paper Laminate; Application: Security PCB; Flame Retardant Properties: V0; Processing Technology: Electrolytic Foil; Production Process: Additive Process; Base Material: Copper; Insulation Materials: Epoxy Resin; Layer Count: 6L up to 24L; Board Thickness: 1.6mm up to 8mm; Min Hole Size: 0.25mm; Min. Trace/Space: 3mil; Finished Copper: 1/1 Oz;	Structure: Multilayer Rigid PCB; Dielectric: FR-4; Material: Epoxy Paper Laminate; Application: Security PCB; Flame Retardant Properties: V0; Processing Technology: Electrolytic Foil; Production Process: Additive Process; Base Material: Copper; Insulation Materials: Epoxy Resin; Brand: 1; Layer Count: 6L up to 24L; Board Thickness: 2.4mm up to 8mm; Min Hole Size: 0.6mm; Min. Hole Wall Cu: 30um; Finished Copper: 3/3 Oz;	Structure: Multilayer Rigid PCB; Dielectric: FR-4; Material: Epoxy Paper Laminate; Application: Security PCB; Flame Retardant Properties: V0; Processing Technology: Electrolytic Foil; Production Process: Additive Process; Base Material: Copper; Insulation Materials: Epoxy Resin; Layer Count: 8L up to 24L; Board Thickness: 2.4mm up to 8mm; Min Hole Size: 0.6mm; Min. Hole Wall Cu: 30um; Finished Copper: 3/3 Oz;
Supplier Name	Shenzhen Xinmanda Printed Circuit Board Co., Ltd.	Shanghai Gawin Electronic Technology Co., Ltd.	Shanghai Gawin Electronic Technology Co., Ltd.	Shanghai Gawin Electronic Technology Co., Ltd.	Shanghai Gawin Electronic Technology Co., Ltd.
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